JPS6083070U - Rectangular conductor coating thickness adjustment device - Google Patents
Rectangular conductor coating thickness adjustment deviceInfo
- Publication number
- JPS6083070U JPS6083070U JP17340283U JP17340283U JPS6083070U JP S6083070 U JPS6083070 U JP S6083070U JP 17340283 U JP17340283 U JP 17340283U JP 17340283 U JP17340283 U JP 17340283U JP S6083070 U JPS6083070 U JP S6083070U
- Authority
- JP
- Japan
- Prior art keywords
- rectangular conductor
- adjustment device
- coating thickness
- thickness adjustment
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
- Electrostatic Spraying Apparatus (AREA)
- Coating Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案装置の要部断面図、第企図は本考案の塗
膜厚調節装置の斜視図である。
1・・・・・・塗膜厚調節装置、2・・・・・・コーテ
ィングゾーン、3・・・・・・容器、4・・・・・・平
角導体、5・・・・・・粉体付着防止板、8・・・・・
・合成樹脂粉体、9・・・・・・けずり落とし板、10
・・・・・・多孔板。FIG. 1 is a sectional view of a main part of the apparatus of the present invention, and the second figure is a perspective view of the coating film thickness adjusting apparatus of the present invention. 1... Coating film thickness adjustment device, 2... Coating zone, 3... Container, 4... Rectangular conductor, 5... Powder Body adhesion prevention plate, 8...
・Synthetic resin powder, 9... Scraping plate, 10
・・・・・・Perforated plate.
Claims (1)
着させる装置において、前記装置内の前記平角導体の下
面に接する位置に粉体の付着を所要長さにわたって防止
する粉体付着防止板を設置するとともに、この粉体付着
防止板の後方の前記平角導体の側面に接する位置に前記
平角導体の側面に付着された粉体をけずり落とすための
けずり落とし板を配置したことを特徴とする平角導体塗
膜厚調節装置。In an apparatus for attaching a synthetic resin body to the surface of a rectangular conductor by an electrostatic dynamic dipping method, a powder adhesion prevention plate is provided in the apparatus at a position in contact with the lower surface of the rectangular conductor to prevent the adhesion of powder over a required length. In addition, a scraping plate for scraping off powder adhered to the side surface of the rectangular conductor is arranged at a position behind the powder adhesion prevention plate and in contact with the side surface of the rectangular conductor. Conductor coating thickness adjustment device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17340283U JPS6083070U (en) | 1983-11-09 | 1983-11-09 | Rectangular conductor coating thickness adjustment device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17340283U JPS6083070U (en) | 1983-11-09 | 1983-11-09 | Rectangular conductor coating thickness adjustment device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6083070U true JPS6083070U (en) | 1985-06-08 |
Family
ID=30377760
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17340283U Pending JPS6083070U (en) | 1983-11-09 | 1983-11-09 | Rectangular conductor coating thickness adjustment device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6083070U (en) |
-
1983
- 1983-11-09 JP JP17340283U patent/JPS6083070U/en active Pending
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