JPS61127642U - - Google Patents
Info
- Publication number
- JPS61127642U JPS61127642U JP1140185U JP1140185U JPS61127642U JP S61127642 U JPS61127642 U JP S61127642U JP 1140185 U JP1140185 U JP 1140185U JP 1140185 U JP1140185 U JP 1140185U JP S61127642 U JPS61127642 U JP S61127642U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- resin
- encapsulated
- molded body
- resin molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1140185U JPS61127642U (enExample) | 1985-01-30 | 1985-01-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1140185U JPS61127642U (enExample) | 1985-01-30 | 1985-01-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61127642U true JPS61127642U (enExample) | 1986-08-11 |
Family
ID=30493489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1140185U Pending JPS61127642U (enExample) | 1985-01-30 | 1985-01-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61127642U (enExample) |
-
1985
- 1985-01-30 JP JP1140185U patent/JPS61127642U/ja active Pending