JPS6112233U - ワイヤボンダにおけるワイヤ始端末の固定構造 - Google Patents

ワイヤボンダにおけるワイヤ始端末の固定構造

Info

Publication number
JPS6112233U
JPS6112233U JP9495484U JP9495484U JPS6112233U JP S6112233 U JPS6112233 U JP S6112233U JP 9495484 U JP9495484 U JP 9495484U JP 9495484 U JP9495484 U JP 9495484U JP S6112233 U JPS6112233 U JP S6112233U
Authority
JP
Japan
Prior art keywords
wire
spool
clamp member
fixing structure
start end
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9495484U
Other languages
English (en)
Japanese (ja)
Other versions
JPH027467Y2 (enrdf_load_stackoverflow
Inventor
均 佐久間
昌司 川本
博 丑木
Original Assignee
株式会社 新川
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社 新川 filed Critical 株式会社 新川
Priority to JP9495484U priority Critical patent/JPS6112233U/ja
Publication of JPS6112233U publication Critical patent/JPS6112233U/ja
Application granted granted Critical
Publication of JPH027467Y2 publication Critical patent/JPH027467Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Wire Bonding (AREA)
JP9495484U 1984-06-25 1984-06-25 ワイヤボンダにおけるワイヤ始端末の固定構造 Granted JPS6112233U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9495484U JPS6112233U (ja) 1984-06-25 1984-06-25 ワイヤボンダにおけるワイヤ始端末の固定構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9495484U JPS6112233U (ja) 1984-06-25 1984-06-25 ワイヤボンダにおけるワイヤ始端末の固定構造

Publications (2)

Publication Number Publication Date
JPS6112233U true JPS6112233U (ja) 1986-01-24
JPH027467Y2 JPH027467Y2 (enrdf_load_stackoverflow) 1990-02-22

Family

ID=30653840

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9495484U Granted JPS6112233U (ja) 1984-06-25 1984-06-25 ワイヤボンダにおけるワイヤ始端末の固定構造

Country Status (1)

Country Link
JP (1) JPS6112233U (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH027467Y2 (enrdf_load_stackoverflow) 1990-02-22

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