JPS6069625U - composite board - Google Patents

composite board

Info

Publication number
JPS6069625U
JPS6069625U JP16162983U JP16162983U JPS6069625U JP S6069625 U JPS6069625 U JP S6069625U JP 16162983 U JP16162983 U JP 16162983U JP 16162983 U JP16162983 U JP 16162983U JP S6069625 U JPS6069625 U JP S6069625U
Authority
JP
Japan
Prior art keywords
substrate
composite board
metal plate
plate
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16162983U
Other languages
Japanese (ja)
Inventor
谷沢 太加夫
樽井 秀美
秀樹 大高
Original Assignee
日野自動車株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日野自動車株式会社 filed Critical 日野自動車株式会社
Priority to JP16162983U priority Critical patent/JPS6069625U/en
Publication of JPS6069625U publication Critical patent/JPS6069625U/en
Pending legal-status Critical Current

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  • Laminated Bodies (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、本考案の第1実例を示す断面図、第一2図は
、第1実施例の変形例を示す断面図、第3図は、本考案
の第2実施例を示す断面図である。 1・・・木質基板、2・・・金属板、3.4. 5・・
・木質基板。
Fig. 1 is a sectional view showing a first example of the present invention, Fig. 12 is a sectional view showing a modification of the first embodiment, and Fig. 3 is a sectional view showing a second embodiment of the invention. It is. 1... Wooden substrate, 2... Metal plate, 3.4. 5...
・Wood substrate.

Claims (3)

【実用新案登録請求の範囲】[Scope of utility model registration request] (1)木質基板と、この基板に接着された金属板とを具
備し、この金属板の厚さを上記基板の厚さの数分の一以
下としたことを特徴とする複合板。
(1) A composite board comprising a wooden substrate and a metal plate bonded to the substrate, the thickness of the metal plate being less than a fraction of the thickness of the substrate.
(2)上記基板は木材、合成木材、合板のいずれかであ
り、上記金属板は鉄板であることを特徴とする実用新案
登録請求の範囲第1項に記載の複合板。
(2) The composite board according to claim 1, wherein the substrate is made of wood, synthetic wood, or plywood, and the metal plate is an iron plate.
(3)上記金属板は一対の木質基板の間に挟まれている
ことを特徴とする実用新案登録請求の範囲第1項又は第
2項に記載の複合板。
(3) The composite plate according to claim 1 or 2, wherein the metal plate is sandwiched between a pair of wooden substrates.
JP16162983U 1983-10-19 1983-10-19 composite board Pending JPS6069625U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16162983U JPS6069625U (en) 1983-10-19 1983-10-19 composite board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16162983U JPS6069625U (en) 1983-10-19 1983-10-19 composite board

Publications (1)

Publication Number Publication Date
JPS6069625U true JPS6069625U (en) 1985-05-17

Family

ID=30355159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16162983U Pending JPS6069625U (en) 1983-10-19 1983-10-19 composite board

Country Status (1)

Country Link
JP (1) JPS6069625U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62229998A (en) * 1986-03-31 1987-10-08 清水建設株式会社 Electromagnetic shielding structure of assembly board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62229998A (en) * 1986-03-31 1987-10-08 清水建設株式会社 Electromagnetic shielding structure of assembly board

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