JPS61100135U - - Google Patents

Info

Publication number
JPS61100135U
JPS61100135U JP18590484U JP18590484U JPS61100135U JP S61100135 U JPS61100135 U JP S61100135U JP 18590484 U JP18590484 U JP 18590484U JP 18590484 U JP18590484 U JP 18590484U JP S61100135 U JPS61100135 U JP S61100135U
Authority
JP
Japan
Prior art keywords
wire
spring plate
spring
spring pressure
clamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18590484U
Other languages
English (en)
Japanese (ja)
Other versions
JPH025535Y2 (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18590484U priority Critical patent/JPH025535Y2/ja
Publication of JPS61100135U publication Critical patent/JPS61100135U/ja
Application granted granted Critical
Publication of JPH025535Y2 publication Critical patent/JPH025535Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Wire Bonding (AREA)
JP18590484U 1984-12-07 1984-12-07 Expired JPH025535Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18590484U JPH025535Y2 (enExample) 1984-12-07 1984-12-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18590484U JPH025535Y2 (enExample) 1984-12-07 1984-12-07

Publications (2)

Publication Number Publication Date
JPS61100135U true JPS61100135U (enExample) 1986-06-26
JPH025535Y2 JPH025535Y2 (enExample) 1990-02-09

Family

ID=30743363

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18590484U Expired JPH025535Y2 (enExample) 1984-12-07 1984-12-07

Country Status (1)

Country Link
JP (1) JPH025535Y2 (enExample)

Also Published As

Publication number Publication date
JPH025535Y2 (enExample) 1990-02-09

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