JPS6092846U

JPS6092846U - Boiling cooling semiconductor device

Info

Publication number: JPS6092846U
Application number: JP18461883U
Authority: JP
Inventors: 橋本　正寛
Original assignee: 三菱電機株式会社
Priority date: 1983-12-01
Filing date: 1983-12-01
Publication date: 1985-06-25
Also published as: JPS6322684Y2

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図Ａは従来の沸騰冷却体半導装置の一例の概略一部
断面正面図、第１図Ｂは第１図Ａの右側面図、第２図Ａ
は本考案による沸騰冷却体半導装置の一実施例の概略一
部断面正面図、第２図Ｂは第１図Ａの右側面図、第３図
は第２図Ａの隔壁２３の外面斜視図、第４図は第２図Ａ
の空気溜及び液溜感温部２７．２８の取付けを尽す管２
５，２６の断面図である。１・・・・・・半導体素子、３・・・・・・冷却片、５
・・・・・・半導体スタック、７，２４・・・・・・液
溜、８・・・・・・凝縮器、９・・・・・・気相管、１
０・・・・・・液相管、１１・・・・・・液相の凝縮性
冷却媒体（冷媒）、１２，２１・・・・・・空気溜、１
４・・・・・・気化した凝縮性冷却媒体（冷媒蒸気）、
１５・・・・・・冷却風、２２・・・・・・小穴、２３
・・・・・・隔壁、２５，２６・・・・・・管、２７・
・・・・・空気溜感温部、２８・・・・・・液溜感温部
、２９・・・・・・リード線、３０・・・・・・温度差
計測装置（温度差継電器）。なお、各図中、同一符号は
同−又は相当部分を示す。FIG. 1A is a schematic partially sectional front view of an example of a conventional evaporative cooling body semiconductor device, FIG. 1B is a right side view of FIG. 1A, and FIG.
2B is a right side view of FIG. 1A, and FIG. 3 is a perspective view of the outer surface of the partition wall 23 of FIG. 2A. Figure 4 is Figure 2A
Pipe 2 to which the air reservoir and liquid reservoir temperature sensing part 27 and 28 are attached
5 and 26. FIG. 1... Semiconductor element, 3... Cooling piece, 5
... Semiconductor stack, 7, 24 ... Liquid reservoir, 8 ... Condenser, 9 ... Gas phase tube, 1
0... Liquid phase pipe, 11... Liquid phase condensable cooling medium (refrigerant), 12, 21... Air reservoir, 1
4... vaporized condensable cooling medium (refrigerant vapor),
15...Cooling air, 22...Small hole, 23
......Partition wall, 25, 26...Pipe, 27.
... Air reservoir temperature sensing section, 28 ... Liquid reservoir temperature sensing section, 29 ... Lead wire, 30 ... Temperature difference measuring device (temperature difference relay) . In each figure, the same reference numerals indicate the same or corresponding parts.

Claims

[Scope of utility model registration request]

A semiconductor stack in which semiconductor elements and cooling pieces are alternately laminated, a liquid reservoir that passes through each cooling piece through an insulating tube, a condenser with an air reservoir at the top, and an air that communicates the condenser and the liquid reservoir. A cooling piece, a liquid reservoir, a condenser, a gas phase pipe, and a liquid phase pipe form one closed container, which is composed of a phase pipe and a liquid phase pipe,
In addition, in this boiling-cooled semiconductor device in which a condensable cooling medium is sealed inside the airtight container, a partition wall having a large number of small holes is provided between the air reservoir and the condenser, and a container wall for each of the air reservoir and the liquid reservoir. A tube is installed that protrudes toward the inside, closes the tip, and is equipped with an air reservoir temperature sensing section and a liquid reservoir temperature sensing section inside the tip, respectively, and detection is performed by the air reservoir temperature sensing section and the liquid reservoir temperature sensing section. 1. A boiling-cooled semiconductor device comprising: a temperature difference measuring device for measuring a temperature difference between the two temperatures.