JPS6099537U - ワイヤボンダ用ツ−ル - Google Patents

ワイヤボンダ用ツ−ル

Info

Publication number
JPS6099537U
JPS6099537U JP1983191826U JP19182683U JPS6099537U JP S6099537 U JPS6099537 U JP S6099537U JP 1983191826 U JP1983191826 U JP 1983191826U JP 19182683 U JP19182683 U JP 19182683U JP S6099537 U JPS6099537 U JP S6099537U
Authority
JP
Japan
Prior art keywords
chamfer
wire
diameter
wire bonder
honda
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983191826U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0142349Y2 (enrdf_load_stackoverflow
Inventor
十三男 小林
博 丑木
門沢　元昭
Original Assignee
株式会社　新川
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社　新川 filed Critical 株式会社　新川
Priority to JP1983191826U priority Critical patent/JPS6099537U/ja
Publication of JPS6099537U publication Critical patent/JPS6099537U/ja
Application granted granted Critical
Publication of JPH0142349Y2 publication Critical patent/JPH0142349Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1983191826U 1983-12-13 1983-12-13 ワイヤボンダ用ツ−ル Granted JPS6099537U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983191826U JPS6099537U (ja) 1983-12-13 1983-12-13 ワイヤボンダ用ツ−ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983191826U JPS6099537U (ja) 1983-12-13 1983-12-13 ワイヤボンダ用ツ−ル

Publications (2)

Publication Number Publication Date
JPS6099537U true JPS6099537U (ja) 1985-07-06
JPH0142349Y2 JPH0142349Y2 (enrdf_load_stackoverflow) 1989-12-12

Family

ID=30412988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983191826U Granted JPS6099537U (ja) 1983-12-13 1983-12-13 ワイヤボンダ用ツ−ル

Country Status (1)

Country Link
JP (1) JPS6099537U (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6325269B1 (en) * 1997-12-19 2001-12-04 Toto Ltd. Wire bonding capillary

Also Published As

Publication number Publication date
JPH0142349Y2 (enrdf_load_stackoverflow) 1989-12-12

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