JPS6087675A - Rectifier - Google Patents
RectifierInfo
- Publication number
- JPS6087675A JPS6087675A JP58196468A JP19646883A JPS6087675A JP S6087675 A JPS6087675 A JP S6087675A JP 58196468 A JP58196468 A JP 58196468A JP 19646883 A JP19646883 A JP 19646883A JP S6087675 A JPS6087675 A JP S6087675A
- Authority
- JP
- Japan
- Prior art keywords
- rectifier
- semiconductor
- fin
- soldering
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/02—Conversion of ac power input into dc power output without possibility of reversal
- H02M7/04—Conversion of ac power input into dc power output without possibility of reversal by static converters
- H02M7/06—Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes without control electrode or semiconductor devices without control electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Rectifiers (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は車両用交流発電機等に使用する整流装置に関す
る。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a rectifier used in a vehicle alternator or the like.
（従来技術）及び（本発明の背景）
従来周知の整流器に於ける半導体整流器接続構造は、そ
の縦断面図をｍ１図に示す如くで、１は半導体整流器、
ＩＤは凹形状の銅ディスクで、このディスクＩＤの内側
に半導体素子ＩＰ、リードＩＬが半田ＩＳで接続・固定
され、シリコンゴムＩＲにて気密封止されており、前記
ディスクＩＤの外側に冷却フィン３が半田２にて接合・
固定されており、冷却フィンのエンボス部３ａの凹部に
半導体整流器を半田付にて接続・固定しエン廃ス凸部よ
り風を当てて冷麺する構造となっているが、この構造だ
と半導体整流器め≠イス？ＩＤに風が当り難くディスク
ＩＤから風への熱伝達は非常に悪い、ディスクＩＤの放
熱を良（するため、第２図に示すように、冷却フィンの
エンボス凸部に半一体整流器を直接半田付する構造が考
えられるが、半田がエンボス上面からｊＱ流れてしまい
、半田付の信頼性が著しく低下するという問題がある。(Prior Art) and (Background of the Invention) A semiconductor rectifier connection structure in a conventionally well-known rectifier is as shown in Fig.
The ID is a concave copper disk. The semiconductor element IP and lead IL are connected and fixed with solder IS on the inside of this disk ID, and hermetically sealed with silicone rubber IR. Cooling fins are provided on the outside of the disk ID. 3 is joined with solder 2.
The structure is such that a semiconductor rectifier is connected and fixed to the concave part of the embossed part 3a of the cooling fin by soldering, and the noodles are cooled by blowing air from the convex part of the exhaust gas. Rectifier≠chair? It is difficult for the wind to hit the ID, and the heat transfer from the disk ID to the wind is very poor.In order to improve heat dissipation from the disk ID, as shown in Figure 2, a semi-integral rectifier is soldered directly to the embossed part of the cooling fin. Although a structure in which the solder is attached is conceivable, there is a problem in that the solder flows from the upper surface of the embossing in a jQ manner, and the reliability of soldering is significantly reduced.
（本発明の目的）
本発明は、上記の問題点に鑑み、半導体整流器の冷却性
の優れた軽量・低コスト・高品質の整流装置を提供する
ことを目的とするものである。(Object of the present invention) In view of the above-mentioned problems, an object of the present invention is to provide a lightweight, low-cost, and high-quality rectifier that has excellent cooling performance for a semiconductor rectifier.
（本発明の構成）
本発明は、軽金属製冷却フィンのエンボス凸部に固相接
合状態で一体化した、径が半導体整流器の外径とほぼ等
しく熱伝導性・半田付性良好なる金属板状体に、半導体
整流器を半田にて接合・固定したものである。(Structure of the present invention) The present invention provides a metal plate shape having a diameter approximately equal to the outer diameter of a semiconductor rectifier and having good thermal conductivity and solderability, which is integrated with the embossed convex portion of a light metal cooling fin in a solid phase bonded state. A semiconductor rectifier is bonded and fixed to the body with solder.
（実施例） 以下、本発明を図に示す実施例について説明する。(Example) DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention shown in the drawings will be described.
第３図は本発明になる整流装置の一実施例の構成を示す
縦断面図で、１は半導体整流器で凹形状の銅ディスク１
０に半導体素子ＩＰ、リードＩＬノ順ニ半田ＩＳで接続
・固定され、シリコンゴムＩＲにて気密封止されており
、六方側はリードが図示していない交流六方端子に接続
され、出方側はディスクＩＤが直流電極となるアルミ等
の軽金属製冷却フィン３の高さがフィンの板厚程度のエ
ンボス部３ａの凸部に固相状態で一体化された径が半導
体整流器の外径とほぼ等しいろう着可能な金属板状体例
えば銅板４に半田２にて接合・固定されている。FIG. 3 is a vertical cross-sectional view showing the configuration of an embodiment of the rectifier according to the present invention, in which 1 is a semiconductor rectifier with a concave copper disk 1.
The semiconductor element IP and lead IL are connected and fixed with solder IS in order to 0, and hermetically sealed with silicone rubber IR, and the lead on the hexagonal side is connected to an AC hexagonal terminal (not shown), and the output side In this case, the height of the cooling fin 3 made of light metal such as aluminum, which serves as a DC electrode, is integrated in a solid state with the convex part of the embossed part 3a, which is about the thickness of the fin.The diameter is approximately the outer diameter of the semiconductor rectifier. It is joined and fixed to an equal solderable metal plate-like body, for example, a copper plate 4, with solder 2.
（本発明の効果）
上述のように、本発明になる整流装置においては、軽金
属製冷却フィンのエンボス部の凸部に固相接合状態で一
体化した径が半導体整流器の外径とほぼ等しく、熱伝導
性・半田付性良好なる金属板状体に、半導体整流器を半
田にて接合・固定しているため、従来装置と比較して下
記のような優れた利点を有する。(Effects of the Present Invention) As described above, in the rectifier according to the present invention, the diameter of the light metal cooling fin integrated with the convex portion of the embossed portion in a solid phase bonded state is approximately equal to the outer diameter of the semiconductor rectifier; Since the semiconductor rectifier is bonded and fixed with solder to a metal plate with good thermal conductivity and solderability, it has the following advantages compared to conventional devices.
（１１半導体整流器が冷却フィンのエンボス部により覆
われることなく外気に対し菖られになっているため、半
導体整流器のディスクから外気への放熱が飛躍的に多く
なり、半導体素子部の温度を押さえることができ、半導
体素子部の損傷の少ない高品質の整流装置を提供できる
という効果がある。(11) Since the semiconductor rectifier is not covered by the embossed parts of the cooling fins and is exposed to the outside air, heat radiation from the disks of the semiconductor rectifier to the outside air increases dramatically, suppressing the temperature of the semiconductor element part. This has the effect of providing a high quality rectifier with less damage to the semiconductor element portion.
（２）冷却風がエンボス凹部方向から当たっているため
、エンボス部でのフィンから風への熱伝達は悪くなるが
熱は熱伝導によりフィン全体に広がって冷却される。従
ってフィン全体が効率的に冷却に寄与でき半導体素子部
の温度を低く押さえることができるという効果がある。(2) Since the cooling air is applied from the direction of the embossed recesses, heat transfer from the fins to the wind at the embossed portions is poor, but the heat spreads over the entire fins due to thermal conduction and is cooled. Therefore, the entire fin can efficiently contribute to cooling, and the temperature of the semiconductor element portion can be kept low.
（３）半導体整流器と金属板状体を接続・固定している
半田は軽金属製冷却フィンが半田付性が悪いため、金属
板状体より下へ流れることなく、又、半田の表面張力に
より半田厚が一定となり信頼性の高い整流装置を提供で
きるという効果がある。(3) The solder that connects and fixes the semiconductor rectifier and the metal plate does not flow down to the metal plate because the light metal cooling fins have poor solderability, and the solder does not flow downwards due to the surface tension of the solder. This has the effect of providing a highly reliable rectifying device with a constant thickness.
第１図は従来の整流装置の要部縦断面図、第２図は本発
明を説明するりめの整流装置の要部縦断面図、第３図は
本発明になる整流装置の一実施例の構成を示す要部縦断
面図である。
ｌ・・・半導体整流器、ＩＤ・・・ディスク、ＩＰ・・
・半導体素子、ＩＬ・・・リード、１ｓ、２・・・半田
、３・・・冷却フィン、３ａ川工ンボス部、４・・・金
属板状体。
代理人弁理士 岡 部 隆Fig. 1 is a longitudinal cross-sectional view of the main part of a conventional rectifier, Fig. 2 is a longitudinal cross-sectional view of the main part of a rectifier according to the present invention, and Fig. 3 is an embodiment of the rectifier according to the present invention. FIG. l...Semiconductor rectifier, ID...Disk, IP...
- Semiconductor element, IL...Lead, 1s, 2...Solder, 3...Cooling fin, 3a Kawakou boss portion, 4...Metal plate-shaped body. Representative Patent Attorney Takashi Okabe
Claims (1)
で一体化した、径が半導体整流器の外径とほぼ等しく熱
伝導性・半田付性良好なる金属板状体に、半導体整流器
を半田にて接合、固定したことを特徴とする整流装置。The semiconductor rectifier is soldered to a metal plate-like body whose diameter is approximately equal to the outside diameter of the semiconductor rectifier and has good thermal conductivity and solderability, and which is integrated with the convex part of the embossed part of a light metal cooling fan in a solid state bonding state. A rectifying device characterized by being joined and fixed by.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58196468A JPS6087675A (en) | 1983-10-19 | 1983-10-19 | Rectifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58196468A JPS6087675A (en) | 1983-10-19 | 1983-10-19 | Rectifier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6087675A true JPS6087675A (en) | 1985-05-17 |
| JPH0440945B2 JPH0440945B2 (en) | 1992-07-06 |
Family
ID=16358300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58196468A Granted JPS6087675A (en) | 1983-10-19 | 1983-10-19 | Rectifier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6087675A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5828564A (en) * | 1997-02-25 | 1998-10-27 | Mitsubishi Denki Kabushiki Kaisha | Rectifier heat dissipation |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51272A (en) * | 1974-06-19 | 1976-01-05 | Hitachi Ltd | DENKIKAIROSOCHIOYOBISONO SEIHO |
-
1983
- 1983-10-19 JP JP58196468A patent/JPS6087675A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51272A (en) * | 1974-06-19 | 1976-01-05 | Hitachi Ltd | DENKIKAIROSOCHIOYOBISONO SEIHO |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5828564A (en) * | 1997-02-25 | 1998-10-27 | Mitsubishi Denki Kabushiki Kaisha | Rectifier heat dissipation |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0440945B2 (en) | 1992-07-06 |
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