JPS61118218A - Molding device - Google Patents
Molding deviceInfo
- Publication number
- JPS61118218A JPS61118218A JP23991584A JP23991584A JPS61118218A JP S61118218 A JPS61118218 A JP S61118218A JP 23991584 A JP23991584 A JP 23991584A JP 23991584 A JP23991584 A JP 23991584A JP S61118218 A JPS61118218 A JP S61118218A
- Authority
- JP
- Japan
- Prior art keywords
- transfer chamber
- making
- plunger
- air
- pot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/34—Moulds having venting means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【技術分野１
本発明は、トランス７Ｔ−成形におけるボイド（空気巻
き込みによる空隙）不良を削減するため材料注入前トフ
ンス７アーチャンパ−（ポット）内の空気を脱気するた
めの技術に関する。
【背景技術】
従来のトランス７７−成形の金型にあっては、ボイド不
良を避けるためにはデートの位置を工夫したり、成形品
にエアベントを設置したりしていたが、金型内のトラン
ス７アーチヤンバー内のエアを脱気する方法は無かった
。従って、従来のような方法では確実にボイド不良を無
くすことはできなかった。TECHNICAL FIELD 1 The present invention relates to a technique for deaerating the air in a transformer 7 arch chamber (pot) before material injection in order to reduce void defects (gaps caused by air entrainment) in transformer 7T molding. [Background Art] In conventional transformer 77-molding molds, in order to avoid void defects, the position of the date has been devised and air vents have been installed in the molded product. There was no way to evacuate the air inside the transformer 7 arch yambar. Therefore, it has not been possible to reliably eliminate void defects using conventional methods.
本発明は以上のような技術的背景に鑑みて為されたもの
であり、その目的とするところは成形品のボイド不良を
確実に無くすことがでさるようにすることにある。
τ発明の開示】
本発明の成形装置は、金型１のトフンス７７−チャンバ
ー２にエア排出用の脱気孔３を設け、トランスファーチ
ャンバー内に挿入されろプランツヤ−４の外周にトラン
スファーチャンバー２内を気密的に密閉させるためのボ
フトンールＭ５を摺動自在に挿通させて成ることを待像
とするものであり、トランス７フーチヤンパー２内に成
形材料１１を投入した後、ポットシール蓋５をトランス
ファーチャンバー２の開口に取り付けて密閉させ、脱気
孔３よりトランスファーチャンバー２内のエアを強制排
気させ、この後プランツヤ−４を突出させて成形品を成
形することにより、成形品のボイド不良を確実に防止す
ることができるのである。
以下本発明の実施例を添付図に基いて詳述する。
１図及び第２図に示すものは、補助ラム式（ブレ２２１
７式）のトランス７７−成形機であり、金型１は上型６
と下型７とから成り、上型６と下型７の間にはキャビテ
ィ８が形成されており、上下型６．７間のキャビテイ８
外周はゴムパツキンのようなシール材９により気密的に
シールされている。上型６にはキャビティ８に連通せる
トランスファーチャンバー２が形成されており、トラン
ス７フーチヤンパー２上部の開口部分は環状の鍔４Ｉｉ
１０により形成されており、鍔部１０にエア排出用の脱
気孔３が設けられている。成形材料１１（タブレフト）
を加圧するプランツヤ−４の外周には環状のポットシー
ル蓋５が摺動自在に挿通されており、ポットシール蓋５
の内周とプランツヤ−４外周とのｎｌはシール材１２に
より′Ａ密的にシールされており、更にポットシール鐙
５のド面にも環状のシール材１３が収着されている。
しかして、第２図のよう１ニドランス７アーチヤンバー
２内に成形材料１１を投入した後、プランツヤ−４を第
１図の高さまで降下させ、ポンドシールｆｉ５のシール
材１３をトランスファーチャンバー２の間口の緑に押圧
し、この後脱気孔３から真空ポンプ（図示せず）などに
よりトランスファーチャンバー２やキャビティ８等の内
部のエアを強制的に高速脱気（３秒以内、１〜３Ｔｏｒ
ｒ）Ｌ、脱気後プランジャー４を下降させて成形材料１
１を加圧し、注入する。これにより、空気の巻き込み、
混入が防止され、特に低圧封止成形のボイド発生防止に
効果がある。しかも、キャビティ８などが真空になりて
いるので材料の流動性が良くなり、充填性も向上し、充
填性の悪い形状の成形品でも良好に成形材料を充填させ
ることができる。また、脱気孔３は鍔部１０に設けであ
るので、大きく設計でさ、短時間にトランスファーチャ
ンバー２内の到達真空度をあげることができるようにな
っている。The present invention has been made in view of the above technical background, and its purpose is to reliably eliminate void defects in molded products. τ Disclosure of the Invention The molding apparatus of the present invention is provided with a deaeration hole 3 for air discharge in the chamber 2 of the mold 1, and the inside of the transfer chamber 2 is provided on the outer periphery of the planter 4 inserted into the transfer chamber. The main feature is that a bofton hole M5 for airtight sealing is slidably inserted therethrough, and after the molding material 11 is put into the transformer 7 foot jumper 2, the pot seal lid 5 is inserted into the transfer chamber 2. The air in the transfer chamber 2 is forcibly exhausted through the degassing hole 3, and the molded product is molded by protruding the planter 4, thereby reliably preventing void defects in the molded product. It is possible. Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The one shown in Figures 1 and 2 is an auxiliary ram type (Bure 221
7 type) transformer 77-molding machine, mold 1 is upper mold 6
and a lower mold 7, and a cavity 8 is formed between the upper mold 6 and the lower mold 7.
The outer periphery is hermetically sealed with a sealing material 9 such as a rubber seal. A transfer chamber 2 that communicates with the cavity 8 is formed in the upper die 6, and the opening at the top of the transformer 7 foot jumper 2 is formed with an annular collar 4Ii.
10, and the collar portion 10 is provided with a deaeration hole 3 for discharging air. Molding material 11 (table left)
An annular pot seal lid 5 is slidably inserted into the outer periphery of the plant jar 4 that pressurizes the pot seal lid 5.
The inner periphery of the pot seal stirrup 5 and the outer periphery of the plant jar 4 are tightly sealed by a sealing material 12, and an annular sealing material 13 is also adsorbed on the do surface of the pot seal stirrup 5. After putting the molding material 11 into the first lance 7 arch yambar 2 as shown in FIG. 2, the planter 4 is lowered to the height shown in FIG. After that, the air inside the transfer chamber 2, cavity 8, etc. is forcibly degassed at high speed (within 3 seconds, 1 to 3 Torr) from the degassing hole 3 using a vacuum pump (not shown) or the like.
r) L, after degassing, lower the plunger 4 and release the molding material 1.
1 is pressurized and injected. This causes air entrainment,
Contamination is prevented, and it is particularly effective in preventing void generation during low-pressure sealing molding. Moreover, since the cavity 8 and the like are in a vacuum, the fluidity of the material is improved, and the filling performance is also improved, so that even a molded product having a shape with poor filling performance can be filled with the molding material. Further, since the deaeration hole 3 is provided in the flange 10, the ultimate vacuum degree in the transfer chamber 2 can be increased in a short time with a large design.
本発明は、叙述のごと（金型のトランスファーチャンバ
ーにエア排出用の脱気孔を設け、トランスファーチャン
バー内に挿入されるプランジャーの外周にトランスファ
ーチャンバー内を気密的に密閉させるためのポットシー
ル蓋を摺動自在に挿通させであるから、トランスファー
チャンバー内に成形材料を投入した後、ポットシール蓋
をトランスファーチャンバーの開口に取り付けで密閉さ
せ、脱気孔よりトランス７アーチヤンパー内のエアを強
制排気させて真空にし、この後プランツヤ−を突出させ
て成形品を成形することにより、成形品のボイド不良を
確実に防止することができるという利点がある。更に、
成形材料の流動性が良くなり、充填性が向上するという
利点がある。As described above, the present invention provides a deaeration hole for air discharge in the transfer chamber of the mold, and a pot seal lid for airtightly sealing the inside of the transfer chamber around the outer periphery of the plunger inserted into the transfer chamber. Since it is slidably inserted, after putting the molding material into the transfer chamber, the pot seal lid is attached to the opening of the transfer chamber to seal it, and the air in the transformer 7 arch jumper is forcibly exhausted from the vent hole. By creating a vacuum and then molding the molded product by protruding the planter, there is an advantage that void defects in the molded product can be reliably prevented.Furthermore,
This has the advantage of improving the fluidity of the molding material and improving its filling properties.
第１図は本発明の一実施例を示す断面図、第２図は同上
のポットシール蓋を開いた時の断面図であり、１は金型
、２はトランス７アーチヤンバー、３は脱気孔、４はプ
ランツヤ−１５はポットシール蓋である。FIG. 1 is a cross-sectional view showing an embodiment of the present invention, and FIG. 2 is a cross-sectional view of the same pot seal with the lid opened. 1 is a mold, 2 is a transformer 7 arch yambar, 3 is a deaeration hole, 4 is a plant jar and 15 is a pot seal lid.
Claims (1)
脱気孔を設け、トランスファーチャンバー内に挿入され
るプランジャーの外周にトランスファーチャンバー内を
気密的に密閉させるためのポットシール蓋を摺動自在に
挿通させて成ることを特徴とする成形装置。(1) A deaeration hole for air discharge is provided in the transfer chamber of the mold, and a pot seal lid is slidably inserted around the outer circumference of the plunger inserted into the transfer chamber to airtightly seal the inside of the transfer chamber. A molding device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23991584A JPS61118218A (en) | 1984-11-14 | 1984-11-14 | Molding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23991584A JPS61118218A (en) | 1984-11-14 | 1984-11-14 | Molding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61118218A true JPS61118218A (en) | 1986-06-05 |
Family
ID=17051738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23991584A Pending JPS61118218A (en) | 1984-11-14 | 1984-11-14 | Molding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61118218A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5082615A (en) * | 1987-12-18 | 1992-01-21 | Mitsubishi Denki Kabushiki Kaisha | Method for packaging semiconductor devices in a resin |
-
1984
- 1984-11-14 JP JP23991584A patent/JPS61118218A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5082615A (en) * | 1987-12-18 | 1992-01-21 | Mitsubishi Denki Kabushiki Kaisha | Method for packaging semiconductor devices in a resin |
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