JPS609215U - Molded electronic parts - Google Patents
Molded electronic partsInfo
- Publication number
- JPS609215U JPS609215U JP10003783U JP10003783U JPS609215U JP S609215 U JPS609215 U JP S609215U JP 10003783 U JP10003783 U JP 10003783U JP 10003783 U JP10003783 U JP 10003783U JP S609215 U JPS609215 U JP S609215U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- mold
- mold body
- end surface
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のモールド型コンデンサの説明図、第２図
は本考案による好ましい一具体例のモールド型コンデン
サの説明図、第３図は第２図のコンデンサの下面説明図
、第４図は第２図のコンデンサの成形用金型の一例の説
明図、第５図及び第６図は変形例の金型の一部の説明図
である。
１１・・・・・・モールド本体部、１２・・開型子部品
本体部、１３．１４・・・・・・リード線、１５・・・
・・・端面、１６．１７・・・・・・被覆部、２１．
２２． ２３． ２４・・・・・・突起部。FIG. 1 is an explanatory diagram of a conventional molded capacitor, FIG. 2 is an explanatory diagram of a molded capacitor according to a preferred embodiment of the present invention, FIG. 3 is an explanatory diagram of the bottom of the capacitor in FIG. 2, and FIG. FIG. 2 is an explanatory diagram of an example of a mold for forming a capacitor, and FIGS. 5 and 6 are explanatory diagrams of a part of a modified mold. 11...Mold body part, 12...Open mold child part main body part, 13.14...Lead wire, 15...
. . . end face, 16. 17 . . . covering portion, 21.
22. 23. 24... Protrusion.
Claims (1)
部と、 モールド本体部の一端面から突出した電子部品本体部用
のリード線と、 リード線とモールド本体部の樹脂部との間から電子部品
本体部への湿気の侵入を抑制すべく、突出リード線の基
部の全周を被覆してモールド本体部の前記一端面から突
出しており、モールド本体部と一体的な樹脂製被覆部と
、 前記一端面からリード線の突出方向に前能被覆部よりも
大きく突出しており、モールド本体部と一体的な少なく
とも三本の樹脂製突起部とを有してなるモールド型電子
部品。[Scope of claim for utility model registration] A mold body in which an electronic component body is embedded in a resin, a lead wire for the electronic component body protruding from one end surface of the mold body, and the lead wire and the mold body. In order to suppress the intrusion of moisture into the electronic component body from between the lead wire and the resin part, the protruding lead wire protrudes from the one end surface of the mold body by covering the entire circumference of the base of the protruding lead wire, and is integrated with the mold body. and at least three resin protrusions that protrude from the one end surface in the direction in which the lead wires protrude to a greater extent than the front cover, and are integral with the mold main body. Molded electronic parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10003783U JPS609215U (en) | 1983-06-28 | 1983-06-28 | Molded electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10003783U JPS609215U (en) | 1983-06-28 | 1983-06-28 | Molded electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS609215U true JPS609215U (en) | 1985-01-22 |
Family
ID=30236825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10003783U Pending JPS609215U (en) | 1983-06-28 | 1983-06-28 | Molded electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS609215U (en) |
-
1983
- 1983-06-28 JP JP10003783U patent/JPS609215U/en active Pending
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