JPS61123566U - - Google Patents
Info
- Publication number
- JPS61123566U JPS61123566U JP584085U JP584085U JPS61123566U JP S61123566 U JPS61123566 U JP S61123566U JP 584085 U JP584085 U JP 584085U JP 584085 U JP584085 U JP 584085U JP S61123566 U JPS61123566 U JP S61123566U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- printed circuit
- circuit board
- hole
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 239000011889 copper foil Substances 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP584085U JPS61123566U (en:Method) | 1985-01-19 | 1985-01-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP584085U JPS61123566U (en:Method) | 1985-01-19 | 1985-01-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61123566U true JPS61123566U (en:Method) | 1986-08-04 |
Family
ID=30482724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP584085U Pending JPS61123566U (en:Method) | 1985-01-19 | 1985-01-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61123566U (en:Method) |
-
1985
- 1985-01-19 JP JP584085U patent/JPS61123566U/ja active Pending
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