JPS6082870A - Inspection of active matrix substrate - Google Patents

Abstract

PURPOSE:To make it possible to perform various inspections prior to a panel assembling process, in a driver built-in type active matrix substrate, by providing the contact region with an external probe and a switch. CONSTITUTION:Pads 220-239 for the contact with an external probe are provided on gate wires 201-205 and data wires 206, 210 and switches 240-249 are provided between a driver 214 for driving the gate wires and the pads as well as between a driver 215 for driving the data wires and the pads. The opening and closing of the switches 240-244 and 245-249 is controlled by using external signals 250, 251 and the external probe is brought into contact with the pads to perform various inspections such as the presence and absence of the disconnection between the gate wires and data wires or the short-circuit of the gate wires and the data wires. By this method, various inspections can be performed prior to a panel assembling process.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for testing an active matrix substrate with a built-in peripheral drive circuit.

In order to reduce the size, performance, and cost of I+X type liquid crystal display devices, it is required to incorporate a peripheral ringing circuit (hereinafter referred to as a driver) into the active matrix substrate. Matrix substrate and 1. In this case, a MOS transistor is formed on a single-crystal silicon substrate, and a MOS transistor is formed on a single-crystal silicon substrate.
Products that form the 40S Transinuku are being manufactured and prototyped.

FIG. 1 shows a conventional driver-type actif matrix substrate. In FIG. 1, 101 to 103, etc. are gate lines, 104 to 107, etc. are data lines, 110 to 112, etc. are pixels, 113 and 114 are gate line tl-drivers, and 115 and 116 are data bond f drives. A driver who does. For a certain active matrix board with a built-in driver in the m1 diagram, there was no particularly effective inspection method, and it was only possible to observe the data output in the shift register of the driver and the current consumption of the driver. Therefore, there were many cases in which various defects were discovered after the manufacturing process, and this greatly put a brake on the cost reduction of active matrix liquid crystal display devices.

The purpose of the present invention is to inspect an active matrix substrate with a built-in driver before the panel assembly process, identify defects, and effectively carry out subsequent processes, thereby reducing the cost of active matrix liquid crystal display devices. It's about doing.

The gist of the present invention is to provide an abortive region (hereinafter referred to as "bad") with an external probe on the gate ζ pump link connecting the driver output section and the drawing section in an active matrix board with a built-in driver. A switch is provided between the pad and the driver output section, and between the pad and the pixel section, the opening and closing of the switch is controlled by an external signal, and an external probe is brought into contact with the vano H to conduct the inspection.

Hereinafter, the present invention will be described in detail based on six examples.

FIG. 2 shows an embodiment of the present invention. In the figure, 201 to 205 gate lines, 206 to 210 data lines, 2
11 to 213, etc. are pixels, 2141-t a driver for driving the gate line, 215 is a driver for driving the data line, 220 to 239 are pads provided for contact with an external probe, 240 to 249 are analog switches, 250 Input terminal for signals that control opening/closing of analog switch groups 240 to 244, 251 analog switch edge group 245
This is an input terminal for a signal that controls the opening and closing of 249 to 249. The analog switch group is assumed to be conductive when the control signal is high.

First, when the first row of control signal input terminals 250 and 251 is made low, all analog switches 240 to 249 become non-conductive. Therefore, by tracing the external probe and measuring the resistance of the gate I%+201 through the pads 220 and 225, it is possible to check whether or not the gate line 201 is disconnected.

Similarly, by measuring the resistance through the pads 221 and 226, 222 and 227, etc., the presence or absence of disconnection in the gate lines 202, 203, etc., was determined through the pads 230, 2'55, 261, and 236.
It is possible to detect whether or not the data lines 206, 207, etc. are disconnected by measuring the fc resistance. Also, with Bud 220,
By measuring the resistance between the gate line 230 and the data line 230, it is possible to check whether there is a vertical short circuit between the gate line 201 and the data line 206. Similarly, due to the constant resistance between the pads 220 and 231, 232, etc., it is possible to check for vertical short circuits between the gate line 201 and the data 4 wires 207, 208, etc., and by repeating these steps, the gate line and the data 4 wires 207, 208, etc. The presence or absence of vertical short circuits at all intersection points can be checked. Then, for only the board with good θ in the above inspection, the potential of the control signal input terminals 250 and 251 is set high to make the analog switch group conductive, and the driver 2
14 and 215, the bads 220 to 22
The output waveform of the gate side driver 214 can be viewed through pads 230 to 234, and the output waveform of the data side driver 215 can be viewed through pads 230 to 234.

FIG. 6 shows another embodiment of the invention. In the figure, 301 to 305 are gate lines, 306 to 610 are data lines, 611 to 313 are pixels, and 614 and 61 are data lines.
Driver for driving 5 gate lines, 316 and 517
is a driver that drives the data line, 320 to 339 are pads for contact with the external probe, 640 to 3591''1 analog switch, 360. 561. 62 and 36
6 are analog switch groups 340 to 3443, respectively.
45 to 349. 350 to 354 and 355 to 3
This is an input terminal for a signal that controls the opening and closing of 59.

First, by setting the control signal input terminals 36G to 3630 low and making all the analog switches 340 to 359 non-conductive, the presence or absence of a vertical short circuit at the intersection of the gate lines 301 to 305 and the data lines 606 to 610 is inspected. Yes. Regarding the inspection of upper and lower short circuits, when the potential of the control signal input terminal 360 is set to full high for good board insertion,
The output waveform of the gate side driver 614 can be observed. In addition, by setting the potential of the control signal input terminal 360 to low and the potential of the control signal input terminal 361 to no, the gate side driver 31
5 output waveform can be observed. Similarly, the output waveforms of the data side drivers 316 and 317 can be observed independently.

By the way, in FIG. 3, for example, the gate side driver 3
15 is malfunctioning. In this phase, by setting the potential of the control signal input terminal 361 to low Kt and setting the U Gnuit switches 345 to 549f non-conductive, the gate lines 301 to 305 can be driven by the input of the gate side driver 314. In other words, defects can be repaired with a single operation of the control signal. In this case, by further turning off the analog switches 340 to 344f, it is possible to detect whether or not the gate lines 301 to 305 are disconnected.

As described above, by using the present invention, various inspections and simple defect relief of active matrix substrates with built-in drivers are possible, and it is also possible to effectively correct defects and perform post-processing. The cost reduction of LCD display devices is expected to continue.

[Brief explanation of drawings]

FIG. 1 is a diagram for explaining a conventional active matrix plate with a built-in driver. FIG. 2 is a diagram for explaining the present invention in detail. FIG. 3 is a diagram for explaining another embodiment of the present invention. that's all

Claims (1)

[Claims] a plurality of gate lines, a plurality of data lines perpendicular to the gate lines, fr provided at the intersection of the gate lines and the data lines,
Pixel part and surrounding area by MOS l-transistor,'
! ty, Ij from the 1lrh circuit! In an active matrix substrate with a built-in peripheral drive circuit, +C on the gate line and data line connecting the peripheral circuit output section and the pixel section.
Outer area] (Provide a contact ship with the probe, and connect the contact area and the peripheral area 1i1+circuit [1)1 or ' fd Nui -/- between the contact area and the pixel area, and connect the switch with an external signal. 2. A method for inspecting an active matrix substrate, comprising: controlling the opening and closing of the active matrix substrate;