JPS611041A - 沸騰冷媒式冷却装置 - Google Patents

沸騰冷媒式冷却装置

Info

Publication number
JPS611041A
JPS611041A JP59121018A JP12101884A JPS611041A JP S611041 A JPS611041 A JP S611041A JP 59121018 A JP59121018 A JP 59121018A JP 12101884 A JP12101884 A JP 12101884A JP S611041 A JPS611041 A JP S611041A
Authority
JP
Japan
Prior art keywords
refrigerant
heat transfer
frame
boiling
transfer fins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59121018A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0329181B2 (OSRAM
Inventor
Atsushi Kanda
篤 神田
Kazuo Kitani
一夫 木谷
Kiichirou Shirai
白井　祺一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Precision Products Co Ltd
Fuji Electric Co Ltd
Original Assignee
Sumitomo Precision Products Co Ltd
Fuji Electric Co Ltd
Fuji Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Precision Products Co Ltd, Fuji Electric Co Ltd, Fuji Electric Manufacturing Co Ltd filed Critical Sumitomo Precision Products Co Ltd
Priority to JP59121018A priority Critical patent/JPS611041A/ja
Publication of JPS611041A publication Critical patent/JPS611041A/ja
Publication of JPH0329181B2 publication Critical patent/JPH0329181B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W40/73—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP59121018A 1984-06-13 1984-06-13 沸騰冷媒式冷却装置 Granted JPS611041A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59121018A JPS611041A (ja) 1984-06-13 1984-06-13 沸騰冷媒式冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59121018A JPS611041A (ja) 1984-06-13 1984-06-13 沸騰冷媒式冷却装置

Publications (2)

Publication Number Publication Date
JPS611041A true JPS611041A (ja) 1986-01-07
JPH0329181B2 JPH0329181B2 (OSRAM) 1991-04-23

Family

ID=14800765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59121018A Granted JPS611041A (ja) 1984-06-13 1984-06-13 沸騰冷媒式冷却装置

Country Status (1)

Country Link
JP (1) JPS611041A (OSRAM)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5559366A (en) * 1994-08-04 1996-09-24 Micron Technology, Inc. Lead finger tread for a semiconductor lead package system
US6076596A (en) * 1996-03-14 2000-06-20 Denso Corporation Cooling apparatus for high-temperature medium by boiling and condensing refrigerant
US6148905A (en) * 1999-04-30 2000-11-21 Motorola, Inc. Two-phase thermosyphon including air feed through slots
WO2020057306A1 (zh) * 2018-09-21 2020-03-26 浙江嘉熙科技有限公司 大功率热超导板翅组合式散热器

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5559366A (en) * 1994-08-04 1996-09-24 Micron Technology, Inc. Lead finger tread for a semiconductor lead package system
US6076596A (en) * 1996-03-14 2000-06-20 Denso Corporation Cooling apparatus for high-temperature medium by boiling and condensing refrigerant
US6148905A (en) * 1999-04-30 2000-11-21 Motorola, Inc. Two-phase thermosyphon including air feed through slots
WO2020057306A1 (zh) * 2018-09-21 2020-03-26 浙江嘉熙科技有限公司 大功率热超导板翅组合式散热器

Also Published As

Publication number Publication date
JPH0329181B2 (OSRAM) 1991-04-23

Similar Documents

Publication Publication Date Title
US4705102A (en) Boiling refrigerant-type cooling system
US4461343A (en) Plated heat pipe
US7700233B2 (en) Battery and method of producing the same
EP0753713B1 (en) Method of manufacturing tunnel-plate type heat pipes
CN105977213B (zh) 陶瓷封装、电子器件装置及其制造方法
US20010022219A1 (en) Plate type heat pipe and its mounting structure
US5321888A (en) Integrated lightweight card rack
CN102484223A (zh) 带有框架的伽伐尼电池和其制造方法
JP2010067582A (ja) バッテリ
JPS611041A (ja) 沸騰冷媒式冷却装置
KR100755572B1 (ko) 판형 열전달 장치의 케이스 접합 방법 및 그 방법에 의해제조된 장치
KR20070003847A (ko) 각형 충전 배터리 및 그 제조방법
CA1245756A (en) Transformer cooling structure with u-shaped cooling panels
JPS59131888A (ja) 熱交換器およびその製造方法
CN118718660A (zh) 气体分子吸附装置及其装配方法
JP3953741B2 (ja) 沸騰冷却器及びその製造方法
JP2573351Y2 (ja) 真空断熱パネル
TWI913804B (zh) 刀刃型均溫板結構及其製作方法
CN223726919U (zh) 立体均温板接合结构
JP2014163583A (ja) 熱交換器の製造方法
JPH0335992Y2 (OSRAM)
GB2090775A (en) Manufacture of freezer compartment
US2098746A (en) Arrangement in condensers
JPS58112307A (ja) 油入電気機器用タンクの製造方法
JPH039320Y2 (OSRAM)