JPS61100192U - - Google Patents
Info
- Publication number
- JPS61100192U JPS61100192U JP18505184U JP18505184U JPS61100192U JP S61100192 U JPS61100192 U JP S61100192U JP 18505184 U JP18505184 U JP 18505184U JP 18505184 U JP18505184 U JP 18505184U JP S61100192 U JPS61100192 U JP S61100192U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- sealed
- resin
- semiconductor chip
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002787 reinforcement Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Electric Clocks (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18505184U JPS61100192U (enExample) | 1984-12-07 | 1984-12-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18505184U JPS61100192U (enExample) | 1984-12-07 | 1984-12-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61100192U true JPS61100192U (enExample) | 1986-06-26 |
Family
ID=30742534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18505184U Pending JPS61100192U (enExample) | 1984-12-07 | 1984-12-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61100192U (enExample) |
-
1984
- 1984-12-07 JP JP18505184U patent/JPS61100192U/ja active Pending