JPS61123536U - - Google Patents

Info

Publication number

JPS61123536U

JPS61123536U JP670285U JP670285U JPS61123536U JP S61123536 U JPS61123536 U JP S61123536U JP 670285 U JP670285 U JP 670285U JP 670285 U JP670285 U JP 670285U JP S61123536 U JPS61123536 U JP S61123536U

Authority

JP

Japan

Prior art keywords

resin

lead frame

semiconductor manufacturing

temperature

pressurizing

Prior art date

1985-01-23

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 4
• 239000011347 resin Substances 0.000 claims description 3
• 229920005989 resin Polymers 0.000 claims description 3
• 238000004519 manufacturing process Methods 0.000 claims 2
• 230000009477 glass transition Effects 0.000 claims 1
• 238000010438 heat treatment Methods 0.000 description 4
• 238000007789 sealing Methods 0.000 description 1