JPS6078084A - Memory apparatus blocked from heat of airplane flight data memory apparatus - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION This IJI is caused by similar destructive high temperature conditions.
9 (6) Shielding enclosures, especially those relating to heat-tracing enclosures where enclosure dimensions and grade are important requirements. In the described embodiment, this offset The storage device was constructed to withstand the destruction of the aircraft tower and the subsequent fire with almost no loss of data stored in it. This invention relates to a small and lightweight storage device.

There are 7 situations in which it is necessary to review the items, but in the event of destruction or fire, the aircraft's kite recorder (L) must be kept away from high-temperature situations. The aircraft's arsenal BT is subject to very strong role I' constraints.In this regard, the scheduled time before aircraft destruction
In order to preserve the flight data assigned to the storage device by the flight data recording device 1 during data acquisition, the device was temporarily suspended to avoid any disaster. Ru//0
It must be constructed and arranged to withstand temperatures in excess of 0C (approximately 20θO'F') and be constructed to withstand the destructive and penetrating forces experienced in impact and secondary impact with other parts of the aircraft. .

The storage device of the flight data recording device has dimensions, weight,
It is subject to other design limitations imposed by requirements generally applicable to aircraft equipment and equipment, including limitations on cost, availability, and safety.

The technical advantage of electronic solid-state devices is that only field-effect transistor devices can be programmed and read, and high-capacity electronic storage devices are used for the immutable storage of digitally encoded data. However, transistor devices and bubble storage devices are one type of such storage devices. In other words, this kind of outfit @
The small, cynical, and compact design is the impetus for the replacement of magnetic tape transport used in today's flight recorder designs by solid-state storage devices.

Due to the increasing demand for heat shielding, tape transfer or other methods are used to store the memory device in a solid material that is a relatively good thermal insulator and is completely surrounded by a metal housing. The technology used today to install a flight data recorder memory device is that a semiconductor memory length +q (using z) of 1ζ rows of data recorders can be obtained as shown in Table 1. does not achieve the required overall reduction in storage size and storage size.

According to the invention, the device to be thermally secured iff″f:
Relatively compact and lightweight heat shielding is achieved through the use of solid-liquid phase change thermal insulators as part of the enclosure or enclosure. Solid-liquid phase change occurs 1
The temperature is selected to be (a) above the peak temperature encountered by the trowel during continuous cropping, and (b) at or below the desired peak temperature of the trowel.

When subjected to fire or other high temperature conditions, solid phase change materials and other thermal insulators used primarily act as thermal shields for thermal foils by exhibiting relatively high barrier properties.

When the bath-meltable material reaches the bath melting point, the material used to transfer thermal energy changes from a solid state to a liquid state, or is thermally melted, thereby effectively acting as a heat sink. The preferred embodiment of this invention maintains the maximum temperature reached when the flight recorder storage is exposed to still temperature conditions at an acceptable standard.
1. In a fire that produces a temperature sound of //θθ℃ (lamp λθθO'p') for 5 hours. is approximately 390'F' when the apparatus is left undisturbed for another hour.
Materials that are designed to maintain the flight recorder's solid-state electronics equipment at or below the maximum temperature of
H3.0,700HNC where the alkyd groups extend radially and linearly from the amide chains on both sides of the molecule! 2I(,NH,NH
There are synthetic organic waxes that are chemically formed as N,Nl-ethele/functional bis-stearamide, or fiN,Nl~distearoyl ethylene diamine, with the chemical structure OOO,,OH3,.

In terms of physical form, the flight recorder storage device described herein is an external material made of a metal that exhibits high conductivity and high resistance to crushing and puncturing.・I have Ujing money. An insulating layer of solid material exhibiting a relatively low thermal conductivity is centrally located within the outer housing and is inserted into each inner surface of the outer housing to form a shaped cavity Bf. ! It is in contact with i. The printed circuit board consists of seven or more printed circuit boards containing a nuclear device containing a solid-state electronic circuit board to be protected, and a synthetic wax material enclosing the printed circuit board in the form of a metal alloy in the central cavity. There is one illustration in the inner workings. Solint State Electronics is 1, Hangso Tetsu and 6
The connections between the printed circuit board and the outside of the outer housing are
The following details are in accordance with the accompanying drawings: It will be more fully understood from this explanation.

According to the present invention, the temperature is maintained at 4 hF and is designated by the reference numeral 10 in the figure. As is well known in the art, such a storage device stores data for scheduled time intervals that occur immediately before the flight recorder is deactivated (including deactivation that occurs when the aircraft is destroyed). To record important aircraft flight parameters (1%)
has been completed. In the creation i'tlJ, the information stored in the storage device is 1. A flight recorder, such as a flight recorder storage device, receives input signals from a large number of aeronautical sensors and processes the input signals to produce signals compatible with the record storage medium used. It is progressively supplied by another component of the record storage, bond media, etc. Only the memory circuit can be electronically erased and programmed.
4. of the body. The platform of the illustrated practical example of this invention, which uses solid-state electronic equipment, is equipped with a record acquisition device! ! 5. l
I:1 A digital signal is supplied continuously to and from the semiconductor storage circuit (Pr-) of the time-tested data display in each parameter being monitored.
In connection with the technology mainly used today, data compression is commonly used to allow the storage of digital signals representing a time course of 75 to 30 minutes for each monitored parameter.

1st. ．． As shown in Figure 2, an embodiment of the flight recorder storage device of the invention has a metal outer housing 7.2 of y-rectangular cross-section when viewed perpendicular to each major axis. Flanges/4t extend perpendicularly from the edges of both sides of the base of the outer housing/2 to facilitate mounting of the storage device 10 at a suitable location within the aircraft by bolts or other suitable fasteners. Since the rectangular cavities /6 extend inwardly from the seven sides of the outer housing 12 toward the base of the storage device 10, most of the outer holes 1 and 2 are shaped like rectangular shells. formed as a body.

The outer housing 2 is made of a titanium alloy or other material that has a relatively low density and a relatively high thermal conductivity, and is relatively strong against crushing or penetration at the wall portion, and is made of a titanium alloy or other material that has a relatively low density and a relatively high thermal conductivity, and is The space between the outer housing 2 and the outer surface of the outer housing 2 is formed to a size that can withstand crushing and penetration in the event of an aircraft crash. A box-shaped thermal liner /g formed in the cavity /6 of the outer housing 12 shields components located inside the flight recorder storage device 10 from high-temperature fires that may occur in the event of an aircraft crash. A second heat shield is formed for this purpose. The thermal liner has a rectangular cross-section with respect to each main axis and forms an inwardly extending cavity 2Of located within the cavity /6 of the outer housing /2. Thermal liner/g
A monolithic structure made of a solid material that is a good heat insulator with a low thermal conductivity K and a relatively low density is preferred. Suitable materials include John's of Tenbor, Colorado.
2θ is the refractory material manufactured and sold by Manpil Ltd., Abton Wirral in the UK, and Microbore Inshwarf 3F Ltd. in Merseyside, respectively.
There are thermal insulators that are suitable combinations of fibrous materials and very fine substances such as Oθ and MICROTHERM J.Of course, this material has very poor thermal conductivity, e.g. 70'Q deni-o, 1ttb, 1ioo
C'cK==0.27 ff and is commercially available today under the trade name "Microtherm" as a suitable material for thermal liner/g.

As best seen in FIG. 7, a relatively thin-walled box 22 provided within the cavity 2θ is provided with one or more printed circuits that provide support and electrical connection for a number of Norito state storage units 6. It stores wooden boards. Although the 4'l structure of FIG. 1 shows a conventional printed circuit device in which each solid-state storage device is encased to form what is known as a conventional dual-in-line package, other structures may be used. I can do it. For example, embodiments of the present invention may be used to program a large number of electrically erasable memories only directly onto a semicircular substrate or other support containing vacuum deposited or similarly made electrical interconnections. It may be advantageous to expose a semiconductor chip containing circuitry for reading the data.

In either case, the rationale for the generation of a suitable high-temperature heat-valley exchange, i.e., high-temperature heat capacity, is preferably made from materials such as stainless steel or other metals. Furthermore, since each printed circuit board is mounted within the central box 2.2, each solid state storage device, 26, is spaced apart from the inside surface of the box.

In order to provide the heat shielding of the KW provided by the present invention, the open portion between the inner wall of the central box and the printed circuit board 241 and the adjacent solid state storage device 26 is The required temperature limit for a meltable insulator exhibiting an in-phase liquid phase change below 2g
(Fig. 2) is filled. As shown schematically in Figure 3,
Such materials are characterized by a first temperature range in which the increase in thermal energy supplied to the material is based on a corresponding linear increase in material temperature below the melting point Tm in FIG. At the same time, the amount of heat energy supplied is
It is characterized by a relatively constant temperature range that melts i. As shown in FIG. 3, successive increases in the thermal energy applied to such old materials after reaching the molten state tend to vaporize the material, and by additional increases in the thermal energy applied, The temperature of the generated steam is increased. This latter characteristic is important to this invention and is the first
To prevent any evaporation from occurring when the flight recorder storage device/θ shown in the figure is subjected to high temperature conditions associated with an aircraft fire,
It is only that the meltable insulator 2g used in the embodiment of the invention is selected.

The fusible insulating material used today in embodiments of this invention has alkyds extending radially r (H3'a C1□00HIIO,H,N
H, NHOOo, 70113. N with the chemical structure of
Nl-ethylene bis stearamide, or N, Nl-
It is a chemically determined synthetic organic wax such as custearoyl ethylene-diamine. This type of synthetic wax is available from Glico Incorporated of Greenwinch, Connecticut as "ACRA WAX" (AC
N,Nl-ethylene, which is commercially available under the tradename 1(AW,,AXO)J and is currently available for numerous chemical applications not related to this invention; Bis-steazimide favors a moderate M4 structure exhibiting usefully different melting points. Additionally, the material is non-sterile and valid for a variety of structural formulas, making it compatible with conventional manufacturing methods.

[Referring to Figures 1 and 2 and the structure of the flight recorder storage device/θ, the printed circuit board, the 2-g air contact C, is connected to the densional strips spaced apart from each other. Flexible flat cable sections made of polyimide ribbons and other materials, including? Formed by 0. When the printed circuit board 2 is inserted into the central box λΩ, the cable member 3θ is inserted into the tag! ,2
i′1. rectangular notch 3a
extends through. Next, the box 2.2 includes a printed circuit board 21I, a solid stay), a storage device 26, and a cable member 30. ! :'fr: Cover @fused synthesis'i￥
4 Niswax is filled. An inner cover member having a rectangular metal plate 36 and a flange 3g extending perpendicularly from the metal plate 36 to engage with the inner walls of the two heathers. The internal force that actually seals the box 22 is formed by an insulator λg such as a meltable synthetic organic wax that melts in the event of an aircraft destruction or fire. Thermal shielding in the plane of the box unit λ can be achieved by using a rectangular thermal insulator l/g made of the same material used to form the thermal sinker l/g, such as the Bebbled “Microtherm” insulator mentioned earlier. , OK uphill formation Jl, ru. As shown in Section 1i, the insulator θ is preferably covered with a resinous fiber-reinforced resin plate 2 for ice preservation.

The Ωth rectangular cover plate made of the same material as the outer housing 7.2 actually seals the flight recorder storage device/θ and closes each rectangular surface of the flight recorder memory device @/θ. The flight recording device (C memory device (1 to 1)
Cover the open surface of outer housing/2 so as to sufficiently cover
Yes.

In particular, with reference to FIG. 1, the cable member passes through a rectangular slot 1I-6 into the cavity 16 of the outer housing/2. The connector g at the outer end of the cable member 30 corresponds to a connector 50 provided on the printed circuit board S. In the illustrated embodiment, a conventional electrical interface and control circuitry (not shown in FIG. 1) is used to continuously operate the solid-state memory device ω1 during flight recording operation. A printed circuit board 52 is provided in parallel to the plane of the outer housing 12. This control circuit is described in Solind State 1. It is not necessary for the data stored in the device to remain until later in order to save the data stored in the device, but failure may occur due to electromagnetic interference found in old aircraft equipment or other signals passing through the device. It is preferably mounted within the flight recorder storage IO to eliminate data errors.

To complete the flight recorder storage @10f and form an electrical connection between the system data acquisition device and the printed circuit board 5.2, the connector s4L'2 storage passes through the main surface of the U-shaped flange S7. It has a pupil/θ. As shown in FIG. 1, the seven ranks 56 are intersected in the outer housing 7.2 by connectors 52 spaced from the printed circuit board 52. Appropriately formed ribbon-shaped Kerpul 5
g forms an electrical connection between connector s4t and printed circuit board 5.2.

The degree of thermal insulation achieved by the practice of this invention is illustrated in FIG. 7, which shows the time versus temperature characteristic (curve bo >
and meltable insulator, 2g not included, but with the trade name Ml
N-2000 and “Microtherm (M-OROTHK)
RM) of the same dimensions using a relatively thick thermal liner/g made of the previously mentioned material commercially available in J.
Temperature versus time characteristics of two storage devices (curves A2 and 6 in Figure 7)
'l) is shown. Each of the three storage devices used to provide the data in FIG. t-yu C11
(3 inches), Length/2.2 CR ('1.g inches), Width/8'l Cm ('1.3 inches), Wall Thickness of Outer Housing 12 0.3 units CTLCO,/2! ; inches).

Accordingly, the rectangular cavities formed in the outer housings of the three storage devices yielding the data shown in Figure 1 are approximately 7 α (cm, 2 S inches) high and approximately / /, AC m ('
1. ! ; 5 inches), width approx. / q, g crnC'1
．． 2.5-inch). In a storage device Ut having a MIN-2000 or MICRT IRMJ f, which does not contain a fusible insulator, a storage device made in accordance with the present invention may be used as a thermal liner 16 with a thickness of 83 (Ju (066 inches)). Use it,
Lightness approx. s, 5cnL (2,/s inch), length approx.
SL: WrL (,3,,3!; inch), width approximately 7# (
WrLC3 inch) void (broom/vacancy 20 in the figure) is formed. Approximately 7 g Dougram (6.5 oz) melting point/
93"O(,?'?'F) of molten N-]'+1 ethylene and stearamide were placed in the central wall, and the solid-state memory associated with the printed circuit board Judah was fully exposed. There is.

The thermal performance of this invention can be easily seen from Figure 9,
The solid-state storage device tested was subjected to an oil burner that produced temperatures as high as 1000°F and 50,000 BTU/sq ft/hour of heat during hours. , indicates the temperature that can be obtained at or near a Norindo state storage device that can be allowed to cool down for a period of time. Of first importance, the maximum temperature achieved in the tested embodiments of the invention is approximately /76, b'Q
C3! rO'p>, but storage devices using 2000 insulators at MIN- reach a maximum temperature of approximately 337°C (approximately 6°F), and
RM) J i (storage devices using g-shaped bodies are approximately...?
/g, reaching a maximum temperature of 3°C (approximately 6os°F). Furthermore, MIN-K,! Storage devices using θO0 insulation (6 curves) achieved maximum internal temperature approximately 39 minutes after ignition of the oil burner, and storage devices using only "Microtherm" insulation (6 curves) reached maximum internal temperature after the burner was ignited. After about 55 minutes maximum internal temperature is achieved.

By comparison, the heat exceeds that of a surface memory device using solid insulators by 1.1'! Tested embodiments of the present invention exhibiting high performance achieve approximately 6 g/m (Omukai section temperature) after ignition of the oil burner.

Continuing to refer to Figure 9, the 30 minute burner
37-gη-yugO°P)
l: N-K 2000 Insulator bond / A O, 4℃.

,? , 2/”F) and about 20'1℃C about qoo'p>
It should be noted that the temperature is below that obtained in a storage device using During the period (time less than 30 minutes) required for the burner and storage device to be tested to reach peak internal temperature, the temperature of the tested example is 1st edition N-200θ and Microtherm insulation. Stays below the temperature of the surface memory device that uses only the body. The synthetic organic waxes used in the tested embodiments of this invention dissipate the stored thermal energy at a slower rate than either microtherm. The temperature in the example is somewhat higher than the temperature of one other storage device at the end of the test period (6'A, time equal to 5 hours) shown in FIG. The difference between a storage device having only a thermal lining and a storage device having only a thermal lining is important in maintaining the digitally encoded 'tljr information stored in the solid state storage device.

In particular, the capacity for corrupting bits of stored data increases not only as a function of the peak temperature achieved, but also in proportion to the length of time that the storage device is maintained at a substantially elevated temperature. As can be seen from FIG. 7 and clear from the foregoing description, the storage device of the tested embodiment of the invention is
- and receive less thermal energy than those of storage devices that use exclusively microtherm insulators. That is, the area below the curved edge 60 is curved i4.2, 611
Since the area under the O is also small, the temperature vs. time characteristics exhibited by this invention may release unwanted seeds of accumulated flight data for storage devices of comparable dimensions using only solid state heat sinks. can be recognized as substantially decreasing.

Although this invention has been described in terms of a presently preferred embodiment of a flight recorder storage device, it will be apparent to those skilled in the art that variations, changes and substitutions may be made therein without departing from the scope and spirit of this invention. Will. For example, although described as a storage device for an aircraft flight recorder rL, the invention can be applied to other locations requiring a compact and lightweight thermal insulator. This type of location is particularly relevant to aircraft and spacecraft, as more and more electronic devices are preferably implemented with analog circuit designs replacing digital methods.

Furthermore, the central box of the described embodiment is not a necessary feature of the invention and can be omitted if desired. Regarding this,
The presently preferred embodiment of the invention simplifies assembly and uses a central box as a housing to house the portion of the flight recorder storage that must serve to obtain the recorded flight data. There is.

[Brief explanation of drawings]

FIG. 1 is an exploded view of a flight recorder storage device constructed according to the present invention, FIG. 2 is a partial plan cross-sectional view of the flight recorder storage device of FIG. 1, and FIG. 3 is a diagram of FIGS. Phase diagram of synthetic organic wax stored in a container used in Example 7.
The figure shows the time vs. temperature characteristics of a flight recorder storage device having the same dimensions but using only ordinary solid insulating materials, and the temperature vs. time characteristics of an embodiment of the present invention. In the figure, /θ: flight recorder storage, lλ: outer housing, /F: flange, /6: void, 7g: thermal liner, λ
θ: place, saw = box, 2 tick printed circuit board, 6: solid state storage device, 2g: insulator, 3θ: cable member, 3.2: notch, 3g: inner cover part, 36: Gold heat plate, 3g: Flange, Daθ: Heat insulator, qλ: 4'
ThJ moon blind゛, llg: cover plate, g6: slot, 1g:
Connector, 5.2: Printed circuit sales, 5 da: Kota, 5g
:cable. l+□-

Claims (1)

Claims: 7. An outer housing having an internal cavity for enclosing one or more heat-sensitive items; The heat 2 insulator together with seven or more heat-sensitive items at a distance from the wall forms the λth internal cavity, the solid material remaining solid when the enclosure is exposed to high temperature conditions. 1 P! I! i) a shield occupying at least a portion of the first internal cavity, housing one or more heat-sensitive items, exhibiting a solid-liquid phase change at a predetermined temperature, and exhibiting a solid-liquid phase change when the enclosure is exposed to high temperature conditions and unprotected; The predetermined temperature is selected to maintain a second thermal insulator in the liquid phase when the enclosure is exposed to the hot condition, and the second thermal insulator is in a liquid phase when the enclosure is exposed to the hot condition. An enclosure device that thermally experiences heat-sensitive items. 2. The enclosure of claim 1, wherein the λ thermal insulator is a synthetic organic wax. Synthetic M machine wax is N,Nl-ethylene.
Bis-stear2mid and J1+1-distearoyl°
3. The recessed device of claim 2 chemically formed as ethylene diamine. 4. The enclosure of claim 3, wherein each heat sensitive item is a solid state electronic storage device storing data to be recovered from each solid state electronic storage device following exposure of the enclosure to high temperature conditions. an outer housing surrounding the one or more storage devices and forming a cavity that maintains the one or more storage devices below predetermined temperature limits when the storage devices are subjected to normal ranges of operating temperatures and elevated temperatures; Treat the outer housing wall with solid thermal insulation i.
A heat shield that houses each of the three or more storage devices and exhibits a solid progressive phase change at a predetermined temperature that is not higher than the predetermined temperature of the storage device and is higher than each temperature within the normal operating temperature range. A memory device that can be performed and persisted, which is fully characterized by having a body. 6. The crushable 6 self-storage electrical appliance of claim 5, wherein the second thermal insulator is a synthetic wax. 7 Synthetic KW machine waxes are chemically made as N,Nl-ethylene bissteamide and N,Nl-distearoyl ethylene diamine. g Flight data i'n #. seven or more solid-state storage devices for total acquisition; an outer housing having an internal full area for accommodating the seven or more solid-state storage devices; a thermal liner, at least a portion of which is spaced apart from the seven or more solid-state storage devices, exhibiting a solid-liquid phase change at a temperature exceeding a predetermined range of operating temperatures; a thermal insulator occupying at least a portion of an area formed by a thermal liner housing each of the two or more solid state storage devices, all of which are operable within a predetermined range of operating temperatures; An empty shaft crushable survivable storage device designed to store all recorded data when exposed to a predetermined range of high temperature VCC storage devices. q. The device of claim 1, wherein the thermal insulator is a synthetic wax. /0 @ Seishiki Wax is N,Nl-enalene ●Bis・
The memory device 1i (C0