JPS61100168U - - Google Patents

Info

Publication number

JPS61100168U

JPS61100168U JP18581984U JP18581984U JPS61100168U JP S61100168 U JPS61100168 U JP S61100168U JP 18581984 U JP18581984 U JP 18581984U JP 18581984 U JP18581984 U JP 18581984U JP S61100168 U JPS61100168 U JP S61100168U

Authority

JP

Japan

Prior art keywords

copper foil

connection

resist film

solder resist

conductive paint

Prior art date

1984-12-06

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
• 239000003973 paint Substances 0.000 claims description 3
• 229910000679 solder Inorganic materials 0.000 claims description 3
• 239000000758 substrate Substances 0.000 claims description 2
• 239000011889 copper foil Substances 0.000 claims 4
• 238000005530 etching Methods 0.000 claims 1
• 238000010586 diagram Methods 0.000 description 1

Cited By (1)