JPS61118127A - Mixing apparatus of chemical for semiconductor - Google Patents
Mixing apparatus of chemical for semiconductorInfo
- Publication number
- JPS61118127A JPS61118127A JP59239644A JP23964484A JPS61118127A JP S61118127 A JPS61118127 A JP S61118127A JP 59239644 A JP59239644 A JP 59239644A JP 23964484 A JP23964484 A JP 23964484A JP S61118127 A JPS61118127 A JP S61118127A
- Authority
- JP
- Japan
- Prior art keywords
- liq
- pipe
- liquid
- mixing
- mixing container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J4/00—Feed or outlet devices; Feed or outlet control devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
- B01F23/40—Mixing liquids with liquids; Emulsifying
- B01F23/49—Mixing systems, i.e. flow charts or diagrams
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Accessories For Mixers (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野1
本発明は、ウェハー処理プロセスに用いられる半導体用
化学薬品を調合する調合装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application 1] The present invention relates to a compounding apparatus for compounding semiconductor chemicals used in wafer processing processes.
[従来技術1
一般に、半導体デバイスのV造に際しては、デバイスの
ペースとなるシリコン等のウェハーの表面の洗浄、エツ
チングやホトリングラフィ等を行なう必要があり、それ
らの処理には夫々目的に応じた化学薬品が使用される。[Prior art 1] In general, when fabricating semiconductor devices in a V-shaped manner, it is necessary to perform cleaning, etching, photolithography, etc. on the surface of a silicon wafer, which is the base of the device. Chemicals are used.
ところで、このような化学薬品は、通常作業者によって
調合するようにしているが、その場合は処理の直前に調
合することが難しいため、化学薬品の貯蔵中に反応等に
よって成分変化が生じるというIff題がある。By the way, such chemicals are usually mixed by workers, but in that case, it is difficult to mix them immediately before processing, so there is a possibility that the ingredients may change due to reactions etc. during storage of the chemicals. There is a problem.
又;化学薬品の調合に用いられる原液は、主として7ツ
化水素酸、硫酸、塩酸等の強酸や過酸化水素水、アンモ
ニア等の劇薬であるため、取扱いが危険である上、調合
を作業者によって行なうよ)にすると、最大の汚洗源で
ある作!者から化学薬品にダストが混入する確率が甑メ
て高くなる。Also, the stock solutions used for compounding chemicals are mainly strong acids such as hydrochloric acid, sulfuric acid, and hydrochloric acid, as well as powerful chemicals such as hydrogen peroxide and ammonia, which are dangerous to handle and do not allow workers to mix them. If you do it by), it is the biggest source of cleansing! The probability that dust will be mixed into chemicals from other people increases.
良く知・ちれているように、このようなダストの混入は
、半導体デバイスの精密化、高集積化にとって大きなネ
ックとなるものである。As is well known, such dust contamination poses a major bottleneck to the refinement and high integration of semiconductor devices.
又、作業者によって調合を行なう場合は、ダストの混入
を防止する必要があるため、化学薬品を充分に撹拌して
均一な組成を得ることが難しい2[発明の目的1
本発明は、上述の問題に鑑みてなされたものであって、
半導体材料の処理の直前に自動的に化学薬品を調合しう
るようにす°ることを目的としている6本発明の別の目
的は、ダスト等の異物の混入が少なく、組成の均一な化
学薬品を提供することである。In addition, when mixing is performed by an operator, it is necessary to prevent dust from getting mixed in, so it is difficult to sufficiently stir the chemicals to obtain a uniform composition. This was done in view of the problem,
Another object of the present invention is to automatically prepare chemicals immediately before processing semiconductor materials. Another object of the present invention is to create chemicals with a uniform composition and less contamination by foreign substances such as dust. The goal is to provide the following.
[発明の構r!t1
このため、本発明に係る半導体材料の調合装置は、半導
体用化学薬品を調合するための複数の原液を貯留する複
数の貯留容器と、貯留容器の原液を混合する密閉式の混
合容器と、貯留容器の原液を混合容器に供給する供給手
段と、混合容器に供給される原液の供給量を計量する計
量手段と、混合容器内の液を吸引する吸引手段と液中の
異物を除去するフィルタ手段とを含み、上記吸引手段及
びフィルタ手段を介して混合容器内の液を循環させる循
環路とを備えて構成されたものである。[Structure of invention! t1 For this reason, the semiconductor material blending device according to the present invention includes: a plurality of storage containers for storing a plurality of stock solutions for blending semiconductor chemicals; a closed mixing container for mixing the stock solutions in the storage containers; A supply means for supplying the undiluted solution in the storage container to the mixing container, a measuring means for measuring the supply amount of the undiluted solution to be supplied to the mixing container, a suction means for sucking the liquid in the mixing container, and a filter for removing foreign matter from the liquid. and a circulation path for circulating the liquid in the mixing container via the suction means and filter means.
ネ [発明の効
果1本発明によると、半導体用化学薬品の調合が自動化
されるので、処理の直前に迅速に化学薬品を調合して化
学薬品の成分変化を防止することができると共に、作業
者の危険を回避することができる。[Effect of the invention 1] According to the present invention, the preparation of chemicals for semiconductors is automated, so it is possible to quickly prepare the chemicals immediately before processing to prevent changes in the composition of the chemicals, and it is also possible to dangers can be avoided.
又、調合を自動化すると共に、調合に密閉式の混合容器
を使用したので、化学薬品へのダスト等の異物の混入が
防止されると共に、原液に混入している異物も、上記循
環路内で循環されろうもにフィルタ手段によって除去さ
れるので、不純物の少ない化学薬品を提供することがで
きる。In addition, we have automated the blending process and used a closed mixing container for blending, which prevents foreign matter such as dust from entering the chemicals, and also prevents foreign matter from entering the stock solution in the circulation path. As it is circulated through the wax and removed by filter means, it is possible to provide a chemical with less impurities.
更に又、調合された化学薬品を循環路内で循環させるこ
とにより、化学薬品を撹拌し、化学薬品の組成を充分に
均一化させることができる。Furthermore, by circulating the prepared chemicals in the circulation path, the chemicals can be stirred and the composition of the chemicals can be made sufficiently uniform.
[実施例1 以下、添付図面に基づいて実施例を説明する。[Example 1 Hereinafter, embodiments will be described based on the accompanying drawings.
第3図には半導体材料の洗浄用の化学薬品の調合装置が
示されており、該調合装置6は、アンモニアNH,OH
を貯留する第1貯留ボツクスlと、!
過酸化水素水H,O□を貯留する第2貯留ボツクス2と
、硫酸H2S O−を貯留する第3貯留ボツクス3と、
7ンモニ7と過酸化水素水と純水とから第1の洗浄用化
学薬品を調合する第111合ボックス4と、硫酸と過酸
化水素水とから第2の洗浄用化学薬品を調合する第21
1合ボックス5とを連設して構成されている。FIG. 3 shows a compounding device for chemicals for cleaning semiconductor materials, and the compounding device 6 includes ammonia NH, OH,
The first storage box l stores ! A second storage box 2 for storing hydrogen peroxide solution H,O□, and a third storage box 3 for storing sulfuric acid H2SO-,
A 111th mixing box 4 mixes a first cleaning chemical from the nitrogen 7, hydrogen peroxide solution, and pure water, and a 21st mixer box 4 mixes a second cleaning chemical from sulfuric acid and a hydrogen peroxide solution.
1 box 5 are arranged in series.
第4図に示す如く、第1貯留ボツクス1内には、7ンモ
ニ7を貯留する固定式の第1貯留容器7と、該第1貯蕾
容器7に7ンモニ7を補充する移動可能な第1補充容器
8等が収納されており、該tA1補充容器8は第1貯留
ボツクス1外へ搬出されうるようになっている。第2.
第3貯留ボツクス2゜3も同様に構成されている。As shown in FIG. 4, inside the first storage box 1, there is a fixed type first storage container 7 for storing the 7 ummonium 7 and a movable first storage container 7 for replenishing the 7 ummoni 7 to the first bud storage container 7. The tA1 replenishment container 8 and the like are housed therein, and the tA1 replenishment container 8 can be carried out of the first storage box 1. Second.
The third storage box 2.3 is similarly constructed.
又、第5図に示す如く、第1調合ボックス4内には、第
1の洗浄用化学薬品が調製される第1の混合容器10と
、該第1混合容器10が載置される台秤11(自動平衡
形電子天秤又はa−ドセル形天秤等)と、第1の洗浄用
化学薬品をシ戸遇する流体フィルタ12等が収納されて
いる。第2調合ボックス5も同様に構成されている。Further, as shown in FIG. 5, the first mixing box 4 includes a first mixing container 10 in which a first cleaning chemical is prepared, and a platform scale 11 on which the first mixing container 10 is placed. (such as a self-balancing electronic balance or an a-dossel type balance) and a fluid filter 12 for administering a first cleaning chemical. The second mixing box 5 is similarly configured.
以下、本調合装置の構成をより具体的に説明する。The configuration of this blending device will be explained in more detail below.
第1図に示すように、上記第1補充容器8と第1貯留容
器7は共に密閉式であり、第1貯留容器7内の7ンモニ
7の液面レベルが、常に予め設定された上限レベルL、
と下限レベルL2との間に位置するように、第1補充容
器8から開閉弁13が介設された送液配管14を通して
送液ポンプ15によ智)第1貯留容器7にアンモニアが
供給されるようになっている。第1貯留容器7には、上
述の上限レベルL1と下限レベルL2とを検出するレベ
ル検出器16.17が設けられると共に、送液配管14
には7ンモニ7の流通状況を検出する液体検出器18が
臨設されている。第1補充容器8から第1貯留容器7に
7ンモニ7が供給されろ際には、第1補充容器8内が負
圧となるため、図示しない通気フィルタが設けられた給
気管19から第1補充容器8内に清浄な空気が給気され
る一方、給気用開閉弁20を閉して排気用開閉弁21を
開くことにより、第1貯留容器7内のガスが前記第1〜
第3貯留ボツクス1〜3に夫々収容されている第1〜第
3の貯留容器7,22.23に共通の排気管24を通し
て排出されるようになっている。このように、第1貯留
容器7及び第1補充容器8を密閉式とすることにより、
アンモニア内へのダストの混入を最小限に抑えることが
できる。As shown in FIG. 1, both the first replenishment container 8 and the first storage container 7 are of a closed type, and the liquid level of the liquid 7 in the first storage container 7 is always at a preset upper limit level. L,
Ammonia is supplied from the first replenishment container 8 to the first storage container 7 by the liquid feed pump 15 through the liquid feed pipe 14 in which the on-off valve 13 is interposed so that the ammonia is located between the lower limit level L2 and the lower limit level L2. It has become so. The first storage container 7 is provided with level detectors 16 and 17 that detect the above-mentioned upper limit level L1 and lower limit level L2.
A liquid detector 18 for detecting the flow status of the 7-monitor 7 is installed. When the nitrogen 7 is supplied from the first replenishment container 8 to the first storage container 7, the inside of the first replenishment container 8 becomes negative pressure. While clean air is supplied into the replenishment container 8, by closing the air supply on-off valve 20 and opening the exhaust on-off valve 21, the gas in the first storage container 7 is
The liquid is discharged through a common exhaust pipe 24 to the first to third storage containers 7, 22, and 23 accommodated in the third storage boxes 1 to 3, respectively. In this way, by making the first storage container 7 and the first replenishment container 8 airtight,
The incorporation of dust into ammonia can be minimized.
又、上記排気管24にはガスフィルタ25が介設され、
このガスフィルタ25によって排ガス中の液、蒸気が除
去されるようになっている。Further, a gas filter 25 is interposed in the exhaust pipe 24,
This gas filter 25 removes liquid and steam from the exhaust gas.
上記第1貯留容器7の出口管26は、管継手27を介し
てl111m弁28を有する送液配管30に接続され、
送液配管30は、第2図に示す如く、固定フレームF、
Flllに横架されたバーBによって支持される管継手
31を介し螺旋管32に接続されて、送液配管30及び
螺旋管32の重量が台秤11に作用しないように構成さ
れている。上記螺旋管32はチアミン等の伸縮可能な樹
脂からなり、この螺旋管32はパツキン29を介して本
体に装着された密閉式の第1混合容器10の蓋体33に
固定される管継手34を介して入口管35に接続され、
第1貯留容器7からのアンモニアの供給等に伴う台秤1
1上での第1混合容器10の上下変位が上記螺旋管32
の伸縮によって吸収されるようになっている。The outlet pipe 26 of the first storage container 7 is connected to a liquid feeding pipe 30 having an l111m valve 28 via a pipe joint 27,
As shown in FIG. 2, the liquid feeding pipe 30 is connected to a fixed frame F
It is connected to a helical tube 32 via a pipe joint 31 supported by a bar B horizontally suspended in Fll, so that the weight of the liquid supply piping 30 and the helical tube 32 does not act on the platform scale 11. The spiral tube 32 is made of a stretchable resin such as thiamin, and has a pipe joint 34 fixed to the lid 33 of the first airtight mixing container 10 attached to the main body via a packing 29. connected to the inlet pipe 35 via the
Platform scale 1 accompanying the supply of ammonia from the first storage container 7, etc.
The vertical displacement of the first mixing container 10 on the helical tube 32
It is designed to be absorbed by the expansion and contraction of.
七して給気用開閉弁20(第1図)を開くと共に排気用
開閉弁21を閉じ、圧送用ガス供給口36と圧力計37
.38とリリーフ弁40.41と開閉弁42.43とガ
スフィルタ44等を備えた高圧ガス(窒素〃ス等)によ
る圧送系Pのガス配管45から第1貯留容器7に高圧ガ
スを送給することにより、第1貯留容器7内のアンモニ
アを第1混合容器10に供給することがで塾る。第1混
合容器lOへの7ンモニ7の供給量は、供給前と供給後
の第1混合容器10の重量変化量として台秤11によっ
て計量され、7ンモニ7の供給量が目標値に達した時点
で開閉弁28を閉じることに上り、供給が停止さ九る。7, open the air supply on-off valve 20 (FIG. 1), close the exhaust on-off valve 21, and open the pressurized gas supply port 36 and pressure gauge 37.
.. 38, relief valves 40, 41, on-off valves 42, 43, gas filters 44, etc. High pressure gas is fed to the first storage container 7 from the gas piping 45 of the pressure feeding system P using high pressure gas (nitrogen gas, etc.). As a result, the ammonia in the first storage container 7 is supplied to the first mixing container 10. The amount of 7 mmoni 7 supplied to the first mixing container IO is measured by the platform scale 11 as the amount of change in the weight of the first mixing container 10 before and after supply, and when the supplied amount of 7 mmoni 7 reaches the target value. Then, the on-off valve 28 is closed, and the supply is stopped.
このように、供給量を重量によって計量するようにすれ
ば、供給量を無段階的に調節することができ、しから7
ンモニ7の液温(粘度)等に影響されず、常に正確な計
量が行なえ 5なお、
入口管35の下端35mは、該下端35aが第1混合容
器10内の液に常時浸漬されるように、台秤11の出力
信号、つまり第1混合容器1Gの重量によって検出され
不第1混合容器10内の液の下限レベルL、より下方に
位置している。In this way, if the supply amount is measured by weight, the supply amount can be adjusted steplessly.
It is not affected by the liquid temperature (viscosity) etc. of the liquid meter 7 and can always perform accurate measurement.
The lower end 35m of the inlet pipe 35 is detected by the output signal of the platform scale 11, that is, the weight of the first mixing container 1G, so that the lower end 35a is always immersed in the liquid in the first mixing container 10. It is located below the lower limit level L of the liquid in 10.
それにより、開閉弁28を閉じると即座に7ンモ二7の
供給が停止されると共に、入口管35の下端3Saから
第1混合容器10内へのアンモニアの噴出によって台秤
11に作用する動圧(正荷重)と、アンモニアの噴出に
伴って台秤11に作用する入口管35の反力(負荷重)
とが常時相殺されて7ンモニ7の供給量が一層正確に計
量できる。As a result, when the on-off valve 28 is closed, the supply of 7 ammonia 7 is immediately stopped, and the dynamic pressure ( (positive load) and the reaction force (load weight) of the inlet pipe 35 acting on the platform scale 11 due to the ejection of ammonia.
Since these are always canceled out, the supply amount of 7 mm can be measured even more accurately.
上記第2貯留容器22には、第2補充容器46から開閉
弁47を有する送液配管48を通して送液ポンプ50に
より過酸化水素水が補充されるようになっている。モし
て圧送系Pがら第2貯留容器22に高圧ガスを送給する
ことにより、第2貯留容器22から送液配管51の、開
閉弁52を有する側の分岐管51a、螺旋管53及び入
口管54を通して過酸化水素水が供給される。又、上記
第1混合容器lOには、純水供給口55から流量制御弁
56を有する純水配管57の、開閉弁58が介設された
分岐管57a、螺旋管60及び入口管61を通して純水
が供給される。このように、第1混合容器10に7ンモ
ニ7と過酸化水素水と純水とが順次供給され、夫々の供
給量が台秤11によって計量されて所定の混合比で混合
される。The second storage container 22 is replenished with hydrogen peroxide from a second replenishment container 46 by a liquid feed pump 50 through a liquid feed pipe 48 having an on-off valve 47 . By supplying high pressure gas from the pressure system P to the second storage container 22, the branch pipe 51a, the spiral pipe 53, and the inlet of the liquid delivery pipe 51 from the second storage container 22 are connected to the side where the on-off valve 52 is located. Hydrogen peroxide solution is supplied through pipe 54 . Further, pure water is supplied from the pure water supply port 55 to the first mixing container IO through the branch pipe 57a in which the on-off valve 58 of the pure water piping 57 having the flow rate control valve 56 is interposed, the spiral pipe 60, and the inlet pipe 61. Water is provided. In this way, the liquid 7, hydrogen peroxide, and pure water are sequentially supplied to the first mixing container 10, and the amounts of each are measured by the platform scale 11 and mixed at a predetermined mixing ratio.
第1混合容器10の出口管62は、螺旋管63、調合装
置6内の第1吐出配管64、管継手65及び調合装置6
外の第2吐出配管66を介して内槽67と外槽68から
なる2重構造の処理槽70に連通されている。上記螺旋
管63と、第1吐出配管64と、該第1吐出配管64に
接続される復流配管71と、該復流配管71に接続され
る螺旋管72とは、第1混合容器10内の液を吸引する
循環・吐出ポンプ73と、前記流体フィルタ12と、熱
交換器74とを含む循環路75を形成している。The outlet pipe 62 of the first mixing container 10 includes a spiral pipe 63, a first discharge pipe 64 in the blending device 6, a pipe joint 65, and a spiral pipe 63, a first discharge pipe 64 in the blending device 6, a pipe joint 65,
It is connected to a processing tank 70 having a double structure consisting of an inner tank 67 and an outer tank 68 via an outer second discharge pipe 66 . The spiral pipe 63, the first discharge pipe 64, the return flow pipe 71 connected to the first discharge pipe 64, and the spiral pipe 72 connected to the return flow pipe 71 are arranged inside the first mixing container 10. A circulation path 75 is formed that includes a circulation/discharge pump 73 that sucks the liquid, the fluid filter 12, and a heat exchanger 74.
そしてアンモニアと過酸化水素水と純水との混合後に、
入口弁76及び循環用開閉弁77を開くと共に吐出用開
閉弁78を閉じ、循環・吐出ポンプ73で第1混合容器
10内の混合液を吸引して循環路75中を循環させるこ
とにより、上記混合液を撹拌して均一なm成の第1の洗
浄用化学薬品を調製することができる。又、循環中に流
体フィルタ12により混合液中の異物を除去すると共に
、熱交換器74によって混合液の液温を調整することが
できる。After mixing ammonia, hydrogen peroxide and pure water,
By opening the inlet valve 76 and the circulation on-off valve 77 and closing the discharge on-off valve 78, the circulation/discharge pump 73 sucks the liquid mixture in the first mixing container 10 and circulates it through the circulation path 75. The mixture can be stirred to prepare a uniform composition of the first cleaning chemical. Further, during circulation, foreign matter in the mixed liquid can be removed by the fluid filter 12, and the temperature of the mixed liquid can be adjusted by the heat exchanger 74.
循環路75内での循環によって均一な組成の第1の洗浄
用化学薬品が調製された後に、循環用開閉弁77を閉じ
て吐出用開閉弁78を開くことにより、第1混合容器1
0内の第1の洗浄用化学薬品を第1及び第2吐出配管6
4.66を通して処理槽70に供給し、内槽67内でシ
リコン等のウェハーを洗浄することができる。この上う
に、本実施例では、単一のポンプ73により、混合液の
循環と吐出が行なえる。なお、第1混合容器10から処
理槽70への第1の洗浄用化学薬品の供給量は、台秤1
1によって計量される。After the first cleaning chemical having a uniform composition is prepared by circulating in the circulation path 75, the circulation on-off valve 77 is closed and the discharge on-off valve 78 is opened to prepare the first mixing container 1.
0 to the first and second discharge piping 6.
4.66 to the processing tank 70, and wafers such as silicon can be cleaned in the inner tank 67. Moreover, in this embodiment, the single pump 73 can circulate and discharge the mixed liquid. Note that the supply amount of the first cleaning chemical from the first mixing container 10 to the processing tank 70 is determined by the platform balance 1.
1.
” 第1混合容
器10の底部、復流配管71、洗浄槽70の内槽67及
び外槽68からは夫々Vレン管80〜83が引き出され
ている。84は第1混合容器10への液の給徘に際して
第1混合容器10に給気又は排気するための、図示しな
い通気フィルタが設けられた給排気管である。” V-lens pipes 80 to 83 are drawn out from the bottom of the first mixing container 10, the return flow pipe 71, and the inner tank 67 and outer tank 68 of the cleaning tank 70, respectively. This is an air supply/exhaust pipe provided with a ventilation filter (not shown) for supplying or exhausting air to the first mixing container 10 during supply of air.
前記第3貯留容器23には、第3補充容器85から送液
ポンプ86により硫酸が補充されるようになっている。The third storage container 23 is replenished with sulfuric acid from a third replenishment container 85 by a liquid feeding pump 86 .
そして前記第2調合ボックス5に収容されている第2混
合容器87には、第2貯留容器22から高圧ガスを駆動
源として送液配管51の、開閉弁88を有する側の分岐
管Slb及び螺旋管、入口管を介して過酸化水素水が供
給されると共に、第3貯留容器23から開閉弁90を有
する送液配管91を介して硫酸が供給され、夫々の供給
量が台秤92により計量されて所定の混合比で混合され
る。この混合液は循環・吐出ポンプ93、流体フィルタ
94及び熱交換器95を含む循環路96内で循環されて
撹拌、−過及び調温を施され、このようにして調製され
た第2の洗浄用化粋
学薬品が吐出配管97を介して処理槽98に吐出される
。なお、第2混合容器87には、純水配管57の、開閉
弁99が設けられた分岐管S7bを介して純水が供給さ
れうる上うになっている。The second mixing container 87 housed in the second mixing box 5 is supplied with a branch pipe Slb on the side having the on-off valve 88 of the liquid feeding pipe 51 and a spiral pipe using high pressure gas from the second storage container 22 as a driving source. Hydrogen peroxide solution is supplied through the pipe and inlet pipe, and sulfuric acid is supplied from the third storage container 23 through a liquid supply pipe 91 having an on-off valve 90, and the respective supplied amounts are measured by a platform scale 92. and mixed at a predetermined mixing ratio. This mixed liquid is circulated in a circulation path 96 that includes a circulation/discharge pump 93, a fluid filter 94, and a heat exchanger 95, and is subjected to stirring, filtration, and temperature control, and the second cleaning liquid prepared in this way is Chemicals for use are discharged into a processing tank 98 via a discharge pipe 97. Note that pure water can be supplied to the second mixing container 87 via a branch pipe S7b of the pure water pipe 57, which is provided with an on-off valve 99.
次に、第6図に基づいて第2実施例を説明する。Next, a second embodiment will be described based on FIG.
この第2実施例は、7フ化水素酸等の腐食性の高い原液
を流量によって計量する場合に、汎用の流量計を使用し
て計量できるように工夫したものである。This second embodiment is devised so that a general-purpose flowmeter can be used to measure a highly corrosive stock solution such as heptahydrofluoric acid by flow rate.
すなわち、第2実施例による調合装置は、7ツ化水素酸
等の原液を貯留容器7から混合容器10に供給すると共
に、腐食性の低い計量液(水、油等)を後述の循環路1
72内で原液の流量に対し一定の流量比で反時計回りに
循環させるベローズポンプ163を設け、汎用の流量計
174で計量液の流量を計量することにより、原液の流
量を求めるようにしたものである。That is, the blending device according to the second embodiment supplies a stock solution such as hydrochloric acid from the storage container 7 to the mixing container 10, and also supplies a less corrosive measuring liquid (water, oil, etc.) to the circulation path 1, which will be described later.
A bellows pump 163 that circulates counterclockwise at a constant flow rate with respect to the flow rate of the stock solution is provided in the pump 72, and the flow rate of the stock solution is determined by measuring the flow rate of the metering solution with a general-purpose flowmeter 174. It is.
上記ベローズポンプ163は、本体164の両側に固定
した第1.第2シリング165.166内に第1.第2
ベローズ167、168を収容し、両ベローズIG7.
168の底部を連結シャ7)170で連結してなり、空
気配管160から開閉弁161、絞り弁162を介して
供給される圧縮空気を第1.第2ベローX’167.1
68内に交互に供給することにより、両ベローズ167
、’168番交互に膨張及び収縮させうるように構成
されている。そして第1シリンダ165は、上記計量液
が貯留された貯留容器171を含む循環路172内に位
置する一方、第2シリンダ166は第1貯留容器7と第
1混合容器10を連絡する送液配管173の途中に位置
している。The bellows pump 163 has first bellows pumps fixed to both sides of the main body 164. 1st within 2nd shillings 165.166. Second
Both bellows IG7.
168 are connected by a connecting shaft 7) 170, and the compressed air supplied from the air pipe 160 through the on-off valve 161 and the throttle valve 162 is transferred to the first. 2nd bellow X'167.1
68, both bellows 167
, '168 is constructed so that it can be inflated and deflated alternately. The first cylinder 165 is located in a circulation path 172 that includes a storage container 171 in which the measured liquid is stored, while the second cylinder 166 is a liquid feeding pipe that connects the first storage container 7 and the first mixing container 10. It is located in the middle of 173.
上記ベローズポンプ163においては、連結シャ7N?
0が右行する際に第1シリング16S内に計量液が吸入
されると共に、第2シリンダ166内の原液が第1混合
容器1011へ送出されるので、連結シャ7)170の
1回の右行行程中の両シリンダ165,166の内容積
の変化量の比を予め求めておけば、流量計174で第1
シリンダ165への計量液の吸入量を検出することによ
り、第1混合容器10への原液の供給量を知ることがで
きる。このようにすれば、汎用の流量計等安価で高精度
の計量装置を用いて、7フ化水素酸等の腐食性の高い原
液の計量が可能になる。In the above bellows pump 163, the connecting shaft 7N?
When the cylinder 0 moves to the right, the measured liquid is sucked into the first cylinder 16S, and the stock liquid in the second cylinder 166 is sent to the first mixing container 1011. If the ratio of the amount of change in the internal volumes of both cylinders 165 and 166 during the stroke is determined in advance, the first
By detecting the amount of metered liquid sucked into the cylinder 165, the amount of the stock solution supplied to the first mixing container 10 can be determined. In this way, it becomes possible to measure a highly corrosive stock solution such as heptahydrofluoric acid using an inexpensive and highly accurate measuring device such as a general-purpose flowmeter.
第1図は本発明を適用した半導体材料の洗浄用化学薬品
の調合装置の展開説明図、第2図は第1図の部分拡大図
、第3図は第1図の調合装置の斜視図、第4図は第3図
中A−A線に沿う内部機構を一部省略した断面略図、第
5図は第3図中B−B線に沿う内部機構を一部省略した
断面略図、第6図は別の実施例の部分説明図である。
7.22.23・・・貯留容器、 10.87・・・
混合容器、 11.92・・・台秤(計量手段)、
12゜94・・・流体フィルタ(フィルタ手段)、
73゜93・・・循環・吐出ポンプ(吸引手段)、
75゜96・・・循環路、 P・・・圧送系(供給
手段)。
特 許 出 願 人 倉敷紡績株式会社代 理 人 弁
理士 前出 葆ほか2名第2図
第5図FIG. 1 is a developed explanatory view of a compounding device for cleaning chemicals for semiconductor materials to which the present invention is applied, FIG. 2 is a partially enlarged view of FIG. 1, and FIG. 3 is a perspective view of the compounding device of FIG. 1. 4 is a schematic cross-sectional view taken along the line A-A in FIG. 3 with some of the internal mechanisms omitted; FIG. 5 is a schematic cross-sectional view taken along the line B-B in FIG. 3 with some of the internal mechanisms omitted; The figure is a partial explanatory diagram of another embodiment. 7.22.23...Storage container, 10.87...
Mixing container, 11.92... platform scale (measuring means),
12゜94...Fluid filter (filter means),
73°93...Circulation/discharge pump (suction means),
75°96... Circulation path, P... Pressure feeding system (supply means). Patent applicant: Kurashiki Boseki Co., Ltd. Representative: Patent attorney Mr. Hao and two others Figure 2 Figure 5
Claims (1)
貯留する複数の貯留容器と、貯留容器の原液を混合する
密閉式の混合容器と、貯留容器の原液を混合容器に供給
する供給手段と、混合容器に供給される原液の供給量を
計量する計量手段と、混合容器内の液を吸引する吸引手
段と液中の異物を除去するフィルタ手段とを含み、上記
吸引手段及びフィルタ手段を介して混合容器内の液を循
環させる循環路とを備えたことを特徴とする半導体用化
学薬品の調合装置。(1) A plurality of storage containers for storing a plurality of stock solutions for preparing semiconductor chemicals, a closed mixing container for mixing the stock solutions in the storage containers, and a supply means for supplying the stock solutions in the storage containers to the mixing container. , a measuring means for measuring the supply amount of the stock solution supplied to the mixing container, a suction means for suctioning the liquid in the mixing container, and a filter means for removing foreign matter from the liquid, the suction means and the filter means being 1. A compounding device for semiconductor chemicals, comprising: a circulation path for circulating a liquid in a mixing container through the mixing container.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59239644A JPS61118127A (en) | 1984-11-13 | 1984-11-13 | Mixing apparatus of chemical for semiconductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59239644A JPS61118127A (en) | 1984-11-13 | 1984-11-13 | Mixing apparatus of chemical for semiconductor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61118127A true JPS61118127A (en) | 1986-06-05 |
JPH0579372B2 JPH0579372B2 (en) | 1993-11-02 |
Family
ID=17047775
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59239644A Granted JPS61118127A (en) | 1984-11-13 | 1984-11-13 | Mixing apparatus of chemical for semiconductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61118127A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1995009042A1 (en) * | 1993-09-30 | 1995-04-06 | Semitool, Inc. | Semiconductor processor liquid spray system with additive blending |
JP2003518591A (en) * | 1998-06-30 | 2003-06-10 | アドバンスト・デリバリー・アンド・ケミカル・システムズ・リミテッド | System for supplying multiple chemicals to process tools |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60122031A (en) * | 1983-12-02 | 1985-06-29 | Takeda Chem Ind Ltd | Apparatus for automatically preparing solution such as chemical liquid |
-
1984
- 1984-11-13 JP JP59239644A patent/JPS61118127A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60122031A (en) * | 1983-12-02 | 1985-06-29 | Takeda Chem Ind Ltd | Apparatus for automatically preparing solution such as chemical liquid |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1995009042A1 (en) * | 1993-09-30 | 1995-04-06 | Semitool, Inc. | Semiconductor processor liquid spray system with additive blending |
JP2003518591A (en) * | 1998-06-30 | 2003-06-10 | アドバンスト・デリバリー・アンド・ケミカル・システムズ・リミテッド | System for supplying multiple chemicals to process tools |
Also Published As
Publication number | Publication date |
---|---|
JPH0579372B2 (en) | 1993-11-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6151810B2 (en) | Fluid processing system and method | |
TWI428975B (en) | Systems and methods for reclaiming process fluids in a processing environment | |
TWI445577B (en) | Systems and methods for managing fluids in a processing environment using a liquid ring pump and reclamation system | |
US8517802B2 (en) | Slurry system for semiconductor fabrication | |
KR100494971B1 (en) | Liquid transfer system, and method for transferring liquid from a liquid supply tank to a liquid output line | |
TWI454682B (en) | Systems and methods for managing fluids using a liquid ring pump | |
KR100394181B1 (en) | Two-stage chemical mixing system | |
RU2537583C2 (en) | Mixing unit for preparing ready-mixed medical irrigating solutions, first haemodialysis concentrates | |
US20100128555A1 (en) | Systems and methods for material blending and distribution | |
US4650339A (en) | Solution mixing method and apparatus | |
JP2004516931A (en) | Method and apparatus for preparing and distributing slurry solution | |
US20070109912A1 (en) | Liquid ring pumping and reclamation systems in a processing environment | |
KR20050044456A (en) | Advanced process control for immersion processing | |
US6446644B1 (en) | Chemical solutions system for processing semiconductor materials | |
US20080314450A1 (en) | Flow Control | |
JP3741811B2 (en) | Method and apparatus for diluting alkaline developer stock solution | |
JPS61118127A (en) | Mixing apparatus of chemical for semiconductor | |
US20050146982A1 (en) | Quick blend module | |
JP6984875B2 (en) | Chemical supply device | |
CN207748843U (en) | A kind of automatic filling machine | |
JPH11300190A (en) | Liquid chemical compounding device for producing semiconductor | |
US6322261B1 (en) | Photographic developer with automated mixing and replenishing | |
CN107555383A (en) | A kind of automatic filling machine | |
JP2003532286A (en) | Apparatus and method for processing semiconductor wafer | |
JPS61159116A (en) | Weighing equipment for liquid |