JPS61129357U - - Google Patents
Info
- Publication number
- JPS61129357U JPS61129357U JP1985012626U JP1262685U JPS61129357U JP S61129357 U JPS61129357 U JP S61129357U JP 1985012626 U JP1985012626 U JP 1985012626U JP 1262685 U JP1262685 U JP 1262685U JP S61129357 U JPS61129357 U JP S61129357U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- light
- holder
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985012626U JPH0414942Y2 (https=) | 1985-01-31 | 1985-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985012626U JPH0414942Y2 (https=) | 1985-01-31 | 1985-01-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61129357U true JPS61129357U (https=) | 1986-08-13 |
| JPH0414942Y2 JPH0414942Y2 (https=) | 1992-04-03 |
Family
ID=30495868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985012626U Expired JPH0414942Y2 (https=) | 1985-01-31 | 1985-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0414942Y2 (https=) |
-
1985
- 1985-01-31 JP JP1985012626U patent/JPH0414942Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0414942Y2 (https=) | 1992-04-03 |