JPS606721A - Epoxy resin composition - Google Patents

Abstract

PURPOSE:The titled composition excellent in both low-temperature curability and workability, solvent resistance, heat resistance, etc., consisting essentially of a polyepoxy resin obtained by using a specified MW-increasing agent and a curing agent for epoxy resins. CONSTITUTION:An epoxy resin composition consisting essentially of (A) a polyepoxy resin with an epoxy equivalent weight of 200-2,000, obtained by reacting an epoxy resin of an epoxy equivalent weight of 100-800 (e.g., diglycidyl ether- type epoxy resin) with an MW-increasing agent containing 2.3-10 functional groups per molecule (e.g., novolak resin) and (B) a curing agent for epoxy resins (e.g., triethylenetetramine). While conventional epoxy resins have a disadvantage of poor low-temperature curability, the use of the above polyepoxy resin makes it possible to improve room-temperature air dryability and curability, especially, during winter or in a cold district and therefore to widen the scope of its application markedly.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a new and useful epoxy resin composition. The present invention relates to a resin composition comprising the resin composition as a component.

Epoxy (HJ resin) can be used in combination with various hardening agents to provide excellent adhesion and adhesion, water resistance, chemical resistance, electrical insulation properties, heat resistance, and low dimensional stability. It is used for a wide range of purposes, such as adhesives, electricity, and civil engineering, and is an essential industrial material that supports modern life.

By the way, such epoxy resins are generally obtained from ginenols, which can be said to be the main 1r component of epoxy resins, represented by bisphenol-A, and epoxy group-supplying compounds, typified by shrimp chlorohydrin. The main ingredients are epoxy resin and a curing agent such as a polyamine compound, and if necessary, a third substance such as a pigment such as talc is also combined to cure the resin through various curing conditions. Although it is used for many purposes, the curing method can be roughly divided into two types: it cures and dries by simply leaving it as it is as a natural phenomenon, without any intervention of so-called external factors such as heating. The so-called room-temperature dry-curing type, which is called curing, and external factors such as physical or chemical means such as heat and pressure are used alone or in combination to accelerate curing and drying and obtain the desired object. It can be divided into two types: a forced dry curing type and a forced dry curing type.

Among these, the forced dry curing type maintains constant drying power by maintaining the physical factors applied from the outside under constant conditions, overcoming climatic or climatic differences. It can be said that setting the curing conditions to No. 1 is also not so supinating and is rather relatively easy.

On the other hand, with room-temperature dry-curing types, it is almost impossible to expect that the ground or meteorological conditions are constant, and the so-called natural conditions become the dry-curing conditions, such as temperature, humidity, air flow, etc. Many factors, including , differ each time, resulting in a state that is artificially difficult to control.

In this way, although epoxy 4+1 resin is actually dry-cured using these two dry-curing methods,
In the case of 8 coatings, which are carried out under natural drying and curing conditions, epoxy resin paste is used for a wide variety of applications such as painting, adhesives, electrical applications, civil engineering applications, etc., and is especially used as an anti-corrosive coating for dog-shaped copper structures. Most of the "heavy-duty anti-corrosion paint" is air-dry T7
; Requires work under curing conditions.

In these fields, for example in the construction of ships, f! i′! There is a method of painting the materials and assembling them, and a method of painting them after assembly, and there are also methods of applying R9 according to each process, among others. If the materials used are large and irregular, and the same materials are not produced in large quantities, from an economical point of view, drying and curing conditions after painting should be based on natural phenomena. There is no other way than to use it as is.

Application fields that require the use of air-dry curing methods are not limited to the above-mentioned marine applications, but also paints and adhesives for steel pipes, bridges, large vehicles, aircraft, and buildings, as well as roads. It is used in a wide variety of civil engineering applications such as repair work.

However, such epoxy resin itself has various excellent customization properties as mentioned above, and is used in combination with various 4Φ curing agents.In particular, in the case of hardening by natural drying method, Although most of them are used in combination with amine-based curing agents, the biggest drawback of such usage is that they have poor low-temperature curing properties, and in some cases, curing may no longer occur at low temperatures. However, in the end, this is a major obstacle in the way that the expression of the excellent performance of epoxy resins is limited in terms of use, and this low-temperature curing property is the main problem that restricts the use of epoxy resins. It can be said that this is a major factor.

In order to solve the problem of low-temperature curing, which is a constraint on the use of these materials, the following methods have been developed: ■ Use of curing accelerators, ■ Use of thiocol-based curing agents that can react even at low temperatures, ■ Use of ester-type epoxy resins, or ■ Use of epoxy urethane.・The use of various systems has also been proposed and has been used to take advantage of the advantages of each.
A catalyst that causes a ring-opening reaction between an epoxy group and an imino group, such as a phenolic compound or an acid compound, is used as a curing accelerator, but although the effects of using such an accelerator are certainly recognized, This effect is limited to about 20'C at most, and if the temperature drops to 5°C or below freezing, not only will the accelerator effect not be recognized, but the accelerator itself will remain in the cured product and act as a factor in poor performance. There are 5 drawbacks to this, and in the case of (2), it is basically a reaction between an epoxy group and a mercapto group, and by appropriately using a curing accelerator in the case of (2) above, it can be cured even at sub-zero temperatures. Although it exhibits excellent curing properties, such as quick curing, it loses most of the properties expected of epoxy resins, such as ViH properties and chemical resistance.
This method is also not practical, and in the case of (2), the ester-type epoxy resin itself easily reacts with imino groups even at low temperatures, and furthermore, by using an appropriate curing accelerator, Although this method significantly improves low-temperature curing properties, it is also possible to achieve the best performance of epoxy resins such as water resistance and alkali resistance due to the large number of ester bonds present in the cured product. In addition, method (2) takes advantage of the specific groove edges of epoxy resin and utilizes the hydroxyl groups inherent in the (7j1 resin) or the hydroxyl groups further generated by modifying the resin. The method itself is an excellent system because it is cured with Incyane H1, a curing agent, and has good low-temperature curing properties. Compared to general-purpose epoxy-amine-based room-temperature curing products, they tend to foam easily and have fewer hydroxyl groups in the cured product, resulting in poor adhesion, poor long-term corrosion protection, and shorter topcoat intervals. However, it can be said that this method has many drawbacks other than low temperature curability.

Under these circumstances, there is a strong demand for an epoxy resin that maintains and further improves the original performance of the epoxy-amine system and has excellent low-temperature curing properties. Although it is not as good as N5 in terms of area, it provides an excellent answer to the proposition of shortening the drying and curing time compared to conventional resin compositions, even under relatively warm climate conditions, that is, even at higher temperatures. Not only strong 1tt
The demand for resins with excellent low-temperature curing properties has increased since the beginning of the use of epoxy resins, as they can reduce physical levels such as drying and curing time, even at even higher temperatures. It was a consistent and earnest message.

Therefore, the inventors of the present invention have conducted research over many years in order to meet these long-standing demands.As a result, we have succeeded in maintaining the original characteristics of epoxy resin while further improving it, and on the other hand, we have developed a technology that can be cured at low temperatures. The present invention was completed by discovering an epoxy resin that can fulfill the desired purpose.

That is, the present invention is obtained by reacting an epoxy resin (a-1) having an epoxy equivalent of 100 to 800 with a polymerizing agent (a-2) having an average number of functional groups in one molecule of 2.3 to 10. Epoxy per jHklr”-200 to 2,000i
, C74 functional epoxy resin N and a curing agent for epoxy resin (B) as essential components.Epoxy with particularly excellent low-temperature curing properties, as well as excellent workability, solvent resistance, and heat retention. The present invention provides a resin composition, in particular, as the polymerizing agent (a-2), a phenol-novolak resin or a resin obtained by modifying it with a novolak resin derived from a diphenol compound. The object of the present invention is to provide a resin composition which uses a polyhydric phenol such as a resin obtained by modifying xylene JPL resin or a resin obtained by modifying xylene JPL resin with phenol, substituted phenol, or phenol/novolac resin.

Here, the polyfunctional epoxy resin (Al) refers to a bifunctional phenolic hydroxyl group represented by bisphenol-A or bisphenol-F, with an epoxy tooth needle of 100 to 80[ ], more preferably 200 to 700[ ]. An epoxy tree 1f' having two glycidyl ether groups in the same molecule, which can be derived from a diphenol compound having
+￥ (a-1>, polyhydric phenols having an average of 2.3 to 10 phenolic hydroxyl groups, more preferably 2.5 to 6 phenolic hydroxyl groups in one molecule, that is, the average number of functional groups in one molecule is 2. The number of phenolic hydroxyl groups in the polymerizing agent (a-2) is 1 or less, preferably 0.5 or less per 1 epoxy group in the polymerizing agent (a = 1) of 3 to 10. A resin having an epoxy equivalent of 200 to 2,000, more preferably 220 to 1.800, which is obtained by reacting at a ratio such that it does not gel,
In addition, the above-mentioned dienol compounds include bisphenol-A,
Compounds represented by the general formula corresponding to bisphenol-F or their isomers; dihydroxyphenyl alkane M in which the benzene nucleus in 1 is substituted with a halogen atom such as chlorine or bromine or an alkyl group:
It refers to all compounds having two phenolic hydroxyl groups in the same molecule, including dihydroxybenzenes represented by the general formula or their nuclear alkyl-substituted or nuclear halogen-substituted substances.

From these diphenol compounds and an epoxy group-supplying substance such as epichlorohydrin, ebi-tetramuhydrin, or methyl epichlorohydrin, two molecules are synthesized in the same molecule by a known method such as that described in "Epoxy Resin" published by Shokodo. A so-called diglycidyl ether type epoxy I7r resin (a-1) having glycidyl ether groups is obtained.

Next, the above-mentioned polymerizing agent (a-2) is first obtained from a monophenol compound such as phenol and/or alkylphenol and formaldehyde, or is obtained from a diphenonyl compound and formaldehyde. , the so-called novolac tree J'δ is mentioned,
Next, use xylene (δI fat as a paste and modify it with phenol, substituted phenol, or phenol/novolac resin), such as 1 Glasstics A Vol. 53, No. 7, and No. 8, published by Ichiho Research Group. Examples include all modified phenolic resins as described above, and in addition, as mentioned above, examples include in-1 resins having an average number of functional groups in the range of 2.6 to 10.

Here, for example, in the above-mentioned general formula [1rD, the range of n=0.3 to 8 means that the phenol/novolak resin itself has n=0.1.2...
It is often obtained as a mixture of compounds,
It is noted that reference is made to the average value of such a mixture.

Therefore, although the polyfunctional epoxy resin (A) used in the present invention is obtained from the diglycidyl ether type epoxy 1rLI resin (a-1) and the polymerizing agent (a-2), , the ratio of (ll-1) and (a-2) used in this case is not limited to any range; First of all, it is necessary that the number of phenolic hydroxyl groups in a-2) is 1 or less, more preferably 0.5 or less, and in addition, the usage ratio is limited to the number of n in the above general formula [11f]. Since it is based on the phenolic hydroxyl group present in the molecule, it is necessary to select a usage range that does not cause so-called gelation.

Using the above-mentioned epoxy resin (a-1) and polymerizing agent (a-2) in the limited usage ratios as described above, for example, the above-mentioned "epoxy 4.tj resin" or JP-A-48
The desired multifunctional epoxy tree JJX# can be obtained by a known method such as that described in Japanese Patent No. 83199.

More specifically, the low temperature curability, which is one of the objects of the present invention, is the result of the polyfunctional epoxy 4&tJJiKA obtained in this way.
), and therefore it can be said that the combination of the epoxy resin (a-1) and the polymerizing agent (a-2) is the most important factor.

By bringing the temperature close to 2, the low-temperature curing factor is infinitely reduced.

Based on this knowledge, polyfunctionality in order to obtain practical low-temperature curability that meets the purpose of the present invention is defined as having an average number of functional groups of 2.6 or more, and with consideration to workability, etc. indicates an average number of functional groups of 10 or less.

On the other hand, the above-mentioned epoxy resin curing 71XB) refers to a substance that can react with the multifunctional epoxy resin to dry and harden the resin. In particular, amino groups represented by polyamines (
Imino group)-containing compounds or their conductor-containing compounds can be used, among which typical examples include aliphatic amines such as triethylenetetramine; aromatic amines such as diaminodiphenylmethane; [Laromine C-2<5O
J (West German BASF company 1.4 bis(4-amino-
6-methyl-cyclohexyl)-methane], amine compounds such as inphorone diamine or xylylene diamine, and amide compounds obtained from such amine compounds and fatty acids or dimeric fatty acids. or a polyamide amine compound, or an abad adduct amine compound or an amine adduct compound which is a pre-cocondensate of an amine compound and an epoxy resin, as described in the above-mentioned 1-epoxy resin. There are known and commonly used amine curing agents.

On the other hand, when performing forced dry smoke curing by applying external physical factors such as heat and pressure, in addition to the above-mentioned amine curing agents, dicyandiamide, modified dicyandiamides, or adipic acid dihydrazide can be used. Amines that react slowly with epoxy groups at room temperature such as various dihydrazides; acid anhydrides such as phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride or their alkylated products, trimellitic anhydride or pyromellitic anhydride; Known and commonly used curing agents such as resol type or novolak type phenolic resins, acid-rich polyesters, or melamine resins can be used.

The above multifunctional epoxy resin (A) and 4 mJ of epoxy
By using the curing agent (B) for iEf as an essential component, the required strength such as non-linkability, hardness, water resistance, and corrosion resistance can be obtained earlier in natural room temperature dry curing. Not only can it be used, but it also has good drying properties, especially in winter or in cold regions.
The range of applications can be greatly expanded, and in forced dry curing, the necessary strength can be obtained with less energy, so we can minimize the use of limited resources that are irreplaceable for humankind. It is possible to achieve so-called energy saving for the purpose of use, and in addition, there are many advantages such as shortening of the curing cycle and shortening of pMA type opening time.

The composition of the present invention may further contain, as necessary, curing accelerators, solvents, diluents, organic compounds such as autologous compounds or petroleum resins, and substances such as glasses, carbons, titanium, talc, and silica. Of course, inorganic substances such as pigments can also be included.

Next, the present invention will be explained in detail with reference to Reference Examples, Examples, and Comparative Examples, where all parts and percentages are based on weight unless otherwise specified.

Reference Examples 1 to 4 [Preparation examples of various polyhydric phenols as polymerized 71iIXBI] Monophenol compounds as shown in Table 1 and 67%
Use a specified amount of formalin, add 0.6 I hydrochloric acid, incubate at 80°C for 4 hours, neutralize with 10% aqueous sodium hydroxide solution until the pH becomes 15, and then Virtually detect excess monophenolic compounds by water vapor? Various phenol/novonolac reference example 5 [polyfunctional epoxy resin (
Preparation example of Al] In a 11-four flask equipped with a stirrer, a nitrogen inlet tube, a thermometer, and a condenser, a
50Jf: 190g of Daime Ink Kagaku Kogyo (epoxy resin obtained from scooped bisphenol and shrimp chronohydrin in 1901) and 22,1 of phenol resin (a-2-1), !i+, that is, 0.18 phenolic hydroxyl groups per 1 epoxy group.
Furthermore, 0.4 g of 1% aqueous sodium hydroxide solution was added and reacted at 140°C for 5 hours, and then 90.9.9 of methyl isobutyl ketone was added to prepare the desired tree. I got it. This is a resin solution with an epoxy equivalent of 260 and a non-volatile content of 70%, and is hereinafter abbreviated as resin (A-1).

Reference example 6 (same as above) In the same manner as reference example 5, 1709 “Ebichron 860
” (Product S, manufactured by the same company, with an epoxy equivalent of 170 obtained from bisphenol-F and epichlorohydrinone)
22.1.9 phenol (?)
1 fat (A-2-2), that is, phenolic hydroxyl groups [), 21 (+, 'il) for 51 epoxy resins, and further 1% hydroxylation. 064g was added and reacted at 140°C for 4 hours,
Next (add 82.?L of methyl in butyl ketone to the desired resin FA). It's I. This is a copper fat solution with an epoxy equivalent of 243 and a non-volatile content of 698%, and will hereinafter be referred to as resin J]fi(A-2).

Reference Example 7 (same as above) In place of polyhydric phenol (a-22), 7 g of phenol l'iJ fat (a-23) was added, that is, 0.21 phenolic hydroxyl groups per 1 epoxy group. and methyl isobutyl ketone in a proportion of 87.3
In the same manner as in Reference Example 6, except that the epoxy resin was changed to 600, the target resin (FFJ liquid with a non-volatile content of Al of 70.5%) was used as IQ. ]It is abbreviated as 1t(A-3).

Reference Example 8 (same as above) Instead of the polyhydric phenol (a-23), the phenolic resin (a-2-4) of the same (, ()) was used, that is, phenolic water per 1 solid of F]coxy group. The objective jθjJ with an epoxy equivalent of 268 was carried out in the same manner as in Reference Example 7, except that the ratio was changed to 2 units U and 21 units.
A J-tone bath 1 with a nonvolatile content of 708% was obtained. Hereinafter, this will be abbreviated as resin (A-,!l).

Reference Example 9 (same as above) In the same manner as Reference Example 5, 260g of “Ebikuron 860
'' (manufactured by the same company, Kougetsu Mixi TM 0, which has an epoxy equivalent of 260 made from bisphenol-A and epichlorohydrinone, and 41.4 g of phenol resin (a
-2-1) in a ratio of 035 phenolic hydroxyl groups to 1 epoxy group, and further 1%
Add 0.6g of sodium hydroxide aqueous solution σ) and raise to 160°C.
for 5 hours, then 1 of methyl isobutyl ketone
00.5. ! 9 and xylene 1-00. By adding i, the epoxy weight becomes 465. () The non-volatile content of period N is 60.
．． A 5% solution was obtained. Hereinafter, this will be abbreviated as resin (A-5).

Reference Example 10 (same as above) Instead of polyhydric phenol (a-2-1), the same amount of phenol'! f'111i1 (a 2 = 2), that is, 0.3 phenolic hydroxyl group per 1 epoxy group.
A solution with a non-volatile content of 598% of the objective resin particles with an epoxy equivalent of 470 was prepared using the same quartets as in Reference Example 9, except that the proportion was changed to 9. Hereinafter, this will be abbreviated as resin (A-6).

Reference Example 11 (h) 71 Preparation Example of Amino Group-Containing Compound) 100! Charge triethylenetetramine (I) and raise the temperature to 80°C while purging nitrogen gas, and when the same temperature is reached, [Epicor] 1001J (epoxy resin manufactured by Shell, Netherlands; epoxy current = 475.7
75I (5% xylene solution) was added over a period of 2 hours, and stirring was continued for 2 hours even after the temperature was raised to 100°C.Then, residual triethylenetetramine was removed by distillation under reduced pressure, and then 55.8.9 parts each of toluene and n-buknol were added to obtain a solution of the target compound of amine (ilIi: 680 and active hydrogen equivalent: 125).

Examples 1 to 18 and Comparative Examples 1 to 6 Each polyfunctional epoxy resin (Al
and the amino group-containing compound obtained in Reference Example 11.
Object of the present invention 4j'1l
A lti silk composition and a control resin composition were obtained.

However, in obtaining the control 4111 fat composition,
Instead of multifunctional epoxy i9J) mAJ, commercially available epoxy 41Jil, U Ebicuron 860, respectively.
and 1-Epicron 1050J (epichlorohydrin bisphenol A type epoxy from 1+M, lI'
f: l fat; epoxy equivalent: -475) was used.

For each resin composition obtained by coating, a coating film was obtained in the following manner. are summarized in the same table.

1) Painting period: JIS cold rolling 61 plate (0.8 x 70 x 150 mm) specified in JIS G-3i1.
K-5400-1970, 3/6; Use a V1 tube purified by the method specified in (3).

2) Painting method 2 Apply JIS K-51 to the above-mentioned materials.
00-1970, 3/5; (The thickness of the coating after drying + 1!21 yen according to method 11 was 100 ± 6 in the clear test.
μm, 300±6 for pure test and tar test
I painted it to make it μirn.

3) Paint film drying method: Dry for 7 days in a constant temperature room at 25°C.

However, only when preparing coatings for low-temperature curing tests and walking tests, dry immediately after painting in a constant humidity chamber at 5°C.

Test method and evaluation The tests were carried out in a conventional manner using the commonly used ff1il humidity test rock and the salt water jet Ij tester.

The degree of change in the painted surface before and after each test was visually determined and evaluated.

4-2) Goban Mekkoku Foil Test (・y (Cross Cut Test) Make 11 vertical and horizontal scratches on the painted surface with a razor blade at 1-diameter intervals to create 100 square cells of 1 mm x 1 mm.
Apply cellophane tape to this area, then forcefully peel it off.

4-3) Pencil hardness Evaluated by drying at 25° C. for 24 hours according to JIS K-5401 (1969).

4-4) Low temperature curing JIS K-saot+-1970, 5°10: f
2) According to (b), evaluate after leaving at 5°C for 36 hours.

4-5) Walking test After drying at 5°C for 24 hours, the coated surface was stepped on with safety shoes (load: approximately 60 kg) and evaluated by determining whether or not walking was possible.

/ Reference Example 12 [Preparation example of each polyhydric phenol as polymerizer FB + barrel] 228I of bisphenol-A was added to 70 Jil of hot water.
/mlF, 12F of 20% oxalic acid aqueous solution was added, the temperature was raised to 100°C, 41.5% formalin was added dropwise, and after being kept at the same temperature for 6 hours, the final temperature was 180°C. Dehydration was carried out over a period of 3 hours at a temperature of
and the average number of functional groups is 8.0, bisphenol-
A novolak resin derived from A was obtained. Hereinafter, this will be abbreviated as polyhydric phenol (a-25).

Reference Example 12 [Preparation example of polyfunctional epoxy resin fA1] Instead of polyhydric phenol (a-2-2), polyhydric phenol (a-25) of 16.3.9 was added to one epoxy group. 0.14 phenolic hydroxyl groups, and 92% methyl in butyl ketone and xylene.
．． The purpose is to make epoxy 320 in the same month as in Reference Example 10 except for changing to use 1.9f.
A solution with a nonvolatile content of fat (A) of 602% was obtained. Hereinafter, this will be abbreviated as ``I fat (A-7)''.

Reference Example 16 (same as above) Instead of polyhydric phenol (a-25), 15.711
[Dicanol P-10DJ [Phenol-modified xylene resin manufactured by Mitsubishi Gas Chemical (1); Phenolic water WR]
Reference example except that J8 equivalent + 1 = 194, numerator = 800, average number of functional groups = 4.1), that is, used at a ratio of 0.08 phenolic hydroxyl groups to 1 epoxy group. Similarly to 12, the epoxy equivalent is 3
A solution with a target resin (Al nonvolatile content of 598%) named 00 was obtained.Hereinafter, this will be abbreviated as resin (A-8).

Reference Example 14 [Same as above] In the same manner as Reference Example 5, 190g of "Epicron 850
'', bisphenol-A of 65.511 and 05 g of 1% sodium hydroxide aqueous solution were reacted at 140°C for 4 hours to obtain an intermediate diglycidyl ether with an epoxy equivalent of 600, and then 15.7.9 of A polymerizing agent polyhydric phenol (a-21) was added at a ratio of 0.43 epoxy groups to 015 phenolic hydroxyl groups and reacted at 160°C for 7 hours. V of methyl isobutyl ketone and xylene were added to prepare a solution of resin (A) having an epoxy equivalent of 980 and a non-volatile content of 596%. Hereinafter, this will be abbreviated as resin (A-9).

Examples 19 to 21 and Comparative Examples 7 to 9 [Epiclon B-57DJ (alicyclic acid anhydride manufactured by the same company) and [Epiclon B-4400J (alicyclic tetrabasic acid anhydride manufactured by the same company)] A glass blade was impregnated with each resin composition obtained using the compounding ratio (solid content weight ratio) as shown in Table 5, and then the solvent was evaporated, and then a torsional free damping type viscoelasticity measuring device was used. The relative rigidity and logarithmic attenuation were measured using the same method, and the glass transition point (Tg), which is an important factor representing heat resistance, was determined. The results are summarized in the same table.

From the results in Table 5, it can be seen that the composition of the present invention has excellent heat resistance.
In obtaining a product with a Tg of 66° C., the heat curing conditions can be halved.

These results demonstrate the effectiveness of the composition of the present invention for applications such as laminates that require heat resistance.

Examples 22 to 30 In the same manner as Examples 1 to 18 and Comparative Examples 1 to 6, target compositions of the present invention were obtained, coating films were obtained, and then similar evaluations were attempted for each coating film. The results are summarized in Table 6.

However, Examples 22 to 24 are for clear paints, Examples 25 to 27 are for enamel paints, and Examples 28 to 3 are for enamel paints.
゜ indicates the case of tar-epoxy IT# resin paint.

From the results of the Examples shown above, the composition of the present invention not only has excellent low-temperature curability, but also has excellent properties such as corrosion resistance.

Agent: Patent Attorney Katsutoshi Takahashi

Claims (1)

[Scope of Claims] 1. An epoxy resin having an epoxy equivalent of 200 to 800, obtained by reacting an epoxy resin with a N epoxy equivalent of 100 to 800, with a polymerizing agent having an average functional group number of 2.3 to 10 per molecule.
By using a polyfunctional epoxy resin of 2.000 and a hardening agent for BL epoxy resin as essential components, it has excellent low-temperature curing properties, as well as excellent workability, strong bathing properties, and heat resistance. Epoxy resin composition. 2. The woven yarn 11 composition according to claim 1, wherein the polymerizing agent is a novolac resin obtained from phenol and/or substituted phenol and formaldehyde. 6. The composition according to claim 1, wherein the polymerizing agent is a resin obtained by modifying a novolak resin obtained from a diphenol compound and formaldehyde. 4. The polymerizing agent converts Gysilene θI fat into phenol,
11. The composition according to claim 1, which is a 111 fat modified with a substituted phenol or phenol novolac resin.