JPS61104585U - - Google Patents
Info
- Publication number
- JPS61104585U JPS61104585U JP18903384U JP18903384U JPS61104585U JP S61104585 U JPS61104585 U JP S61104585U JP 18903384 U JP18903384 U JP 18903384U JP 18903384 U JP18903384 U JP 18903384U JP S61104585 U JPS61104585 U JP S61104585U
- Authority
- JP
- Japan
- Prior art keywords
- divided part
- printed circuit
- divided
- part formed
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 230000004907 flux Effects 0.000 claims 1
- 230000002265 prevention Effects 0.000 claims 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Molten Solder (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18903384U JPS61104585U (no) | 1984-12-13 | 1984-12-13 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18903384U JPS61104585U (no) | 1984-12-13 | 1984-12-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61104585U true JPS61104585U (no) | 1986-07-03 |
Family
ID=30746492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18903384U Pending JPS61104585U (no) | 1984-12-13 | 1984-12-13 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61104585U (no) |
-
1984
- 1984-12-13 JP JP18903384U patent/JPS61104585U/ja active Pending
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