JPS61103969A - Water-soluble glue - Google Patents

Water-soluble glue

Info

Publication number
JPS61103969A
JPS61103969A JP22519784A JP22519784A JPS61103969A JP S61103969 A JPS61103969 A JP S61103969A JP 22519784 A JP22519784 A JP 22519784A JP 22519784 A JP22519784 A JP 22519784A JP S61103969 A JPS61103969 A JP S61103969A
Authority
JP
Japan
Prior art keywords
cmc
water
degree
glue
starch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22519784A
Other languages
Japanese (ja)
Inventor
Takeo Omiya
大宮 武夫
Akihiko Fujita
明彦 藤田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daicel Corp
Original Assignee
Daicel Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Chemical Industries Ltd filed Critical Daicel Chemical Industries Ltd
Priority to JP22519784A priority Critical patent/JPS61103969A/en
Publication of JPS61103969A publication Critical patent/JPS61103969A/en
Pending legal-status Critical Current

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  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE:A water-soluble glue that contains an alkali metal salt of CMC with more than a specific value of substitution degree, thus being suitable for use as a paper-coating agent, a variety of adhesive and cloth starch. CONSTITUTION:The objective glue contains an alkali metal salt, preferably sodium salt, of CMC with an average degree of substitution (DS) of more than 1.2, preferably more than 1.4. The degree of polymerization in CMC is preferably about 20-200 (rather low degree), when a glue of high solid concentration is desired and advantageously about 200-2,000 (high degree), when a high viscosity is desired in a low concentration.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、平均置換度(以下DSと略称す6)12以上
のカルボキンメチルセルロースのアルカリ金属塩を含有
することを特徴とする耐腐敗性及び接着性の優れた水溶
性糊料に関するものである。
Detailed Description of the Invention (Industrial Application Field) The present invention provides a rot-resistant product characterized by containing an alkali metal salt of carboquine methyl cellulose having an average degree of substitution (hereinafter abbreviated as DS) of 12 or more. The present invention also relates to a water-soluble paste with excellent adhesive properties.

水溶性糊料は製紙工業界におけるコーティング剤、内面
添加剤、壁紙接着剤、合板接着剤、段ポールコルゲ−タ
− および事務用または学習用紙接着剤等に広く一般に使用
されている。
Water-soluble adhesives are widely used in the paper industry as coating agents, interior additives, wallpaper adhesives, plywood adhesives, corrugated pole corrugators, office or educational paper adhesives, and the like.

(従来技術) この水溶性糊料としては古くから小麦澱粉コ.ンスター
千等の未変性澱粉および加工澱粉エーテル化澱粉等の変
性澱粉が大量に使用されていたが、未変性澱粉について
は溶解時に加熱処理を行なう必要があり、変性澱粉?こ
ついては変性時に生成する低分子量澱粉等の水可溶性分
によって排水のCODが大きくなる等の問題点がある。
(Prior art) Wheat starch has long been used as this water-soluble thickener. Large amounts of unmodified starch such as Nstar Sen and modified starch such as modified starch etherified starch were used, but unmodified starch requires heat treatment during dissolution. A problem with this is that the COD of wastewater increases due to water-soluble components such as low molecular weight starch produced during denaturation.

更に、これらの澱粉系糊剤は糊料調製後の保存時に腐敗
し易いという°大きな欠点がある。この腐敗を防止する
ためホルムアルデヒド等の種々の防腐剤が添加されてい
るが、その効果は十分ではなく、さらに防腐剤は有害な
ものが多いことから新たな問題点となっている。従って
最近溶解が容易で、耐腐敗性の優れているポリビニルア
ルコール(PVA)、ポリエチレンオキサイド及びポリ
アクリル酸ソーダ等の合成高分子系糊剤が澱粉系糊剤に
代って主流となりつつある。
Furthermore, these starch-based thickening agents have a major drawback in that they are susceptible to spoilage during storage after preparing the thickening agent. Various preservatives such as formaldehyde are added to prevent this spoilage, but their effectiveness is not sufficient, and many of the preservatives are harmful, creating a new problem. Therefore, synthetic polymer-based glues such as polyvinyl alcohol (PVA), polyethylene oxide, and sodium polyacrylate, which are easy to dissolve and have excellent spoilage resistance, have recently become mainstream in place of starch-based glues.

一方、セルロース誘導体の水溶性糊剤とし゛ ・−  
         ゛ てはカルボキンメチルセルロース(CM Cト略称)ヒ
ドロキシエチルセルロ−ス メチルセルロース(MC)等があるが、上記の用途には
D S 0. 6〜LO程度のCMCが一部使用されて
いる。このCMCは、冷水に溶解しさらに澱粉系糊剤に
比し若干耐腐敗性があり、且つ増粘効果が大きい等の長
所があるが、澱粉系糊剤等に比し接着性が劣り゛まだ合
成高分子系糊剤に比し耐腐敗性が劣るため、一部の使用
にとどまっている。しかし、CMCは少量の添加で大き
な増粘効果があり接着後、フィルム化した時の引張強度
が大きい等の長所がある。
On the other hand, as a water-soluble glue made of cellulose derivatives,
Examples include carboxyl methylcellulose (CMC), hydroxyethylcellulose methylcellulose (MC), etc., but for the above uses, DS0. CMC of about 6 to LO is partially used. This CMC has the advantage of being soluble in cold water, slightly more rot resistant than starch-based glues, and has a greater thickening effect, but its adhesive properties are still inferior to starch-based glues. Because it has inferior rot resistance compared to synthetic polymer adhesives, it is only used in some cases. However, CMC has advantages such as a large thickening effect even when added in a small amount, and high tensile strength when formed into a film after adhesion.

これらの特長は、CMCの分子構造が直鎖状の剛直な構
造をしているのに対してPVA等の合成高分子系の糊料
は屈曲性の分子構造を有していることに基因するものと
考えられる。また、CMCは原料がセルロースでアリ主
な被接着物である紙との親和性が優れており、さらに、
人体に対して無害である等の特長も有している。
These features are due to the fact that the molecular structure of CMC is linear and rigid, whereas synthetic polymer adhesives such as PVA have a flexible molecular structure. considered to be a thing. In addition, CMC is made of cellulose and has excellent compatibility with paper, which is the main adherend.
It also has features such as being harmless to the human body.

(発明の目的) これらのCMCの特長を活かし欠点である接着性及び腐
敗性を改良した水溶性糊料の開発を目指して鋭意検討し
た結果本発明に至ったものである。
(Purpose of the Invention) The present invention was achieved as a result of intensive studies aimed at developing a water-soluble paste that takes advantage of these features of CMC and improves its disadvantages of adhesiveness and perishability.

(発明の構成及び効果) 本発明は、平均置換度(DS )12以上,、好しくは
L4以上のCMCよりなる耐腐敗性及び接で性の優れた
水溶性糊料に関するものである。このようにCMCのD
Sを12以上好しくはL4以上とすることによって耐腐
敗性は著しく向上するばかりではなく、接着性も著しく
向上することを見出した。
(Structure and Effects of the Invention) The present invention relates to a water-soluble paste having excellent spoilage resistance and adhesion properties and made of CMC having an average degree of substitution (DS) of 12 or more, preferably L4 or more. In this way, CMC's D
It has been found that by setting S to 12 or more, preferably L4 or more, not only the rot resistance is significantly improved, but also the adhesiveness is significantly improved.

従来のCMCはカビ等の産生ずるセルラーゼによって比
較的容易に腐敗分解される欠点を有していたが、DSを
L2以上好しくはL4以上とすることによりCMCの分
子構造中のセルラーゼによって分解され易い箇所と考え
られる未置換無水グルコース単位の数を少なくすること
によって耐腐敗性が向上したものと考えられる◇ さらに、接着性が向上した理由−こついては明確ではな
いが、CMCの水溶性及び接着性に密接に関係している
と考えられるカルボキンメチル基の分子中の密度が高く
なることによると考えられる。
Conventional CMC has the disadvantage of being relatively easily putrefied and decomposed by cellulases produced by mold, etc., but by setting the DS to L2 or more, preferably L4 or more, CMC can be decomposed by cellulases in the molecular structure of CMC. It is thought that the rot resistance was improved by reducing the number of unsubstituted anhydroglucose units, which are considered to be easy points. ◇ Furthermore, the reason for the improved adhesion - although the reason is not clear, it is due to the water solubility and adhesion of CMC. This is thought to be due to the increased density of carboxine methyl groups in the molecule, which is thought to be closely related to sex.

なお、本発明のCMCはナトリウム、カリウム、リチウ
ム、セシウム及びルビジウムの各項のいずれでもその効
果を発揮するが、ナトリウム塩が最も経済的で有利であ
る。  1また、本発明のCMCの重合度については特
に制限はないが、固形分濃度の高い糊が必要な場合は約
2 0 − ! 2 0 0の低重合度のものが有利で
あり、一方、少量で高い粘性を出したいときは約200
〜2000の高重合度のものが有利である。
Although the CMC of the present invention exhibits its effects with any of sodium, potassium, lithium, cesium, and rubidium, sodium salt is the most economical and advantageous. 1. There is no particular limit to the degree of polymerization of the CMC of the present invention, but if a glue with a high solid content concentration is required, it may be about 20-! A low polymerization degree of 200 is advantageous, while a polymerization degree of about 200 is advantageous when high viscosity is desired in a small amount.
High degrees of polymerization of ˜2000 are preferred.

このように、本発明のCMCは、従来のCMCの特長を
活かし、さらに従来のCMCのと 欠点されていた耐腐敗性及び接着性をも改良式 することにより、紙のコーティング剤及び内面添加剤、
壁紙接着剤、合板接着剤、段ポールコルゲータ−用接着
剤、洗濯糊および事務用または学習用紙接着剤等の水溶
性糊料としての有用な糊料を提供するものである。
In this way, the CMC of the present invention takes advantage of the features of conventional CMC, and also improves the rot resistance and adhesiveness, which were disadvantageous compared to conventional CMC. ,
The present invention provides a glue useful as a water-soluble glue such as a wallpaper adhesive, a plywood adhesive, a corrugator adhesive, a laundry paste, and an office or study paper adhesive.

また、本発明のCMCは、従来から水溶性糊剤として使
用されている澱粉系糊剤および合成高分子系糊剤と併用
して上記の用途に使用することも可能である。
Furthermore, the CMC of the present invention can be used in the above-mentioned applications in combination with starch-based sizing agents and synthetic polymer-based sizing agents that have been conventionally used as water-soluble sizing agents.

また、本発明のCMCはリコター又はパルプ等のセルロ
ース質原料に苛性ソーダおよびモノクロル酢酸等のエー
テル化剤を作用させて製造されるが、DS12以上特に
DSL4以上の高DSCMCは本発明者が開発した方法
(特開昭58−45201及び特開昭−58−1762
02)により工業的に容易に製造できる。
Furthermore, the CMC of the present invention is produced by reacting cellulosic raw materials such as ricotta or pulp with an etherifying agent such as caustic soda and monochloroacetic acid, but high DSCMC with a DS of 12 or more, particularly a DSL of 4 or more, is produced by a method developed by the present inventor. (JP-A-58-45201 and JP-A-58-1762
02) can be easily produced industrially.

(実施例) 次に本発明の実施例を記すが本発明は以下の実施例に限
定されるものではない。また、実施例及び比較例中の部
又は%は重重基準を示す。
(Examples) Next, examples of the present invention will be described, but the present invention is not limited to the following examples. In addition, parts and percentages in Examples and Comparative Examples are based on weight.

実施例 1                  比1
容量500−の円筒型ガラス容器に水380部を仕込み
、攪拌機で攪拌しながら置換度(DS)123重合度4
60のCMC20部を少量づつ添加し2時間攪拌して溶
解し、粘度2100 cps (25℃)の糊を得た。
Example 1 Ratio 1
Pour 380 parts of water into a 500-volume cylindrical glass container, and while stirring with a stirrer, the degree of substitution (DS) is 123 and the degree of polymerization is 4.
60 CMC was added little by little and dissolved by stirring for 2 hours to obtain a paste with a viscosity of 2100 cps (25°C).

この糊を50部とり上質紙にパーコーター五8で塗布し
、上質糺を貼合せてゴムローラーで圧締後100℃で5
分間乾燥後の接着性を測定し、第1表にまとめた。
Take 50 parts of this glue and apply it to high-quality paper using a Percoater 58, paste the high-quality glue, press it with a rubber roller, and heat it at 100℃ for 50 minutes.
Adhesion after drying for minutes was measured and summarized in Table 1.

また残りの糊をバラフィルムでノールして25℃の空調
室に静置し、1ケ月後の腐敗状況を調べるとともに粘度
測定を行ない、それらを第1表にまとめた。
Further, the remaining glue was covered with loose film and left to stand in an air-conditioned room at 25°C, and after one month, the state of decay was examined and the viscosity was measured, and the results are summarized in Table 1.

実施例2〜5及び比較例1〜2 実施例1に用いたCMCの代りt′!″、DS及び重合
度の異なるCMCを使用しさらに水及びCMCの使用量
の異なるものを実施例2〜5及び比較例1〜2としそれ
らを第1表にまとめた。
Examples 2 to 5 and Comparative Examples 1 to 2 Instead of CMC used in Example 1, t'! Examples 2 to 5 and Comparative Examples 1 to 2 are summarized in Table 1, using CMCs with different DS and polymerization degrees, and with different amounts of water and CMC.

較例 3 実施例1のCMCの代りにエーテル化とうもろこし澱粉
(商品名ユニークガムC−3010、松谷化学工業製)
を使用したものを第1表にまとめた。
Comparative Example 3 Etherified corn starch (trade name Unique Gum C-3010, manufactured by Matsutani Chemical Industry) in place of CMC in Example 1
Those using are summarized in Table 1.

第1表から明らかのように本発明のDS12以上のCM
Cは従来のCMC及びエーテル化澱粉に比し耐腐敗性が
優れている。
As is clear from Table 1, commercials with a DS of 12 or higher according to the present invention
C has superior spoilage resistance compared to conventional CMC and etherified starch.

また接着性においても、従来のCMCより優れているば
かりではなく、エーテル化澱粉に比し低濃度で高粘度の
糊料が得られ且つ低濃度でも優°れた接着性を有してい
る。
Furthermore, in terms of adhesiveness, it is not only superior to conventional CMC, but also provides a thickening agent with a high viscosity at a lower concentration than etherified starch, and has excellent adhesiveness even at a low concentration.

j・ 接着性:糊剤50部を上質紙にバーコーター瓜8で塗布
し上質紙を貼合せて ゴムローラーで圧締後100℃で 5分間乾燥し、180°剥離した場 合の紙破状況を次の如く評価した。
j. Adhesiveness: Apply 50 parts of glue to high-quality paper using Bar Coater 8, laminate the high-quality paper, press with a rubber roller, dry at 100℃ for 5 minutes, and check the paper breakage when peeled 180°. It was evaluated as follows.

紙破率 100%    0 紙破率 99〜90%  ○ 紙破率 80〜89%  Δ 紙破率 79%以下   ×Paper tear rate 100% 0 Paper tear rate 99-90% ○ Paper tear rate 80-89% Δ Paper tear rate: 79% or less ×

Claims (1)

【特許請求の範囲】[Claims] 平均置換度12以上のカルボキシメチルセルロースのア
ルカリ金属塩を含有することを特徴とする水溶性糊料。
A water-soluble paste containing an alkali metal salt of carboxymethyl cellulose having an average degree of substitution of 12 or more.
JP22519784A 1984-10-26 1984-10-26 Water-soluble glue Pending JPS61103969A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22519784A JPS61103969A (en) 1984-10-26 1984-10-26 Water-soluble glue

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22519784A JPS61103969A (en) 1984-10-26 1984-10-26 Water-soluble glue

Publications (1)

Publication Number Publication Date
JPS61103969A true JPS61103969A (en) 1986-05-22

Family

ID=16825490

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22519784A Pending JPS61103969A (en) 1984-10-26 1984-10-26 Water-soluble glue

Country Status (1)

Country Link
JP (1) JPS61103969A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005108833A (en) * 2003-10-01 2005-04-21 Samsung Sdi Co Ltd Carboxymethyl cellulose-based bond and lithium cell using the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5845201A (en) * 1981-09-10 1983-03-16 Daicel Chem Ind Ltd Preparation of carboxymethylcellulose ether alkali salt

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5845201A (en) * 1981-09-10 1983-03-16 Daicel Chem Ind Ltd Preparation of carboxymethylcellulose ether alkali salt

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005108833A (en) * 2003-10-01 2005-04-21 Samsung Sdi Co Ltd Carboxymethyl cellulose-based bond and lithium cell using the same
CN100457848C (en) * 2003-10-01 2009-02-04 三星Sdi株式会社 Carboxymethyl cellulose-based binder material and lithium battery using the same
US7531272B2 (en) 2003-10-01 2009-05-12 Samsung Sdi Co., Ltd. Carboxymethyl cellulose-based binder material and lithium battery using the same
JP4594012B2 (en) * 2003-10-01 2010-12-08 三星エスディアイ株式会社 Carboxymethylcellulose binder and lithium battery using the same

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