JPS61106026U - - Google Patents

Info

Publication number
JPS61106026U
JPS61106026U JP19107084U JP19107084U JPS61106026U JP S61106026 U JPS61106026 U JP S61106026U JP 19107084 U JP19107084 U JP 19107084U JP 19107084 U JP19107084 U JP 19107084U JP S61106026 U JPS61106026 U JP S61106026U
Authority
JP
Japan
Prior art keywords
wafer
jig
heat treatment
guide groove
treatment jig
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19107084U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19107084U priority Critical patent/JPS61106026U/ja
Publication of JPS61106026U publication Critical patent/JPS61106026U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図aないし第1図cは本考案を適用したウ
エハ熱処理治具の一実施例を示すものであり、第
1図aは平面図、第1図bは側面図、第1図cは
正面図である。第2図は第1図aのA―A線にお
ける断面図である。第3図は本考案の他の実施例
を示す正面図である。 1…ウエハ熱処理治具、2…ウエハ支持棒、3
…ウエハ案内溝、4…連結板、7…ウエハ、11
…第1の薄板(底面)、12…第2の薄板(後端
)、13…第3の薄板(前端)。
Figures 1a to 1c show an embodiment of a wafer heat treatment jig to which the present invention is applied, in which Figure 1a is a plan view, Figure 1b is a side view, and Figure 1c is a side view. It is a front view. FIG. 2 is a sectional view taken along line AA in FIG. 1a. FIG. 3 is a front view showing another embodiment of the present invention. 1... Wafer heat treatment jig, 2... Wafer support rod, 3
...Wafer guide groove, 4...Connecting plate, 7...Wafer, 11
...First thin plate (bottom surface), 12... Second thin plate (rear end), 13... Third thin plate (front end).

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ウエハ案内溝が穿設された支持棒を備え、ウエ
ハを熱処理する際に上記ウエハ案内溝にウエハを
立てた状態で支持する治具であつて、この治具の
底面と少なくとも治具の挿入方向の前端及び後端
に薄板を設けてなるウエハ熱処理治具。
A jig that is equipped with a support rod in which a wafer guide groove is drilled, and that supports the wafer in an upright position in the wafer guide groove when heat-treating the wafer, the bottom surface of the jig and at least the insertion direction of the jig. A wafer heat treatment jig with thin plates installed at the front and rear ends of the wafer heat treatment jig.
JP19107084U 1984-12-17 1984-12-17 Pending JPS61106026U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19107084U JPS61106026U (en) 1984-12-17 1984-12-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19107084U JPS61106026U (en) 1984-12-17 1984-12-17

Publications (1)

Publication Number Publication Date
JPS61106026U true JPS61106026U (en) 1986-07-05

Family

ID=30748512

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19107084U Pending JPS61106026U (en) 1984-12-17 1984-12-17

Country Status (1)

Country Link
JP (1) JPS61106026U (en)

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