JPS61129349U - - Google Patents

Info

Publication number
JPS61129349U
JPS61129349U JP1214985U JP1214985U JPS61129349U JP S61129349 U JPS61129349 U JP S61129349U JP 1214985 U JP1214985 U JP 1214985U JP 1214985 U JP1214985 U JP 1214985U JP S61129349 U JPS61129349 U JP S61129349U
Authority
JP
Japan
Prior art keywords
fins
large number
shaped member
ventilation resistance
low ventilation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1214985U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1214985U priority Critical patent/JPS61129349U/ja
Publication of JPS61129349U publication Critical patent/JPS61129349U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の一実施例の側面図、第２〜第
５図は第１図の実施例で使用する高性能フインで
ルーバーフインの正面図、第６図、第７図はそれ
ぞれフイン間隔、フインの個数を上流から下流に
向けて変化させた実施例の上面図である。 １…基板、２…冷却フイン、４…半導体モジユ
ール。 Fig. 1 is a side view of an embodiment of the present invention, Figs. 2 to 5 are front views of a high-performance fin used in the embodiment of Fig. 1, and Figs. 6 and 7 are a front view of the louver fin. FIG. 4 is a top view of an embodiment in which the spacing and the number of fins are changed from upstream to downstream. 1... Board, 2... Cooling fin, 4... Semiconductor module.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 多数の発熱体を搭載する板状の部材と、その部
材を多数枚収納する箱型の部材を流路壁として形
成される冷却流路において、上流には通風抵抗の
少ないフインを取付け、下流部には熱伝達率の高
いフインを設けたことを特徴とする電子装置の冷
却構造。 In the cooling channel, which is formed of a plate-shaped member that carries a large number of heating elements and a box-shaped member that houses a large number of these members as the channel wall, fins with low ventilation resistance are installed in the upstream part, and fins with low ventilation resistance are installed in the downstream part. A cooling structure for electronic devices characterized by having fins with high heat transfer coefficient.
JP1214985U 1985-02-01 1985-02-01 Pending JPS61129349U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1214985U JPS61129349U (en) 1985-02-01 1985-02-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1214985U JPS61129349U (en) 1985-02-01 1985-02-01

Publications (1)

Publication Number Publication Date
JPS61129349U true JPS61129349U (en) 1986-08-13

Family

ID=30494936

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1214985U Pending JPS61129349U (en) 1985-02-01 1985-02-01

Country Status (1)

Country Link
JP (1) JPS61129349U (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999048346A1 (en) * 1998-03-18 1999-09-23 Hitachi, Ltd. Electronic equipment
WO2002049106A1 (en) * 2000-12-11 2002-06-20 Fujitsu Limited Electronic device unit
JP2007102803A (en) * 2006-11-08 2007-04-19 Fujitsu Ltd Electronic apparatus unit
JP2008187136A (en) * 2007-01-31 2008-08-14 Densei Lambda Kk Heat dissipating structure
JP2010040188A (en) * 2008-07-31 2010-02-18 Mitsubishi Electric Corp Heating cooker
JP2013042138A (en) * 2011-08-16 2013-02-28 Ls Industrial Systems Co Ltd Heat sinking plate
JP2016178208A (en) * 2015-03-20 2016-10-06 日本電気株式会社 Heat sink, heat dissipation structure, cooling structure and device
JP2019032141A (en) * 2017-08-09 2019-02-28 ダイキン工業株式会社 Outdoor unit of freezer

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999048346A1 (en) * 1998-03-18 1999-09-23 Hitachi, Ltd. Electronic equipment
WO2002049106A1 (en) * 2000-12-11 2002-06-20 Fujitsu Limited Electronic device unit
JP2007102803A (en) * 2006-11-08 2007-04-19 Fujitsu Ltd Electronic apparatus unit
JP4612609B2 (en) * 2006-11-08 2011-01-12 富士通株式会社 Electronic equipment unit
JP2008187136A (en) * 2007-01-31 2008-08-14 Densei Lambda Kk Heat dissipating structure
JP2010040188A (en) * 2008-07-31 2010-02-18 Mitsubishi Electric Corp Heating cooker
JP2013042138A (en) * 2011-08-16 2013-02-28 Ls Industrial Systems Co Ltd Heat sinking plate
JP2016178208A (en) * 2015-03-20 2016-10-06 日本電気株式会社 Heat sink, heat dissipation structure, cooling structure and device
JP2019032141A (en) * 2017-08-09 2019-02-28 ダイキン工業株式会社 Outdoor unit of freezer
US11493213B2 (en) 2017-08-09 2022-11-08 Daikin Industries, Ltd. Outdoor unit for refrigeration apparatus

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