JPS61121774U - - Google Patents

Info

Publication number
JPS61121774U
JPS61121774U JP387985U JP387985U JPS61121774U JP S61121774 U JPS61121774 U JP S61121774U JP 387985 U JP387985 U JP 387985U JP 387985 U JP387985 U JP 387985U JP S61121774 U JPS61121774 U JP S61121774U
Authority
JP
Japan
Prior art keywords
circuit conductor
insulating layer
metal substrate
wiring board
flexible printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP387985U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP387985U priority Critical patent/JPS61121774U/ja
Publication of JPS61121774U publication Critical patent/JPS61121774U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP387985U 1985-01-16 1985-01-16 Pending JPS61121774U (US06256357-20010703-M00001.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP387985U JPS61121774U (US06256357-20010703-M00001.png) 1985-01-16 1985-01-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP387985U JPS61121774U (US06256357-20010703-M00001.png) 1985-01-16 1985-01-16

Publications (1)

Publication Number Publication Date
JPS61121774U true JPS61121774U (US06256357-20010703-M00001.png) 1986-07-31

Family

ID=30478921

Family Applications (1)

Application Number Title Priority Date Filing Date
JP387985U Pending JPS61121774U (US06256357-20010703-M00001.png) 1985-01-16 1985-01-16

Country Status (1)

Country Link
JP (1) JPS61121774U (US06256357-20010703-M00001.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008010730A (ja) * 2006-06-30 2008-01-17 Hitachi Aic Inc 基板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6184091A (ja) * 1984-09-29 1986-04-28 日本メクトロン株式会社 可撓性金属ベ−ス回路基板の端子部構造

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6184091A (ja) * 1984-09-29 1986-04-28 日本メクトロン株式会社 可撓性金属ベ−ス回路基板の端子部構造

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008010730A (ja) * 2006-06-30 2008-01-17 Hitachi Aic Inc 基板

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