JPS6098755A - Optical sensor - Google Patents

Abstract

PURPOSE:To improve the yield by increasing the distance between an end picture element of a sensor board of a contact type optical sensor and a connecting end face of the board. CONSTITUTION:The connecting end face 3a of the board 1a of each optical sensor is formed obliquely to the arrangement 2a of picture elements and shows a trapezoidal form as a whole and the arrangement 2a is shifted toward the long side by 2mm. from the center line 5 of the trapezoidal form. In arranging and interconnecting the sensor boards 1a, the picture element arrangement 2a is in zigzag alternately at each adjacent boards 1a. The reading position of the optical sensors are formed on a line on this paper by combining plural fiber plates 7 incorporating an optical fiber 8 or ''Selfoc'' lenses corresponding to the zigzag arrangement. Thus, the distance between the board end face 3a and the end picture element 4 is increased.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to an optical sensor in which a plurality of substrates are connected and extended in the main scanning line direction, so that reading defects do not occur at connection points.

[Background of the invention]

When manufacturing a close-contact-dimensional optical sensor that is long in the main scanning line direction, it is difficult or uneconomical to manufacture a long one with a single substrate, so multiple sensor substrates are connected in the direction of the sensor's pixel arrangement. Was.

Conventionally, when manufacturing such an optical sensor, as shown in FIG. 1, the end face of each sensor substrate was cut and polished perpendicular to the pixel arrangement direction, and then connected to an adjacent substrate. In this case, for example, if the pixel pitch is 125 μm and the size of one pixel is 100 μm, the margin between pixels is 125-100=2
5 μm, and the distance between the connection end surface and the pixel is 10 to 20 μm.
It was necessary to keep it at m. For this reason, there is a drawback that precision polishing is required and the characteristics of pixels located near the end face are deteriorated during polishing.

In addition, in FIG. 1, 1 is a sensor substrate, 2 is a pixel arrangement (array), and 3 is a connection end surface.

(Object of the Invention) The object of the present invention is to avoid the above-mentioned drawbacks, to provide a large distance between the end surface of the substrate and the end pixels, and to enable reading when a plurality of sensor substrates are connected to form one long sensor. An object of the present invention is to provide a contact type dimensional optical sensor that is free from defects.

[Summary of the invention]

In order to achieve the above object, in the present invention, the direction of the connecting end surface of each optical sensor diagonally intersects with the main scanning line direction, and the pixel arrangement position of the optical sensor is arranged on the sub-scanning line for each sensor board. A staggered arrangement was created in which the positions were alternately shifted in the direction. In this case, in response to the staggered arrangement of the sensor's pixel arrangement position, the reading position of the optical sensor forms a straight line on the paper by combining multiple optical fiber plates with diagonally built-in optical fibers or SELFOC lenses. With this configuration, it is possible to overlap the reading positions of edge pixels between adjacent substrates on the paper surface, and the distance between the edge pixels of the substrate and the edge pixels can be made sufficiently large. You can take it.

[Embodiments of the invention]

Hereinafter, the present invention will be explained in more detail with reference to the drawings.

FIG. 2 is a diagram showing one embodiment of the present invention, in which 1a is a sensor board, 2
a is a pixel array, and 3a is a connection end surface.

The sensor substrate 1a has a connection end surface 3a oblique to the pixel array 2a, and has a trapezoidal shape as a whole. The pixel array 2a is offset from the center line of the trapezoid by 2 lengths on the long side,
When the sensor substrates are arranged and connected as shown in FIG. 2, the pixel arrays 2a are alternately arranged in a staggered manner for each adjacent substrate. The original to be read here is sent in the sub-scanning line direction perpendicular to the pixel array, but if a straight line is drawn in the sub-scanning line direction from the position of the end pixel of the pixel array on a certain sensor board, then this straight line will be connected to the adjacent sensor. It is possible to pass over the end pixels of the pixel array of the substrate. In other words, the same place on the paper,
The end pixels of the pixel arrays of adjacent sensor boards can be read overlappingly, and the original can be read without interruption in the main scanning line direction. At this time, the end pixels 4 and the connecting end surface 3a As is clear from Fig. 3, it can be seen that the distance is F parrot, that is, about 1.4 cranes. Conventional 20μm
However, there is a margin of 70 times greater. Note that the same reference numerals in FIG. 3 as in FIG. 2 indicate the same members, and are the center line 5i. By combining such a sensor substrate 1a and a fiber plate 7 in which optical fibers 8 are built diagonally, the pixel arrangement is alternately shifted from one adjacent sensor substrate to another in a staggered arrangement, as shown in FIG. in spite of,
The reading position can be made to correspond to a straight line on the paper surface. However, as shown in FIG. 4, the optical fiber 8 is built in at a 45 degree angle to the surface of the fiber plate 7, and the thickness of the fiber plate 7 is 2 mm, so that it cannot be brought into close contact with the sensor board 1a. be. Here, the original document being sent in close contact with the fiber plate 7 is illuminated with light 6 from the light source. The illumination light crosses the optical fiber along the way, but if you use a transparent fiber plate that does not contain light-absorbing paint in the cladding of the fiber, there will be no problem with document illumination.Then, the reflected light from the document will be passed through the fiber to the sensor board. 2■ from the center line of
The signal is guided to a pixel array located at a remote location and converted into an electrical signal. Here, by oriented the fiber at 45 degrees to the right or 45 degrees to the left in accordance with the staggered arrangement of the pixel array, it is possible to read data on a straight line on the original. Also, similar results can be obtained by arranging two rows of SELFOC lenses instead of such a fiber plate.

Next, FIG. 5 shows a method for efficiently removing the sensor substrate 1a whose connecting end face is cut diagonally.
0 is a diamond-shaped glass substrate, 9 is a dicing line, and by dicing along the dicing line 9 shown by this broken line, wasted area can be eliminated. In addition, the rhombic glass substrate 1
0 is useless if a rectangular glass material is cut diagonally (it can be used.Also, if the glass substrate is arranged as shown in Fig. 6, it becomes a hexagonal shape, which is effective for a photoelectric conversion film forming apparatus having a circular substrate holder. It is.

〔Effect of the invention〕

As explained above, according to the present invention, it is possible to increase the distance between the end portion Vt*S of the sensor substrate and the connecting end surface of the substrate, and it becomes possible to produce one-dimensional optical sensors with high yield.

[Brief explanation of the drawing]

Fig. 1 is a diagram showing a conventional one-dimensional optical sensor board connection method, Fig. 2 is an embodiment of the present invention, Fig. 3 is a close-up view of the connection part of the adjacent board in the same embodiment, and Fig. 4 is a fiber F by plate! FIG. 5 is an explanatory diagram of material removal for the trapezoidal sensor substrate, and FIG. 6 is a diagram of the arrangement of the glass substrate during film formation. 1a--sensor board, 2a-pixel array, 3a--
- connection end surface, 4 one end pixel, 5 - center line, 6...
−・Light from light source, 7−・Fiber plate, 8−・−
Optical fiber, 9...-Dicing line, 1st
Figure 2 Figure 3 Figure 4 Figure 5/ct Figure 6

Claims (1)

[Claims] 1. In a close-contact type dimensional optical sensor in which a plurality of sensor substrates are connected and connected in the pixel arrangement direction of the sensor to extend the length in the main scanning line direction, the end surface of the sensor substrate to which the connection is made It is characterized by a direction that intersects diagonally with the main scanning line direction, and a staggered arrangement in which the pixel arrangement position of the optical sensor is alternately shifted in the sub-scanning line direction for each adjacent sensor board. Optical sensor. 2. The optical sensor according to claim 1, wherein the optical sensor is combined with a plurality of optical fiber plates having optical fibers installed diagonally so that the reading position of the optical sensor corresponds to a straight line on the paper surface. 3. The optical sensor according to claim 1, wherein the reading positions of pixels at the ends of adjacent sensor substrates are arranged so as to overlap in the main scanning line direction. 4. The optical sensor according to claim 1, wherein material for the sensor substrate is obtained from a diamond-shaped glass substrate.