JPS61127644U - - Google Patents

Info

Publication number

JPS61127644U

JPS61127644U JP1156085U JP1156085U JPS61127644U JP S61127644 U JPS61127644 U JP S61127644U JP 1156085 U JP1156085 U JP 1156085U JP 1156085 U JP1156085 U JP 1156085U JP S61127644 U JPS61127644 U JP S61127644U

Authority

JP

Japan

Prior art keywords

resin

sealed

semiconductor chip

semiconductor device

epoxy resin

Prior art date

1985-01-30

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
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• 239000004065 semiconductor Substances 0.000 claims description 5
• 229920005989 resin Polymers 0.000 claims description 2
• 239000011347 resin Substances 0.000 claims description 2
• 239000003822 epoxy resin Substances 0.000 claims 2
• 229920000647 polyepoxide Polymers 0.000 claims 2
• 239000000853 adhesive Substances 0.000 claims 1
• 230000001070 adhesive effect Effects 0.000 claims 1
• 238000005266 casting Methods 0.000 claims 1
• 238000000465 moulding Methods 0.000 claims 1
• 238000007789 sealing Methods 0.000 claims 1
• 238000010586 diagram Methods 0.000 description 2
• 239000011248 coating agent Substances 0.000 description 1
• 238000000576 coating method Methods 0.000 description 1
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
• 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
• 239000000463 material Substances 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1