JPS61121453U - - Google Patents

Info

Publication number
JPS61121453U
JPS61121453U JP411685U JP411685U JPS61121453U JP S61121453 U JPS61121453 U JP S61121453U JP 411685 U JP411685 U JP 411685U JP 411685 U JP411685 U JP 411685U JP S61121453 U JPS61121453 U JP S61121453U
Authority
JP
Japan
Prior art keywords
copying machine
marker member
contact glass
sorted
protrude
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP411685U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP411685U priority Critical patent/JPS61121453U/ja
Publication of JPS61121453U publication Critical patent/JPS61121453U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】
第１図は複写機全体の概略構成図、第２図は操
作パネルの平面図、第３図は制御回路のブロツク
図、第４図は本考案の一実施例に係るマーカー部
材の駆動部の簡略平面図、第５図は同、側面図、
第６図は用紙の仕分け状態を示す図、第７図は制
御動作のフローチヤートである。 ５０１…コンタクトガラス、５０４…マーカー
部材。

Claims (1)

    【実用新案登録請求の範囲】
  1. 循環式自動原稿搬送装置を設けた複写機におい
    て、コピーセツト毎に仕分けるべき境目のコピー
    紙の先端にマークを付与するために、コンタクト
    ガラス基準側近傍に、タイミングをとつて露光面
    へ突出可能なマーカー部材を有することを特徴と
    する複写機の制御装置。
JP411685U 1985-01-18 1985-01-18 Pending JPS61121453U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP411685U JPS61121453U (ja) 1985-01-18 1985-01-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP411685U JPS61121453U (ja) 1985-01-18 1985-01-18

Publications (1)

Publication Number Publication Date
JPS61121453U true JPS61121453U (ja) 1986-07-31

Family

ID=30479376

Family Applications (1)

Application Number Title Priority Date Filing Date
JP411685U Pending JPS61121453U (ja) 1985-01-18 1985-01-18

Country Status (1)

Country Link
JP (1) JPS61121453U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8927900B2 (en) 2000-09-13 2015-01-06 Hamamatsu Photonics K.K. Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device
US8969752B2 (en) 2003-03-12 2015-03-03 Hamamatsu Photonics K.K. Laser processing method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8927900B2 (en) 2000-09-13 2015-01-06 Hamamatsu Photonics K.K. Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device
US8933369B2 (en) 2000-09-13 2015-01-13 Hamamatsu Photonics K.K. Method of cutting a substrate and method of manufacturing a semiconductor device
US8946589B2 (en) 2000-09-13 2015-02-03 Hamamatsu Photonics K.K. Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device
US8969761B2 (en) 2000-09-13 2015-03-03 Hamamatsu Photonics K.K. Method of cutting a wafer-like object and semiconductor chip
US8969752B2 (en) 2003-03-12 2015-03-03 Hamamatsu Photonics K.K. Laser processing method

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