JPS6098271U - Heat seal connector - Google Patents

Heat seal connector

Info

Publication number
JPS6098271U
JPS6098271U JP1983189858U JP18985883U JPS6098271U JP S6098271 U JPS6098271 U JP S6098271U JP 1983189858 U JP1983189858 U JP 1983189858U JP 18985883 U JP18985883 U JP 18985883U JP S6098271 U JPS6098271 U JP S6098271U
Authority
JP
Japan
Prior art keywords
adhesive layer
layer
utility
model registration
melt adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983189858U
Other languages
Japanese (ja)
Inventor
二階堂　隆示
泰一 小野
天岸　義忠
守利 中村
Original Assignee
アルプス電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アルプス電気株式会社 filed Critical アルプス電気株式会社
Priority to JP1983189858U priority Critical patent/JPS6098271U/en
Priority to DE19843444986 priority patent/DE3444986A1/en
Publication of JPS6098271U publication Critical patent/JPS6098271U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multi-Conductor Connections (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Push-Button Switches (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図はすべて本考案の実施例を説明するための図で、第１
図は携帯用電子機器の一例を示す概略構成図、第２図は
電極構成体の平面図、第３図は所定位置にホットメルト
型接着剤層ならびに保護膜を形成した電極構成体の平面
図、第４図ａｔｂｔＣ，ｄはその電極構成体における接
続用出張り部の形成順序を示す断面図、第５図は第３図
イーイ線上の拡大断面図、第６図は保護膜を形成した接
続用出張り部の拡大断面図、第７図および第８図はスペ
ーサと剥離紙の複合体の平面図および拡大断面図、第９
図はスペーサを貼着した電極構成体の平面図、第１０図
は上下電極の対向状態を示す拡大断面図、第１１図は電
極構成体とプリント基板の接合前の状態を示す概略斜視
図、第１２図ａ、　ｂは同様に電極構成体とプリント基
板の接合の前後の状態を示す拡大断面図、第１３図は絶
縁基板と通常の接着剤との間に水の層が形成される状態
を示している説明図、第１４図ａ、　ｂは絶縁基板表面
のシラノール基と接着剤中のシランカップリング剤の反
応前後の状態を示している説明図、第１５図ａ、　ｂは
絶縁基板表面のシラノール基と接着剤中の塩化ニッケル
の反応前後の状態を示している説明図、第１６図は絶縁
基板表面のシラノール基と接着剤中のインシアネート化
合物が反応した状態を示す説明図、第１７図はルイス塩
基を添加してポリエステル末端のＯＨ基とシラノール基
が反応した状態を示す説明図、第１８図、第２０図、第
２１図は剥離強度特性図、第１９図は剥離強度試験を説
明するための斜視図、第２２図ａ、　ｂ９　ｃ、　ｄは
接続用出張り部の他の例の形成順序を示す一部拡大平面
図である。 ３・・・・・・メンブレンスイッチ、４・・・・・・プ
リント基板、６．　７−−−−−−ヒートシールコネク
ター、８・・・・・・電極構成体、９・・・・・・折返
し部、１０・・・・・・下部電極部、１１・・・・・・
上部電極部、１２・・・・・・接続用出張り部、１３・
・・・・・ベースフィルム、１４・・・・・・電極、１
５・・・・・・銀層、１６・・・・・・炭素層、１７・
・・・・・導電層、１８・・・・・・切込み、１９・・
・・・・亀裂発生阻止用透孔、２１・・・・・・導電性
ホットメルト型接着剤層、２２・・・・・・電気絶縁性
ホットメルト型接着剤層、２３・・・・・・絶縁基板、
２６・・・・・・シランカップリング剤、２７・・・・
・・金属塩、３１・・・・・・保護膜、３２・・・・・
・スペーサ、３４・・・・・・粘着剤層、３５・・・・
・・中空部、３６・・・・・・空気抜き溝、３８・・・
・・・導電層。 ｔイノ　　　　２１２１２２２１２１　１２’　　　　
−一］＜（、（（（ ノ　　　ｌ七　　　　　　　ｌｌｊ　　　ノ　ｌ沙　１
／　　ノ。 Ｏ２０ 第５図　　゛ 一斤℃−一 ４　　　ｕ ３、　−１７− −　　　　　　　　　　　　− モ １　　　　　　＼　　　　ｒ　　　　　−−３６３５’ 第９図 ３５　′ く ノ　　）　　　ジ　　　　　２ ３３３４３４　３５ ２ 一第１□０図 ４ １３　　　１６１５ （（（ ４ ７ −−＝ニド ５ ｒ’、　　　　　　　　　　　　　　　　　　　　ｗ　
　　′ｌ　Ｈ２０ＫＫ）　　ＨｚＯＨｚＯセ＼〜２４七
−−４！モＯＨ；緊？−１ブイ）４スざλ」ＯＨＯＨＯ
ＨＯＨAll the figures are for explaining the embodiments of the present invention.
The figure is a schematic configuration diagram showing an example of a portable electronic device, Figure 2 is a plan view of an electrode assembly, and Figure 3 is a plan view of an electrode assembly with a hot melt adhesive layer and a protective film formed at predetermined positions. , Fig. 4 atbtC, d is a cross-sectional view showing the formation order of the connecting protrusion in the electrode structure, Fig. 5 is an enlarged cross-sectional view taken along line E in Fig. 3, and Fig. 6 is a connection with a protective film formed. 7 and 8 are a plan view and an enlarged sectional view of the spacer and release paper composite, and FIG.
The figure is a plan view of the electrode assembly with spacers attached, FIG. 10 is an enlarged cross-sectional view showing the upper and lower electrodes facing each other, and FIG. 11 is a schematic perspective view showing the state before the electrode assembly and the printed circuit board are bonded. Figures 12a and 12b are similarly enlarged cross-sectional views showing the state before and after the electrode assembly and the printed circuit board are bonded, and Figure 13 is a state in which a layer of water is formed between the insulating board and the ordinary adhesive. Figure 14a and b are explanatory diagrams showing the states before and after the reaction between the silanol groups on the surface of the insulating substrate and the silane coupling agent in the adhesive, and Figures 15a and b are the diagrams showing the insulating substrate. An explanatory diagram showing the state before and after the reaction between the silanol groups on the surface and nickel chloride in the adhesive; FIG. 16 is an explanatory diagram showing the state in which the silanol groups on the surface of the insulating substrate and the incyanate compound in the adhesive have reacted; Figure 17 is an explanatory diagram showing the state in which the OH group and silanol group at the end of polyester react with the addition of a Lewis base, Figures 18, 20, and 21 are peel strength characteristics diagrams, and Figure 19 is peel strength. A perspective view for explaining the test, and FIGS. 22A, 22B, 22C, and 22D are partially enlarged plan views showing the formation order of other examples of the connecting protrusion. 3... Membrane switch, 4... Printed circuit board, 6. 7---Heat seal connector, 8... Electrode structure, 9... Folded part, 10... Lower electrode part, 11...
Upper electrode part, 12... Connection protrusion part, 13.
... Base film, 14 ... Electrode, 1
5... Silver layer, 16... Carbon layer, 17.
...Conductive layer, 18...Notch, 19...
...Through hole for preventing crack generation, 21... Conductive hot melt adhesive layer, 22... Electrically insulating hot melt adhesive layer, 23...・Insulating substrate,
26... Silane coupling agent, 27...
...Metal salt, 31...Protective film, 32...
・Spacer, 34... Adhesive layer, 35...
...Hollow part, 36...Air vent groove, 38...
...conductive layer. t ino 2121222121 12'
-1] <(, ((
/ of. O20 Fig. 5 ゛One loaf ℃ -14 u 3, -17- - - Mo1 ＼ r --3635' Fig. 9 35' (( 4 7 --= Nido 5 r', w
'l H20KK) HzOHzO se\~247--4! MoOH; tension? -1 Buoy) 4 Suza λ” OHOHO
HOH

Claims (9)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）　　表面に形成された導電性ホットメルト型接着
剤層を被接着規板の導電層上に融着して、導電性ホット
メルト型接着剤層と導電層とを電気的′　　に接続する
ヒートシールコネクターにおいて、前記導電性ホットメ
ルト型接着剤層内にそれよりも導電率の高い良導電層が
設けられていることを特徴上するヒートシールコネクタ
ー。(1) The conductive hot-melt adhesive layer formed on the surface is fused onto the conductive layer of the board to be adhered to electrically connect the conductive hot-melt adhesive layer and the conductive layer. 1. A heat-sealed connector, characterized in that the conductive hot-melt adhesive layer is provided with a highly conductive layer having a higher conductivity than the conductive hot-melt adhesive layer. （２）実用新案登録請求の範囲第（１）項記載において
、前記良導電層が金属で構成されていることを特徴とす
るヒートシールコネクター。(2) Utility Model Registration The heat seal connector according to claim (1), wherein the conductive layer is made of metal. （３）実用新案登録請求の範囲第（１）項記載において
、前記良導電層が、銀層と、その銀層の上に形成された
炭素層とから構成されていることを特徴とするヒートシ
ールコネクター。(3) Utility model registration Claim 1, wherein the highly conductive layer is composed of a silver layer and a carbon layer formed on the silver layer. seal connector. （４）実用新案登録請求の範囲第（１）項記載において
、前記導電性ホットメルト型接着剤層と同一平面上に電
気絶縁性ホットメルト型接着剤層が形成され、この絶縁
性ホラｌ−メルト型接着剤層が被接着基板の導電層が形
成されていない表面に融着されることを特徴とするヒー
トシールコネクター。(4) Utility model registration Claim (1), wherein an electrically insulating hot melt adhesive layer is formed on the same plane as the conductive hot melt adhesive layer, and the insulating hollow l- A heat-seal connector characterized in that a melt-type adhesive layer is fused to a surface of a substrate to be bonded on which a conductive layer is not formed. （５）実用新案登録請求の範囲第（４）項記載において
、前記被接着基板が二酸化ケイ素を含む材料で構成され
、その被接着基板の被接着面に存在するシラノール基の
酸素と化学結合して接着面に疎水性を付与する疎水性付
与化合物が前記電気絶縁性ホットメルト型接着剤層に添
加されていることを特徴とするヒートシールコネクタ０(5) Utility model registration Claim (4), wherein the substrate to be bonded is made of a material containing silicon dioxide, and the substrate is chemically bonded with oxygen of a silanol group present on the bonded surface of the substrate to be bonded. A heat-seal connector 0 characterized in that a hydrophobicity-imparting compound that imparts hydrophobicity to the adhesive surface is added to the electrically insulating hot-melt adhesive layer. （６）　　実用新案登録請求の範囲第（５）項記載にお
いで、前記疎水性付与化合物が金属塩であることを特徴
とするヒートシールコネクター。(6) The heat seal connector according to claim (5) of the utility model registration, characterized in that the hydrophobicity-imparting compound is a metal salt. （７）実用新案登録請求の範囲第（５）項記載におい　
　　□て、前記疎水性付与化合物がカップリング剤であ
ることを特徴とするヒートシールコネクタ０(7) Scope of Utility Model Registration Claims Paragraph (5)
□Heat-seal connector 0, characterized in that the hydrophobicity-imparting compound is a coupling agent. （８）実用新案登録請求の範囲第（５）項記載において
、前記疎水性付与化合物がインシアネート化合物である
ことを特徴とするヒートシールコネクター。(8) The heat-seal connector according to claim (5), wherein the hydrophobicity-imparting compound is an incyanate compound. （９）実用新案登録請求の範囲第（５）項記載において
、前記疎水性付与化合物がルイス塩基であることを特徴
とす劣ヒートンールコネクター。　　　　　′(9) The refractory connector according to claim (5), wherein the hydrophobicity-imparting compound is a Lewis base. ′
JP1983189858U 1983-12-10 1983-12-10 Heat seal connector Pending JPS6098271U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1983189858U JPS6098271U (en) 1983-12-10 1983-12-10 Heat seal connector
DE19843444986 DE3444986A1 (en) 1983-12-10 1984-12-10 Heat-sealing connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983189858U JPS6098271U (en) 1983-12-10 1983-12-10 Heat seal connector

Publications (1)

Publication Number Publication Date
JPS6098271U true JPS6098271U (en) 1985-07-04

Family

ID=16248355

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983189858U Pending JPS6098271U (en) 1983-12-10 1983-12-10 Heat seal connector

Country Status (2)

Country Link
JP (1) JPS6098271U (en)
DE (1) DE3444986A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60140685A (en) * 1983-12-28 1985-07-25 日本写真印刷株式会社 Filmlike electrode connector and method of producing same
DE3714316A1 (en) * 1987-04-29 1988-11-10 Siemens Ag Contact mat for keys and keyboards
JP2647589B2 (en) * 1992-01-27 1997-08-27 矢崎総業株式会社 Composite sheet for electromagnetic wave shielding
DE102017117367A1 (en) * 2017-08-01 2019-02-07 Yazaki Systems Technologies Gmbh Contact device and method for producing such a contact device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54102588A (en) * 1978-01-30 1979-08-13 Nippon Telegr & Teleph Corp <Ntt> Freely adhesive connector

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5357481A (en) * 1976-11-04 1978-05-24 Canon Inc Connecting process
DE3240407A1 (en) * 1982-11-02 1984-05-03 Vdo Adolf Schindling Ag, 6000 Frankfurt Connecting terminal

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54102588A (en) * 1978-01-30 1979-08-13 Nippon Telegr & Teleph Corp <Ntt> Freely adhesive connector

Also Published As

Publication number Publication date
DE3444986A1 (en) 1985-06-20

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