JPS6084900A - Method of assembling shielding case - Google Patents

Method of assembling shielding case

Info

Publication number
JPS6084900A
JPS6084900A JP19310183A JP19310183A JPS6084900A JP S6084900 A JPS6084900 A JP S6084900A JP 19310183 A JP19310183 A JP 19310183A JP 19310183 A JP19310183 A JP 19310183A JP S6084900 A JPS6084900 A JP S6084900A
Authority
JP
Japan
Prior art keywords
printed board
metal frame
frame
metal
protruding piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19310183A
Other languages
Japanese (ja)
Other versions
JPH0221677B2 (en
Inventor
池田 三郎
靖雄 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd, Sanyo Denki Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP19310183A priority Critical patent/JPS6084900A/en
Publication of JPS6084900A publication Critical patent/JPS6084900A/en
Publication of JPH0221677B2 publication Critical patent/JPH0221677B2/ja
Granted legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 (イ)産業上の利用分野 本発明はプレビジョン受像機のff((子同調チューナ
等で使用されるシールドゲースの組立て方法に関する。
DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a method for assembling a shield gate used in a pre-vision receiver's FF (sub-tuner, etc.).

(ロ)従来技術 従来、シールドケーヌを形成する全1iJ+枠体内に高
周波回路部品が組込まれたプリント板を収納固定するた
め第1図の如き方法が採られている。
(b) Prior Art Conventionally, a method as shown in FIG. 1 has been adopted for storing and fixing a printed board in which high-frequency circuit components are incorporated in a total 1iJ+ frame forming a shield cane.

第1図1二おいて、filは金属枠体であって、該枠1
4\(1)の側面(1a)にはプレビジ、ン受1求1場
のアンテナ端子から導出されたケーブルが(帽:Q’e
されるコネクタ(2)や複数の外部接続用チューナVl
iA子(3)が設はうit、 ル。ソシテー4iJ記金
1p%枠体(llO)lIil1面(1a)に適宜切り
起し部(1b)や突き出し1ζ3(1c)〔第2図参照
〕を形成し、これら切り起し部(1b)や突き出し部(
1C)に1つ−Cプリント板(4)を仮止め後1手作業
で半1旧:J’ kl’ [ff(1図C二おし)で半
田付は箇所を斜線部で示す〕するか、或は上記の如くプ
リント板(4)を金属枠体(1)に仮止めしだ後第2図
に示すようg二半111ディンピング法(二よって半田
付けを行なつ′〔いた。尚、第2図において第1図と同
一部分には同一図番をイ;」シており、(5)は半田デ
ィピング槽、(61は溶融)・ンダである。
In FIG. 1, 12, fil is a metal frame, and the frame 1
On the side (1a) of 4\(1), there is a cable led out from the antenna terminal of the previsual receiver 1 request 1 field (cap: Q'e
Connector (2) and tuner Vl for multiple external connections
iAko (3) set it up. Cut-and-raised portions (1b) and protrusions 1ζ3 (1c) [see Fig. 2] are formed as appropriate on the frame (llO)lIil1 surface (1a), and these cut-and-raised portions (1b) and The protruding part (
1C) After temporarily fixing the one-C printed board (4), do half a half by hand: J'kl' [Soldering points are indicated by diagonal lines in ff (Fig. 1 C2)] Alternatively, after temporarily fixing the printed board (4) to the metal frame (1) as described above, soldering was performed using the g2-half-111 dipping method (2) as shown in FIG. In FIG. 2, parts that are the same as those in FIG.

ところで上述の如く手作業で半田付けを行なう場合半田
付は箇所が多いので生産性が悪いばかりでなく、金属枠
体(11とプリント板(4)の金属箔(図示せず)との
半田付けのために大容量の半田ゴテが必要となり、また
プリント板(4)に組込まれる部品にチダプ状部品を使
用している場合、半田付は時に加わる熱に」二って前記
チダプ状部品が破損しないように予め部品を熱しておく
(予熱する)必要がある。
By the way, when soldering is performed manually as described above, not only is productivity low because there are many soldering points, but also it is difficult to solder the metal frame (11) and the metal foil (not shown) of the printed board (4). Therefore, a large-capacity soldering iron is required, and if tip-shaped parts are used for the parts to be assembled into the printed circuit board (4), the heat applied during soldering can sometimes cause the tip-shaped parts to break. It is necessary to heat (preheat) the parts in advance to prevent this from happening.

半田ディピング法では上記手作業≦二よる欠点は解消さ
れるが、半田デダビング槽(5)の溶融半田(6)内に
金属枠体(11を浸すので前記溶融半田(6)が金属枠
体(11の側IIII(1a)C付層する。このため第
6図に示すように金属枠体illの開口端(1d)を金
属カバー(71で施孟する場合、該カバー(7)に設け
られた弾性爪片(7a)と金属枠体(11の側面(1a
)との接触が悪くなり、カバーによるν日りノイズが生
じる欠点があった。また、従来鑑;おいてはプリント板
(4)の仮止め作業を必要とし生産性の悪いものであっ
た。
The solder dipping method eliminates the disadvantage of manual work≦2, but since the metal frame (11) is immersed in the molten solder (6) of the solder dedubbing tank (5), the molten solder (6) is absorbed by the metal frame ( For this reason, as shown in FIG. 6, when the open end (1d) of the metal frame ill is covered with a metal cover (71), The elastic claw piece (7a) and the side surface (1a) of the metal frame (11)
) has the disadvantage of poor contact with the cover, and noise caused by the cover. In addition, the conventional method required temporary fixing of the printed board (4), resulting in poor productivity.

し→ 発明の目的 本発明は上記欠点が生じないようにエノくされたり一ル
ドケースの組立て方法を提供することを目的とする。
OBJECT OF THE INVENTION The object of the present invention is to provide an efficient method for assembling a closed case so that the above-mentioned disadvantages do not occur.

(ロ)発明の構成 本発明は金属枠体の少なくとも一方の開口端に複数の突
片を一体に形成し、一方プリント仮に前記金属枠外の開
口9if5 を二沿つ一′Cv力づト溝を設けるととも
I:該■力づト溝に前記突片が伸1司される透孔を設け
、該透孔に前記突片を伸刑することにより前記プリント
板から斐出した前記舅j1と該プリント板上に設けられ
た<’?l b4箔とを半11.1によって結合し、し
かる後前記プリント板を前記v′)JッF iI4で割
って前記金属枠体からはみ出た)11を分を削除し。
(B) Structure of the Invention The present invention includes integrally forming a plurality of projecting pieces on at least one opening end of the metal frame, and forming a 1'Cv force groove along the opening 9if5 outside the metal frame. By providing a through hole through which the protruding piece is extended into the force groove, and by extending the protruding piece into the through hole, the protruding piece is pushed out from the printed board. <'? provided on the printed board. The printed board was then divided by the v') JF iI4 to remove the part 11 that protruded from the metal frame.

i’+il記突片が内面(二当接する如く金す、4カバ
ーを前記一方の開口端に施すようにしたシールドデース
の組立°C方法である。
This is a method for assembling a shield case in which the protruding pieces (i'+il) are placed on the inner surface (two metal plates so that they are in contact with each other), and four covers are applied to the one open end.

&14実施例 本発明のシールドケースの組立C方法を第41゜4乃至
第8図を参照しつつ説明するが従来と同一部分には同一
1番を付してお(。
&14 Embodiment A method C for assembling a shield case according to the present invention will be explained with reference to FIGS.

24I4図は危属枠俸(8)を示しており、該枠体(8
)の11111面(8a)にはコネクタ(2)や外部接
続用チューナ端子(31が設けら才りるとともシニ必要
に応じて金属性の仕切り壁(9)が設けられる。そして
前記金属枠I/Nt81の開DJ(8b)には複数の突
片(tωが一体に形成される。面1本実施例では前記仕
切り壁(9)にも突片(Il+が形成される。
Figure 24I4 shows the dangerous quota (8), and the quota (8)
) is provided with a connector (2) and a tuner terminal (31) for external connection, and a metal partition wall (9) is provided as needed.Then, the metal frame A plurality of protrusions (tω) are integrally formed on the open DJ (8b) of the I/Nt 81. In this embodiment, protrusions (Il+) are also formed on the partition wall (9).

一方、第5図に示す如く高周波回路部品(図示せず)が
実装されるプリント板([21に前記1rt枠体ft4
1)開口yRr+ (8b ) に沿ったvカート/j
5(131(m 5図においCV力ヴト溝(131はプ
リント板(12の畏圓に形成されているので破線で示す
〕を設ける。次し)で前記V力ヴト11ηαQが施され
た部分に前記金属枠体18)の開Ljyiia (8b
 )に設けられた突片uljが挿通される透孔(14を
設けるとともCjail記仕切り壁(9)に設けられた
突片αBが挿通さnる透孔09が設けられる。
On the other hand, as shown in Fig. 5, the printed board ([21]
1) v cart/j along opening yRr+ (8b)
5 (131 (m) In Figure 5, a CV force groove (131 is a printed board (formed in the circle of 12, so it is shown with a broken line) is provided.Next), the V force groove 11ηαQ was applied. The opening Ljyiia (8b) of the metal frame 18)
) is provided with a through hole (14) through which the protruding piece ulj provided on the Cjail partition wall (9) is inserted, and a through hole 09 through which the protruding piece αB provided on the Cjail partition wall (9) is inserted is provided.

i’+i]記プリント仮IIAにはそれに実装される回
路部品の゛電気的1容続に形成される導体パターン(図
示せず)の他に金属枠体(8)とプリン) jljf+
21との結合に必要な金属箔(Iblαn(第5図にf
Jいて斜線を施した部分〕が前記透孔(141(151
の近傍6二゛]・め形成されるが、前記金属枠外(8)
の開Ll y:iA (8b )に形成された突片帥が
挿通される透孔(14)の近傍に形成される金属箔(I
Qについ゛〔は第5図にボート如くvカ・y)71’・
t(131でuJlまれた範囲内で設けられZi次に上
記のvロク加工されたプリントυ11121のJ2’!
i孔(14)(151ニ’f: tL ’Cしくt I
fJX 枠体(81(1) 各突片11111(I o
 ? jii >bl −Tることこより箱6図に示す
如くプリン) 41gttAz)うち前記金1114箔
flfii(17)が形成さjした方の而から前記突片
11(lα1)を突出させるようにし′〔組立゛Cる。
i'+i] The printed temporary IIA includes the circuit components to be mounted on it: ``In addition to the conductor pattern (not shown) formed as one electrical connection, the metal frame (8) and the printed wiring board'' jljf+
The metal foil (Iblαn (f in Figure 5) necessary for bonding with 21
The hatched part] is the through hole (141 (151
62゛] is formed near the metal frame (8).
The metal foil (I
Regarding Q, ゛[is like a boat in Figure 5, vka・y)71'・
t(J2' of the print υ11121 provided within the range uJl in 131 and then processed with the v-roku process above)!
i hole (14) (151 ni'f: tL 'C t I
fJX frame (81 (1) each protrusion 11111 (I o
? As shown in Figure 6, the protruding piece 11 (lα1) is made to protrude from the side where the gold 1114 foil flfii (17) is formed. Assemble.

このようにして組立てられた半完成品はそのプリント板
(121の端部な持つようにして半111ディピング槽
内の溶融半田に浸し、141記プリンN15f21の金
鴎箔0e面が形成された面に半田1を施す。これ≦二よ
って前記金属箔+11i1T17)と突片1118+I
11とが半LLI付けされ。
The semi-finished product assembled in this way was immersed in the molten solder in the semi-111 dipping tank while holding the edge of the printed board (121). Solder 1 is applied to the metal foil +11i1T17) and the protruding piece 1118+I.
11 is attached with half LLI.

プリント板(12が6ン属枠体(8)に固定される。J
<である。
The printed board (12 is fixed to the 6-piece frame (8).J
< is.

しかる後、前記プリント板(Iシりをnu jr+4.
 v力9トc1°laJに沿つて割り、前記金属枠体(
8)からはみ出た部分を削除する。
After that, press the printed board (I side) to nu jr+4.
The metal frame (
8) Delete the part that protrudes from.

そして、第7図に示す如く前記金属枠体(8)の側面(
8a)に係止する複数の弾性爪片(18a)を有する優
属性の裏カバーα口を施す。このときプリント(反(1
2の1j孔(141(151から突出する製片(101
αυが前記九カバーf181の内面の底部(18b)に
当1妾することにより、該裏カバー帥の弾性爪片(IF
la)の係止位置の位置決めが為される。尚、必要に応
じて6’J jje I%カバー(181+″−設けら
れる爪片(18a)→ &1前記突片(1Bの間に位置するように設け、れる。
Then, as shown in FIG. 7, the side surface (
8a) is provided with a rear cover α opening having an advantageous property and having a plurality of elastic claw pieces (18a) that engage with the opening. At this time, print (anti(1)
1j hole (141 (151) protruding from the piece (101
By fitting αυ to the bottom (18b) of the inner surface of the nine cover f181, the elastic claw piece (IF
The locking position of la) is determined. Incidentally, if necessary, the cover (181+''-claw piece (18a) provided → &1 is provided so as to be located between the protruding pieces (1B).

このようにすツシば裏カバーttSの取付けがスムーズ
に1−jえる。また−’V−h−yl・i’ff1日の
t′J)断面が裏カバー(18117月iiQ 1窄(
18c)に接触するのを防出するためにal 7[;A
 l二示す如く前記側壁(13c)を外方に向って少許
膨らまぜるようにした方が好ましい。
In this way, the back cover ttS can be attached smoothly. In addition, -'V-h-yl・i'ff1 day t'J) cross section is the back cover (18117 iiQ 1 narrowing (
18c) to prevent contact with al 7[;A
It is preferable that the side wall (13c) swells slightly outward as shown in 1-2.

このC< * ?IE IfiS枠体(8)の他方の開
口端にも複数の爪片(19n)を自する位属性の表カバ
ー(11が施さtl、−i/−ルドゲースとして完成さ
れる。
This C< *? The other opening end of the IE IfiS frame (8) is also provided with a front cover (11) having a plurality of claw pieces (19n), and is completed as a Ludogesu.

尚、i−2実施例では\1−h−lト11:ζ(131
を4つ設けているが、18図に示すように予め金属枠体
(8)の一方の幅に合致するようにプリント板+12を
形成しておき、金属枠体(8)の他方の幅に沿った■カ
イト溝a3を2つ設け、半田付は終了後そのV力ヴ) 
7/lαJでプリント板α2を割りで、該プリント板[
121の不要な部分を取り除くようにしてもよい。
In addition, in the i-2 embodiment, \1-hlt11:ζ(131
As shown in Figure 18, the printed board +12 is formed in advance to match the width of one side of the metal frame (8), and the printed board +12 is formed to match the width of the other side of the metal frame (8). Two kite grooves A3 are provided along the line, and after soldering is completed, the V force V)
Divide the printed board α2 by 7/lαJ, and divide the printed board [
121 may be removed.

(へ)発明の効果 本発明のシールドケースの組立て方法に依ればプリント
板を金属枠体に仮止めする作業が不要となり生産性が向
上すZ)。
(f) Effects of the Invention According to the method for assembling a shield case of the present invention, there is no need to temporarily fix the printed board to the metal frame, and productivity is improved.

また、半田ディピング法による半II付けを行なうにも
拘らず、金属枠体の側面には半1」1が付着しないので
従来の如き全屈カバーと歌属枠体との接触不良が生じず
、従ってその接触不良に起因する不都合が回避できるな
ど本発明は佑めて有用である。
In addition, even though half-II attachment is performed using the solder dipping method, half-1"1 does not adhere to the side surface of the metal frame, so there is no contact failure between the full-bending cover and the metal frame as in the conventional case. Therefore, the present invention is very useful as it can avoid the inconvenience caused by poor contact.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の方法によつ′〔組立てられたシールドケ
ースの主要部を示す平面図、第2図は従来の組立て方法
を示す図、第3図は従来の方法によって組立てられたり
一ルドケースの要部を断面して示す図である。第4図及
び第5図はそれぞれ本発明で使用される部品の平面図、
第6図は本発明における組立て方法を説明する為の図、
第7図は本発明の方法C二より組立てられたり一ルドヶ
ースを示す因、第8図は他の実施例を説明する為の図で
ある。 (8)・・・金jtA枠体、(8b)・・・開口端、(
101・・・突片、(L2−・・プリント板、(131
・・・Vカイト溝。 aを・・・透孔、 α6)・・・金属箔、 a訃・・裏
カバー。 第2図 第8図 第5図
Figure 1 is a plan view showing the main parts of a shield case assembled by the conventional method, Figure 2 is a diagram showing the conventional assembly method, and Figure 3 is a plan view of the shield case assembled by the conventional method. FIG. 4 and 5 are plan views of parts used in the present invention, respectively;
FIG. 6 is a diagram for explaining the assembly method in the present invention,
FIG. 7 shows a case assembled by method C2 of the present invention, and FIG. 8 is a diagram for explaining another embodiment. (8)...Gold jtA frame, (8b)...Opening end, (
101... Projection piece, (L2-... Printed board, (131
...V kite groove. a...through hole, α6)...metal foil, a...back cover. Figure 2 Figure 8 Figure 5

Claims (1)

【特許請求の範囲】[Claims] (1)金属枠体の少な(とも一方の開口端に複数の突片
を一体に形成し、一方プリント板に前記金属枠体の開口
端に沿って■カダ) i:Qを設けるとともに該V力噌
ト溝に前記突片か挿通される透孔な設け、該透孔に前記
突片な挿通ずることにより前記プリント板から突出した
jiiJ記突片と該プリント板上に設けられた金属箔と
を半ll3(二よって結合し。 しかる後前記プリント板を)iiJ記Vカ’ トi’i
Gで割り℃前記金属枠体からはみ出た部分を削除し、 
i)l記突片が内面(二当接する如く金属カバーを前記
一方の開口端に施すようにしたシールドケーヌの組立て
方法。
(1) A small metal frame (a plurality of protrusions are integrally formed at one opening end, and a frame is formed along the opening end of the metal frame on the printed board) i: Q is provided, and the V A through-hole is provided through which the protruding piece is inserted into the force-fitting groove, and the protruding piece protrudes from the printed board by inserting the protruding piece into the through-hole, and a metal foil provided on the printed board. and half ll 3 (combined by 2. Then the said printed board) ii J.
Divide by G ℃ Delete the part protruding from the metal frame,
i) A method for assembling a shield cane, in which a metal cover is applied to one of the open ends so that the protrusions mentioned above are in contact with the inner surface (two sides).
JP19310183A 1983-10-14 1983-10-14 Method of assembling shielding case Granted JPS6084900A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19310183A JPS6084900A (en) 1983-10-14 1983-10-14 Method of assembling shielding case

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19310183A JPS6084900A (en) 1983-10-14 1983-10-14 Method of assembling shielding case

Publications (2)

Publication Number Publication Date
JPS6084900A true JPS6084900A (en) 1985-05-14
JPH0221677B2 JPH0221677B2 (en) 1990-05-15

Family

ID=16302252

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19310183A Granted JPS6084900A (en) 1983-10-14 1983-10-14 Method of assembling shielding case

Country Status (1)

Country Link
JP (1) JPS6084900A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6320497U (en) * 1986-07-25 1988-02-10
JP2004047759A (en) * 2002-07-12 2004-02-12 Alps Electric Co Ltd Aggregate substrate of electronic unit

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0373972U (en) * 1989-11-22 1991-07-25

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56147500A (en) * 1980-04-18 1981-11-16 Mitsumi Electric Co Ltd Board circuit device and method of manufacturing same
JPS5713791U (en) * 1980-06-30 1982-01-23

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5484360A (en) * 1977-12-17 1979-07-05 Kurita Kasen Kk Method of washing scale

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56147500A (en) * 1980-04-18 1981-11-16 Mitsumi Electric Co Ltd Board circuit device and method of manufacturing same
JPS5713791U (en) * 1980-06-30 1982-01-23

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6320497U (en) * 1986-07-25 1988-02-10
JP2004047759A (en) * 2002-07-12 2004-02-12 Alps Electric Co Ltd Aggregate substrate of electronic unit

Also Published As

Publication number Publication date
JPH0221677B2 (en) 1990-05-15

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