JPS61131833U - - Google Patents
Info
- Publication number
- JPS61131833U JPS61131833U JP1985014622U JP1462285U JPS61131833U JP S61131833 U JPS61131833 U JP S61131833U JP 1985014622 U JP1985014622 U JP 1985014622U JP 1462285 U JP1462285 U JP 1462285U JP S61131833 U JPS61131833 U JP S61131833U
- Authority
- JP
- Japan
- Prior art keywords
- desired outline
- film
- forming
- wetted
- soft solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Die Bonding (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985014622U JPS61131833U (enExample) | 1985-02-06 | 1985-02-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985014622U JPS61131833U (enExample) | 1985-02-06 | 1985-02-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61131833U true JPS61131833U (enExample) | 1986-08-18 |
Family
ID=30499714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985014622U Pending JPS61131833U (enExample) | 1985-02-06 | 1985-02-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61131833U (enExample) |
-
1985
- 1985-02-06 JP JP1985014622U patent/JPS61131833U/ja active Pending