JPS61131841U - - Google Patents
Info
- Publication number
- JPS61131841U JPS61131841U JP1985015709U JP1570985U JPS61131841U JP S61131841 U JPS61131841 U JP S61131841U JP 1985015709 U JP1985015709 U JP 1985015709U JP 1570985 U JP1570985 U JP 1570985U JP S61131841 U JPS61131841 U JP S61131841U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- semiconductor element
- heat sink
- cooling medium
- hollow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 12
- 239000002826 coolant Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985015709U JPS61131841U (enrdf_load_stackoverflow) | 1985-02-06 | 1985-02-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985015709U JPS61131841U (enrdf_load_stackoverflow) | 1985-02-06 | 1985-02-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61131841U true JPS61131841U (enrdf_load_stackoverflow) | 1986-08-18 |
Family
ID=30501800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985015709U Pending JPS61131841U (enrdf_load_stackoverflow) | 1985-02-06 | 1985-02-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61131841U (enrdf_load_stackoverflow) |
-
1985
- 1985-02-06 JP JP1985015709U patent/JPS61131841U/ja active Pending