JPS61113225A - Manufacture of chip type element - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method for manufacturing a chip-type device, and more particularly to an improvement in a method for folding and bending metal terminal members of a chip-type device.

[Technical background of the invention and its problems]

In general, for an element such as a solid electrolytic capacitor, after wiring with internal wiring and metal terminal members is completed, the internal wiring of the element is covered and a part of the metal terminal member is sheathed with resin to form the solid electrolytic capacitor element body. This metal terminal member is bent at multiple locations along the outer wall of the resin exterior.
A chip-type solid electrolyte device has been completed.

Next, a conventional method for manufacturing a chip type element will be explained with reference to FIGS. 5 to 7.

First, as shown in FIG.
In addition, a metal terminal member (21), (an element having two
3) flows through the process.

Next, as shown in FIG. 6, the metal terminal member (2υ) of this element (3), (22) on both side walls (i+), and (1t) on both side walls (II).

The first bending point (4+) along (1,), (
4, ), bend the metal terminal members (21) and (zt) so that they are almost parallel.

Next, as shown in FIG. 7, the metal terminal member (2+), (
The bending point (5s) far from the lead-out part of (2z), (5
t), the metal terminals (61) and (6) are bent along the bottom surface (1,) to complete the chip type element (7).

However, the chip type element formed in this way (the force is applied to the metal terminal (61) at the bending point (51) and (st)
l (Even if you bend the tip of f5 as shown in the broken line so that it touches the bottom surface (1,), the metal terminal member (21), (2□
) and the metal terminals (61), (6t) act, and as a result, a gap (8) is formed between the tip of the metal terminal (61), (6) and the bottom (13), resulting in a chip type. Rather than increasing the height of the element (7) (Hl), for example, as shown in Figure 8, two chip-type elements (7+) and (7t) are connected to both metal terminals through a gap (8). (611) and (64) become entangled, deforming these metal terminals (ss) and (64), and causing the chip type element (
71) and (72) were often defective.

[Purpose of the invention]

The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a method for manufacturing a chip-type element that can reduce the height from a metal terminal and is extremely unlikely to have a defective shape. .

[Summary of the invention]

That is, the present invention provides a chip-type element in which a metal terminal is formed at the end of a metal terminal member which is derived from a resin-sheathed element body and which has been subjected to bending stress at a plurality of locations along the outer wall of the element body. In the manufacturing method, a first step of performing a VC first bending process in a direction opposite to the direction in which the metal terminal member near the lead-out portion from the element body is finally bent;
This method of manufacturing a chip-type device is characterized by comprising a second step of sequentially bending the metal terminal member from a bending portion that is farther from the lead-out portion from the device body.

[Embodiments of the invention]

Next, an embodiment of the method for manufacturing a chip-type device according to the present invention will be briefly described with reference to FIGS. 1 to 4.

First, as shown in FIG. 1, an element αy having metal terminal members (121) and (tzz) led out in a direction perpendicular to both side walls (111) and (11t) of an element body αυ coated with resin is passed through the process. It's coming.

Next, as shown in Fig. 2, the metal terminal members (12□) and (12t) of this element α are bent at an angle (b) in the opposite direction to the direction in which they are finally bent from near the element body αυ. The first step is to perform the bending process. This angle (
α) is determined by taking into account the metal terminal member (12t), the spring dispersion of the (12t), the amount of warping, etc.

Next, as shown in FIG. 3, metal terminal members (121) (1
The bent part (1
5,), (15yi) to almost both side walls (lit)y(li
t) Perform the first stage of the second step of bending by an angle (θ) so as to be parallel to the VC to form a metal terminal (ll1g) + (16t). Similar to the previous angle (α), this angle (θ) also has metal terminal members (121), (1
The angle should be made slightly acute considering the amount of springback of zt).

Next, as shown in FIG. 4, a metal terminal member (121).

(12y) is bent along both side walls (11+) and (1it) at the first bending point (141) and (t4x) so that the metal terminal members (1zt) and (1zt) are almost parallel to each other. Process.

The latter stage is performed to complete the chip type element αη.

By performing this process, metal terminals (161) (1
The tip of the element (62) is arranged so as to slide on the bottom surface (11s) of the element (131), and the angle (θ) is almost a right angle, but since it is deformed to an acute angle, the height of the chip type element αη (
H8) can be lowered, and a chip-type element with good quality can be obtained without creating a gap between the tip of the metal terminal (161), (tst) and the bottom surface (lls) as in the conventional case.

〔Effect of the invention〕

As described above, according to the manufacturing method of the present invention, it is possible to provide a chip type element with extremely good quality.

[Brief explanation of drawings]

1 to 4 are explanatory side views showing a method for manufacturing a chip-type device according to the present invention in order of process, and FIGS. 5 to 7 are side views showing a conventional method for manufacturing a chip-type device in order of process. FIG. 8 is an explanatory diagram showing the intertwining of metal terminals. 1.11...Element body 11112 g 111
+ 112...Both sides 1, , 11. ...Bottom surface 2+, 2t, 12+, 12z...Metal terminal member 3.13...Element 4114+51 +5t+ 14t H142,1s,
, 151...Bending portions 6□, 6y, 6s, 64.
16t, 16t...metal terminal 7, 7. ,7□,1
7... Chip type element 8... Gap

Claims (1)

[Claims] In a method for manufacturing a chip-type element having a metal terminal at an end of a metal terminal member which is derived from a resin-sheathed element body and is bent at a plurality of locations along the outer wall of the element body, A first step of performing a first bending process in a direction opposite to the final bending direction near the lead-out part from the element main body, and sequentially from the bending part farther from the lead-out part from the element main body of the metal terminal member. A method for manufacturing a chip-type element, characterized by comprising a second step of performing a bending process.