JPS61131832U - - Google Patents
Info
- Publication number
- JPS61131832U JPS61131832U JP1425385U JP1425385U JPS61131832U JP S61131832 U JPS61131832 U JP S61131832U JP 1425385 U JP1425385 U JP 1425385U JP 1425385 U JP1425385 U JP 1425385U JP S61131832 U JPS61131832 U JP S61131832U
- Authority
- JP
- Japan
- Prior art keywords
- view
- adhesive
- showing
- protrusions
- tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1425385U JPS61131832U (US06633600-20031014-M00021.png) | 1985-02-05 | 1985-02-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1425385U JPS61131832U (US06633600-20031014-M00021.png) | 1985-02-05 | 1985-02-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61131832U true JPS61131832U (US06633600-20031014-M00021.png) | 1986-08-18 |
Family
ID=30499002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1425385U Pending JPS61131832U (US06633600-20031014-M00021.png) | 1985-02-05 | 1985-02-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61131832U (US06633600-20031014-M00021.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101147613B1 (ko) * | 2009-08-13 | 2012-05-23 | 송병국 | 자동 도색 시스템 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5643160B2 (US06633600-20031014-M00021.png) * | 1976-06-09 | 1981-10-09 |
-
1985
- 1985-02-05 JP JP1425385U patent/JPS61131832U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5643160B2 (US06633600-20031014-M00021.png) * | 1976-06-09 | 1981-10-09 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101147613B1 (ko) * | 2009-08-13 | 2012-05-23 | 송병국 | 자동 도색 시스템 |
