JPS61115982A - Fusion bonding adhesive tape - Google Patents

Abstract

PURPOSE:To provide a fusion bonding adhesive tape which does not cause blocking and has a high pin drawing-out strength and excellent heat retention, prepared by coating a base sheet with a fusion bonding adhesive obtained by adding two or more resins with different softening points to an acrylic pressure sensitive adhesive. CONSTITUTION:The adhesive tape for securing and joining of electronic parts is prepared by applying a thermoplastic adhesive to a base tape. The thermoplastic adhesive is obtained by adding 210-400pts.wt. (B) high and medium temp. softening fusible resin which is compatible with adhesive (A) and has a softening point of 60-150 deg.C (e.g. thermoplastic hydrocarbon resin obtained by copolymerization of an aromatic olefin with a diolefin) and 1-100pts.wt. low softening resin having good compatibility with adhesive (A) and a softening point of below 59 deg.C (e.g. styrene resin) or viscous liquid resin having a viscosity of 10-100,000cP (e.g. ethylene glycol ester of hydrogenated rosin) to 100pts.wt. by solid (A) acrylic pressure-sensitive adhesive [e.g. butyl (meth)acrylate].

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a series of electronic components in which a large number of electronic components with lead wires are arranged in parallel so that the lead wires are located in parallel. This is a heat-sealable adhesive tape whose end portions are sandwiched between two tape base materials, an adhesive vermilion coated Ir1 base material and an adhesive coated base material, for connection and holding. That is, when gluing electronic parts, a taping machine is used to glue electronic parts such as resistive elements, capacitor elements, capacitive elements, and transistor elements with lead wires. p! The present invention applies a fixing method to obtain a permanent adhesive type electronic component chain.The present invention is a heat-fused M5! ! This invention relates to improvements in adhesive tapes.

Conventional technology In the sag-shaped arrangement holding structure of electronic components with lead wires, room-temperature adhesive tape and non-X! A holding structure in which electronic components are sandwiched between two pieces of tape is shown in Japanese Utility Model Publication No. 43-12368, but in this design, the pressure-sensitive adhesive can flow internally with small stress because the adhesive tape is a room-temperature adhesive type. Easy to wake up.

As a result, inconvenient phenomena such as misalignment of the lead wires occur, resulting in the disadvantage that accurate holding and fixing cannot be achieved over a long period of time. In addition, in a star array holding structure in which electronic components with lead wires are sandwiched between two tape base materials, one of the tape base materials is made by adding 50 to 200 parts by weight of a heat-melting resin to 100 parts by weight of a pressure-sensitive adhesive. There are also examples of holding structures in which electronic components are sandwiched between an adhesive tape using a heat-sensitive adhesive and a tape base material to which no adhesive is applied. However, in this case, if 200 parts by weight or more of the hot-melt resin is used for 100 parts by weight of the pressure-sensitive adhesive, then! ! ! It has been shown that pressure-rupture adhesives have weak adhesive strength and rIi adhesives become brittle.

Problems to be Solved by the Invention The object of the present invention is to improve a heat-sensitive adhesive for holding a series of electronic components. The purpose of this invention is to obtain a heat-sealable adhesive tape that has high drawing strength and good heat resistance retention properties.

As a means to solve the problem, the inventors conducted intensive research and found that a heat-melting M4 resin with a softening point of medium to high temperature (temperatures of 60 to 150 degrees Celsius is referred to as medium to high temperature in this specification) is an acrylic pressure-sensitive resin. If it is added in excess of approximately twice the amount of adhesive, it will not cause puking, increase the pin pull-out strength after hot-melt bonding, and improve high-temperature retention (in terms of retention at 50°C). It was also found that the heat resistance was also excellent. At this time, a small amount of low softening point (59°C or less) resin or viscous liquid resin is added.

The brittleness of the hot-melt adhesive was also improved by the balance of the three types of blended compositions, and we were able to obtain a hot-melt adhesive tape for holding electronic components that does not block and has excellent adhesive strength and high-temperature retention properties. This is what I did.

The structure of the present invention is as follows: (a) Based on 100 parts by weight of the solid content of the acrylic pressure-sensitive adhesive, (b) A softening point of 60° C. or more that has good compatibility with the pressure-sensitive adhesive.
210 to 400 parts by weight (preferably 210 to 300 parts by weight) of a thermofusible resin with a medium-high softening point of 150°C, and (c) a low softening point resin with a softening point of 59°C or less that has good compatibility with the pressure-sensitive adhesive. or viscosity 10-100.000cp
A hot-melt adhesive for holding electronic components, which is prepared by applying a hot-melt adhesive prepared by adding 1 to 100 parts by weight (preferably 5 to 80 parts by weight) of a room-temperature viscous liquid resin of s. It is a moldable adhesive tape.

In the present invention, the softening point is a softening point measured by the ring and ball method specified in 2531 of the Japanese Industrial Standards (JIS). Also, the viscosity.

It means the viscosity at 25° C. measured by the method specified in 8833 of the Japanese Industrial Standards (JIS).

The constituent elements of the present invention will be explained in detail below. (Acrylic pressure-sensitive adhesive) In the present invention, as the acrylic pressure-sensitive adhesive, methyl acrylate, methyl acrylate, butyl acrylate, hexyl acrylate, acrylic Acrylic acid esters such as 2-ethylhexyl acrylate, inoctyl acrylate, octyl acrylate, decyl acrylate, methyl methacrylate, ethyl methacrylate, butyl methacrylate,
Obtained by dissolving a homopolymer or copolymer of esters such as methacrylic acid esters such as hexyl methacrylate, methacrylic #2-ethylhexyl, inoctyl methacrylate, octyl methacrylate, and decyl methacrylate in a suitable solvent. Acrylic pressure-sensitive adhesives or their esters and acrylic acid, methacrylic acid,
An acrylic pressure-sensitive adhesive obtained by dissolving a copolymer with a vinyl compound having a functional group such as itaconic acid, crotonic acid, or maleic acid in a suitable solvent is used.

When using a copolymer having this functional group, a small amount of organic crosslinking agent such as epoxy or isocyanate that reacts with the functional group is added to further increase the heat resistance and cohesive strength of the desired hot-melt adhesive. It is also possible f7.

(Medium-high softening point thermofusible resin) The mid-high softening point thermofusible resin in the present invention includes rosin and modified rosin (modified rosin means hydrogenated rosin,
Polymerized rosin, etc.) derivatives (derivatives mean esters such as methyl ester, glycerin ester, triethylene gelcol ester, pentaerythritol ester, etc.), polyterpene resins (i.e., α-pinene polymer, β - pinene polymers, dipentene polymers, etc.), terpene modified resins (i.e., terpene-phenol and α-pinene-phenol copolymers, etc.), aliphatic hydrocarbon resins (i.e., olefin polymers, etc.) polymers, diolefin polymers, etc.), cyclopentadiene resins, aromatic hydrogen resins (meaning polymers of petroleum distillates containing 9 carbon atoms), One or more types selected from the group of phenolic resins (both novolak type and resol type can be used), styrene resins, xylene resins, and coumaron indene resins are used.

The medium-high softening point heat-melting resin that is the main compound of the pressure-sensitive adhesive applied to the tape of the present invention requires a large amount of heat to activate the pressure-sensitive adhesive when the softening point is 150°C or higher. The following points are undesirable and should be relied upon regarding the blending ratio of the hot-melt resin.

When the heat-melting resin is 210 parts or more, that is, in excess,
Thermal adhesion is improved, pin pull-out strength is improved (i.e., adhesion is improved), and retention at high temperatures (i.e., lead wire connection strength at 50°C) is improved (heat resistance is also improved). (It can also be said that the heat resistance retention property is improved).

When the tape is rewound without blocking, and if the amount of the hot-melt resin is in excess of 400 parts or more, the pressure-sensitive adhesive becomes brittle.

(Low softening point resin and room temperature viscous liquid resin) The low softening point resin and room temperature viscosity liquid resin in the present invention include:
Rosin and modified rosin derivatives, polyterpene resins, terpene modified resins, aliphatic hydrocarbon resins, aromatic hydrocarbon resins, phenolic resins, styrene resins 11
11. Fourteen or more selected from the group of xyleno resins are used. Also, what should be considered regarding the blending ratio of low softening point resins or room temperature viscous liquid resins?

It is as follows.

A low softening point resin or viscous liquid resin with a softening point of 59°C or less is used as a brittleness improvement modifier in a small amount (1-
100 parts by weight). In other words, adding an excess (100 parts or more) of a low softening point resin with a softening point of 59° C. or lower or a room temperature viscous liquid resin to form the main blend means that a high temperature (40 to 50 Therefore, the selection and blending amount of low-softening point resins and room-temperature viscous liquid resins are undesirable because they tend to soften and have poor adhesion under acrylic pressure-sensitive adhesives. The physical properties of the pressure-sensitive adhesive are appropriately selected according to the blending ratio of the medium-high softening point heat-melting resin, the scale and softening point (molecular weight) of the medium-high softening point heat-melting resin, and the softening point (molecular weight). It is something.

(Base material for tape) Examples of the base material for tape in the present invention include papers such as crepe paper, kraft paper, and Japanese paper, polyethylene film,
Plastic films such as polypropylene film and polyester film, metal foils such as aluminum foil and copper foil, and fabrics such as cotton cloth and glass cloth can be used alone or as a composite.

EXAMPLES The present invention will be explained in more detail with reference to Examples below, but the following Examples are not intended to limit the present invention in any way.

Example 1 Using lauryl peroxide as an initiator, 11 parts of butyl acrylate 94i and 6 parts by weight of acrylic acid were heated to a monomer concentration of 60% in toluene under a nitrogen stream.
Copolymerization was carried out at a temperature of 7 hours to prepare an acrylic pressure-sensitive adhesive liquid. For this pressure sensitive adhesive,
Per 100 parts by weight of the solid content, Hi-Resin #60 [a product of Toho Oil Resins], a thermoplastic hydrocarbon resin made by copolymerizing aromatic olefin and diolefin,
The softening point is 60°C. ) 25031 [Okibe and Ester Gum] IT (a product of Arayo Kagaku Kogyo, triethylene glycol ester of hydrogenated rosin, its viscosity is 14,000 cps) was added, and 10 parts by weight were added; Further, toluene was added and mixed for dilution or dissolution to obtain a heat-melting TA adhesive liquid with a solid content of 60% by weight.

This hot-melt adhesive liquid was applied to crepe paper with a basis weight of 75 g/m' so that the thickness after drying was 305 m.
It was dried at ℃ for 3 minutes to obtain an adhesive tape with a width of 13 mm. This is called sample A.

Example 2 Acrylic #
92 parts by weight of 2-ethylhexyl and 8 parts by weight of acrylic acid were copolymerized in toluene at a temperature of 80°C for 8 hours at a monomer concentration of 50 ffiffi% under a nitrogen stream to produce an acrylic pressure-sensitive adhesive liquid. did. For each 100 parts by weight of the solid content of this pressure-sensitive adhesive, 250 parts by weight of Hytanol 1501 (a novolac-type alkylphenol resin manufactured by Hitachi Chemical Co., Ltd., with a softening point of 90°C) and dimer resin It is a modified terpene copolymer manufactured by Yushi Kogyo ■, with a viscosity of 3Q,
It is 0OOcps. ] 5 parts of 5 tons of SL were added, and toluene was further added so that the solid content concentration was 60° C. mass %, and the mixture was stirred and dissolved to obtain a hot-melt adhesive liquid. An adhesive tape was produced in the same manner as in Example 1. This will be the sample opening.

Example 3 lauryl peroxide as an initiator.

A monomer mixture of 2-ethylhexyl acrylate/butyl acrylate/acrylic acid in a weight ratio of 40154/6 was copolymerized in toluene at a temperature of 80° C. for 8 hours at a monomer concentration of 60% by weight under a nitrogen stream. An acrylic pressure-sensitive adhesive solution was prepared. Based on 100 parts by weight of the solid content of this pressure-sensitive adhesive, Vetrozin #130 (an aromatic hydrocarbon resin manufactured by Mitsui Petrochemical Industries, Ltd.) has a softening point of 130°C. ]220i
Parts and Picolastic A-50 (styrenic resin manufactured by Vercules, with a softening point of 50°C)
8 oz parts were mixed, toluene was further added so that the solid content concentration was 65% by weight, and the mixture was stirred and dissolved to obtain a hot-melt adhesive liquid.Next, an adhesive tape was prepared in the same manner as in Example 1. Created. This is designated as sample C.

Example 4 Using lauryl peroxide as an initiator, a mixture of butyl 7 acrylate/acrylic acid with a stoichiometric ratio of 9674 was prepared in toluene at a temperature of 80° C. for 8 hours at a monomer concentration of 6011i% under a nitrogen stream. copolymerize,
An acrylic pressure-sensitive adhesive liquid was obtained. For each 100 parts by weight of solids of this pressure-sensitive adhesive, YS resin Px
1,000 parts (a terpene resin manufactured by Anmin Yushi Kogyo V4, which has a softening point of 100°C) and 300 parts of Ester Gum KE-190 (a triethylene glycol ester of modified rosin manufactured by Arayo Kagaku Kogyo Kogyo Co., Ltd.). So, the viscosity is 7
500cpsi? be. ] 880% by weight were mixed, toluene was further added so that the solid content concentration was 70% by weight, and the mixture was stirred and dissolved to obtain a hot-melt adhesive liquid. A tape was made. This is designated as sample 2.

(Pin pullout strength) Test method Tape to be tested (i.e. width 1
A lead wire with a diameter of 0° 5 mm was sandwiched between a 3 mm sample (sample 2 adhesive tape and a commercially available adhesive tape) and a thick kraft paper (width 18 mm) with a width of 1200 g/ln (the product obtained in this way). In other words, the combination in which the lead wire is sandwiched between adhesive tape and kraft paper is called a preliminary sample.), 60℃, 80℃, 100℃, 120℃
Crimping force 10kg/crn'・lse under hot air conditions of
A sample for measurement (in the form of a vertical taping) was prepared by passing the preliminary sample described above between the rubber rolls of c. After 8 melting and pressing, the lead wire was left at room temperature (23° C. x 65% RH) for 30 minutes, and the pull-out strength of the lead wire was measured using an Instron type tensile tester at a tensile speed of 300 mm/min.

Test results The constant M results are shown in Table 1.

Table 1: Pin pullout strength (unit: kg) This is an adhesive tape using a heat-sensitive adhesive made of approximately the same material. (Similarly below) According to the results shown in Table 1, sample 2 of the present invention is 6G-120.
The fusible adhesive is thermally melted (fused) by performing heat-pressing treatment at ℃.

It can be seen that after the heat treatment, the bottle is cooled and becomes adhesive, giving the bottle an extremely high pull-out strength.

(Paper Peeling Test) A thick kraft paper adhesion test was conducted on Sample Il Sample 2 and a commercially available adhesive tape.

Test method and evaluation method 200 K/nf thick kraft paper (18 mm width) and each adhesive tape (13 mm width) were heated at 60.80° and 100°C (hot air) under lokg/crn'・1se.
Heat-sealed between the rubber rolls c and heated to 23°C (65% R
, H) Leave for 30 minutes.

The adhesive tape was pulled strongly by hand, and the state of tearing (peeling) on the surface of the kraft paper was visually determined.

Test Results The test results are shown in Table 2. In Table 2, the following symbols were used.

■ = 100% paper peeled O: 50% to 99% paper peeled Δ: 1% to 49% paper peeled X: 0% paper peeled (not peeled) 2nd: A vs. thick raft Paper adhesion (paper peeling) test According to the results shown in Table 2, the adhesion of sample 2 of the present invention was 6.
It can be seen that it is excellent in heating temperature treatment from 0 to 100°C.

(Blowing/Kinging Properties and High Temperature Retainability) Tests were conducted on blocking properties and high temperature retention properties for Sample Illu Sample 2 and commercially available adhesive tapes. Samples were prepared in the same manner as when measuring pin pullout strength.

Test method 1) After storing the tape at 50° C. for one month, the tape was rewound and the blocking properties at that time were examined.

2) After applying a static load of 500 g to the pin in a dry open at 50°C, the time (minutes) until the pin came out was measured.

Test Results Table 83 shows the test results for blocking properties and high temperature retention properties.

Table 3 shows that the adhesive tape of the present invention has excellent storage durability under high temperatures and does not cause blocking.

It also shows that after heat fusion bonding, it has excellent retention under high temperatures.

Table 3 High temperature (50°C) durability test results Effects of the invention As is clear from the above examples, the heat-fusible adhesive tape according to the present invention can be used in belt taping with heat-fusible adhesive tape at both room temperature and high temperature. Because of its stable properties, it does not cause blocking when the tape is rewound when used, has excellent retention under high temperatures, and has excellent water-immersion adhesion and high adhesion. (That is, to be more specific, the pin pullout strength after heat fusion is high).

Claims (1)

Scope of Claims: (a) Based on 100 parts by weight of the solid content of the acrylic pressure-sensitive adhesive, (b) A softening point of 60°C to 150°C that has good compatibility with the adhesive.
210 to 400 parts by weight of a thermofusible resin with a medium-high softening point of ℃; and (c) a low softening point resin with a softening point of 59℃ or less that has good compatibility with the adhesive, or a room temperature viscosity with a viscosity of 10 to 100,000 cps. A heat-sealable adhesive tape for holding electronic components, which is formed by applying a heat-melting adhesive containing 1 to 100 parts by weight of a liquid resin to a tape base material.