JPS61117858U - - Google Patents
Info
- Publication number
- JPS61117858U JPS61117858U JP208885U JP208885U JPS61117858U JP S61117858 U JPS61117858 U JP S61117858U JP 208885 U JP208885 U JP 208885U JP 208885 U JP208885 U JP 208885U JP S61117858 U JPS61117858 U JP S61117858U
- Authority
- JP
- Japan
- Prior art keywords
- rotating rods
- pair
- fixed
- rods
- axis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 210000000078 claw Anatomy 0.000 claims description 2
Landscapes
- Drawers Of Furniture (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP208885U JPS61117858U (en, 2012) | 1985-01-10 | 1985-01-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP208885U JPS61117858U (en, 2012) | 1985-01-10 | 1985-01-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61117858U true JPS61117858U (en, 2012) | 1986-07-25 |
Family
ID=30475434
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP208885U Pending JPS61117858U (en, 2012) | 1985-01-10 | 1985-01-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61117858U (en, 2012) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02139284U (en, 2012) * | 1989-04-26 | 1990-11-21 | ||
| US7061120B2 (en) | 1999-05-20 | 2006-06-13 | Amkor Technology, Inc. | Stackable semiconductor package having semiconductor chip within central through hole of substrate |
| US7211900B2 (en) | 1999-08-24 | 2007-05-01 | Amkor Technology, Inc. | Thin semiconductor package including stacked dies |
| USRE40112E1 (en) | 1999-05-20 | 2008-02-26 | Amkor Technology, Inc. | Semiconductor package and method for fabricating the same |
| US7633144B1 (en) | 2006-05-24 | 2009-12-15 | Amkor Technology, Inc. | Semiconductor package |
| US9466545B1 (en) | 2007-02-21 | 2016-10-11 | Amkor Technology, Inc. | Semiconductor package in package |
-
1985
- 1985-01-10 JP JP208885U patent/JPS61117858U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02139284U (en, 2012) * | 1989-04-26 | 1990-11-21 | ||
| US7061120B2 (en) | 1999-05-20 | 2006-06-13 | Amkor Technology, Inc. | Stackable semiconductor package having semiconductor chip within central through hole of substrate |
| USRE40112E1 (en) | 1999-05-20 | 2008-02-26 | Amkor Technology, Inc. | Semiconductor package and method for fabricating the same |
| US7211900B2 (en) | 1999-08-24 | 2007-05-01 | Amkor Technology, Inc. | Thin semiconductor package including stacked dies |
| US7633144B1 (en) | 2006-05-24 | 2009-12-15 | Amkor Technology, Inc. | Semiconductor package |
| US9466545B1 (en) | 2007-02-21 | 2016-10-11 | Amkor Technology, Inc. | Semiconductor package in package |