JPS61117853A - Ic indicating method - Google Patents

Abstract

PURPOSE:To obtain the automatic screening-inspection lines for the IC capable of continuous processing, by reading a bar code given to the upper surface of an IC package. CONSTITUTION:The IC1 is provided with a bar code 3 in part of the upper surface 2 of the package. The way of giving the bar code can be either the adhesion of a label indicating a bar code or printing. Bar-coded ICs 21, 31, 41... are arranged at the tops of normal IC groups 22, 32... and supplied to an IC handler. At the top of an N-th lot, the bar code of an IC21 is detected by a bar code reading sensor 8 and read by a bar code reader 7. Next, after a sequence of codeless normal ICs 22, the bar code of an IC31 is detected and read at the top of an M-th lot. Thereafter, similarly the bar code of a coded IC is detected and read at the top of each lot. This manner enables the discrimination of the lot numbers of ICs supplied to a contactor 5. Besides, type, shapes, and grades can be discriminated by suitably preparing bar code information.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for displaying integrated circuits, particularly suitable for automated screening or inspection operations.

(Prior Art) There are various external shapes of integrated circuit products (hereinafter referred to as ICs) depending on the material and method of the package used. FIGS. 4 to 7 show external views of typical ICs. In the case of Figures 4 and 5, dual in-line package (DIP)
), and the most common one, Figure 4, is the plastic type DI.
An example of a P package is shown, and Figure 5 shows a ceramic type DIP.
An example of a package is shown.

Further, FIG. 6 shows an example of a plastic type flat package, and FIG. 7 shows an example of a ceramic type flat package. The flat package shown in FIGS. 6 and 7 is the second most commonly used package after the above-mentioned DIP.

Of course, there are various other IC packages with shapes different from these, but since they all have the same feature of having a substantially flat upper surface, the following explanation will be limited to the DIP. However, it goes without saying that this invention, which will be explained later, is also applicable to almost all ICs other than DIPs.

DIP type ICs are usually handled while being housed in a magazine case as shown in FIG. There are various cross-sectional shapes and materials for magazine cases, but in most cases, DIP type ICs are lined up one by one in the longitudinal direction, and several dozen pieces are housed in one magazine case.

ICt-sorting stored in such a magazine case,
In order to perform the inspection, the IPIC is usually used as shown in Figure 9.
handler is used.

This DIPIC handler moves the ICs in a magazine case in a fixed order using a feeding mechanism 4, and transfers the ICs one by one (or a plurality of ICs at a time).
A test is performed by connecting to the connector 5 connected to a testing machine (tester) for
The Ct monitor 6 separates the information by type. Note that bold arrows 9 in the figure indicate the order in which the ICs to be measured are moved.

Further, at the manufacturing stage, ICs are grouped according to their manufacturing history, and are usually organized into lots of several hundred to tens of thousands of pieces.

(Problem to be solved by the invention) DIP-packaged ICs are shipped in lots after going through characteristics selection and inspection processes, but at these stages, it is necessary to provide a slip with the lot name and quantity written on it. At the same time, logistics management is required to prevent lot mix-ups.
It required a lot of manpower.

As mentioned above, the conventional management method requires documents such as slips and memos for each lot, and requires acquisition management to prevent lots from physically mixing, which hinders the automation of sorting and inspection.

This invention solves the problems of the above-mentioned prior art.
The present invention provides a method for displaying integrated circuits that solves some of the factors that obstruct automation of necessary sorting and inspection of forms.

(Means for Solving the Problems) This invention is a method for displaying integrated circuits, in which a "barcode" display is attached to the top surface of the IC by printing or pasting a label, and the display is read by a barcode reader. This is what I did.

(Function) According to the present invention, since the method for displaying integrated circuits is performed as described above, the barcode is detected by a barcode reader to automatically identify the lot section.

(Example) Hereinafter, an example of the integrated circuit display method of the present invention will be described based on the drawings. FIG. 1(a) shows the ICI of a plastic DIP package applied to one embodiment.
FIG. 1(b) is a perspective view showing a ceramic type DI.
FIG. 1 is a perspective view of an ICI 1 of a P package. In this FIG.

Similarly, in the case of FIG. 1(b), a bar code 13 is attached to a part or the entire surface of the upper surface 12 of the ICII.

The size of these barcodes 3 or 13 is small enough for practical use and printed in advance.
The C type name display etc. may not be covered.

The effect of barcode 3 or 13 is the same whether it is printed or affixed with a label.

Furthermore, in the examples of FIGS. 1(a) and 1(b), the orientation of the barcodes 3 and 13 is illustrated along the longitudinal direction of the DIP, but the same effect can be obtained even if the barcodes are oriented horizontally.

Next, the IC used for barcode detection of the IC according to the present invention
Explain handlers. FIG. 2 is a block diagram of an IC handler with a barcode reader applied to the present invention, and this FIG. A barcode reader 7 is added.

That is, in this invention, for example, the barcode reading sensor section 8 is installed just before the connector 5.
t'' is set, and this barcode reading netsuke IC handler handles the IC passing under the barcode reading sensor 8.
I or 11 barcode 3 or 13 information is read.

Note that in FIG. 2 as well, thick arrows 9 indicate the order in which the ICs to be measured are moved, as in the case of FIG. 9.

Next, according to FIG. 3, the IC with barcode reader shown in FIG.
The handler is used for ICI or 11t-lot classification identification applied to this invention (an example will be described below).

In FIG. 3, reference numeral 20 indicates the order in which the ICs to be measured are supplied to the IC handler with the barcode reader. IC21, 31, and 41 are barcoded ICs applied to the present invention, and one or more ICs are inserted at the beginning of each lot.

That is, after the first IC21 of the Nth lot is detected by the sensor 8 for reading the cover code, and then a plurality of regular IC22s without barcodes follow, until just before the next IC31 with barcodes arrives. This makes it possible to identify the lot that the IC group is the Nth lot.

These identifications and countermeasures are performed by processing the output information of the barcode reader 7 with a normal electronic computer. The biggest advantage is that the boundaries 50 between lots do not require special physical or temporal "intervals" and the movement of the IC group can be uniform and continuous), making it possible to process multiple lots in succession. This is particularly effective for automated sorting (inspection) processes. The content of the barcode information is not particularly limited, and "lot salt only" or "lot salt, model name, lot parameter, etc." may be entered as necessary.

Although the above explanation has been made from the perspective of an IC manufacturer, it is easily inferred that the present invention can be used by IC users for purposes such as acceptance inspections in the same way as the present invention.

In addition, although the application of the IC applied to this invention has been explained using lot identification as an example, by appropriately preparing barcode information, it can also be applied for type name identification, shape identification, grade identification, etc. Needless to say, it is.

(Effects of the Invention) As explained in detail above, according to the present invention, since a bar code is attached to the upper surface of an IC, by detecting the bar code, the section of a lot can be automatically identified. If used, automatic screening (inspection) for ICs that can be processed continuously
Lines can be built.

In addition, the work that was previously managed manually will be mechanized, and slips attached to lots will no longer be necessary, and continuous processing will not only reduce manufacturing costs but also prevent errors caused by humans. Excellent quality IC
It is also effective in creating products.

[Brief explanation of drawings]

FIG. 1(a) shows the I of a plastic DIP package applied to an embodiment of the integrated circuit display method of the present invention.
FIG. 1(b) is a perspective view of an IC in a ceramic DIP package applied to the display method of the same integrated circuit, and FIG. 2 is a perspective view of FIG. 1(a) and FIG. 1(b). A block diagram of an IC handler with a barcode reader applied to IC identification, FIG. 3 explains an example of use for ICt-lot classification identification shown in FIGS. 1(a) and 1(b). Figures 4 to 7 are perspective views of conventional ICs, Figure 8 is a perspective view of a magazine case that houses a conventional DIP type IC, and Figure 9 is a block diagram of a conventional IC controller. It is. 1.11...IC, 2,12...Top surface of IC, 3
゜13... Barcode, 4... Feed mechanism, 5...
Connector, 6... Sorter, 7... Barcode reading f
fl, 8... Senna for barcode reading. Figure 4 Figure 5 Figure 8 Procedural amendment April 10, 1985

Claims (3)

[Claims] (1) A method for displaying an integrated circuit, characterized by attaching and displaying a bar code by printing or pasting a label on the upper surface of an integrated circuit package. (2) Place one integrated circuit with a barcode at the beginning of the lot.
2. The method for displaying an integrated circuit according to claim 1, wherein one or more of the integrated circuits are used. (3) The method for displaying an integrated circuit according to claim 1, wherein the information on the barcode is read by a barcode reader.