JPS6066136A - Peeling-off testing method of semiconductive layer - Google Patents

Abstract

PURPOSE:To put the titled layer to a peeling-off test which is capable of judging exactly adhesive strength conforming with the actual condition, and its uniformity by making a sample fitting base freely slidable to a rail, etc. of the tension shaft side of a tension tester so that a peeling-off point of a semiconductive layer always comes onto a tension axis. CONSTITUTION:A sample fitting base 6 is made freely slidable to the rail 4 of tension shaft 2 side of a tension tester, and the lead-out of a peeling-off point 9 of a semiconductive layer 8 on the insulator 7 of a cable is held by a measuring chuck. In this state, when peeling-off of the layer 8 is executed by operating the shaft 2, the base 6 moves to the left, the peeling-off point always comes onto an axis of the shaft, the peeling-off angle goes to 90 deg., and it is possible to execute a peeling-off test capable of deciding exactly an adhesive strength conforming with the actual condition, and its uniformity.

Description

Detailed Description of the Invention <Technical Field of the Invention> The present invention relates to a peel test of a semiconducting layer of an electric cable, or a semiconducting test in which the peeling point of the semiconducting layer is constantly peeled at an angle of 90 degrees. This invention relates to a layer peel test method.

TECHNICAL BACKGROUND Electrical cables are provided with semiconducting layers between a conductor and an insulator and on the insulator to reduce the electric field.

By the way, from the standpoint of electrical properties, it is preferable that the insulator and the semiconducting layer be in close contact with each other, but it is desirable that the semiconducting layer be easily peeled off during connection and terminal construction, and this condition is important. One of the tests to determine whether the requirements are met is a peel test of a semiconducting layer.

Up until now, peeling tests for semiconducting layers have been carried out by folding back the semiconducting layer that has been peeled off from the adhesive surface 180 degrees and holding the insulating layer part in the measuring chuck of a tensile testing machine, as shown in Figure 3. However, this method does not match the actual situation of semiconducting layer peeling work during electrical cable connection and terminal processing, and is not appropriate as test data for determining the difficulty of semiconducting layer peeling work based on the peel test results of semiconducting layers. I couldn't say that there was.

Under these circumstances, a test method was proposed in which the semiconducting layer was peeled off at a 90 degree angle to the adhesive surface, and the test was conducted using the method shown in Figure 2. In this method, the angle of the semiconducting layer to the adhesive surface at the peeling point is less than 90 degrees at the beginning of the peel test, and becomes larger than 90 degrees at the end of the peel test. It was not possible to obtain data on which a judgment could be made.

<Object of the Invention> The present invention solves the above problems and provides a semiconducting material that is suitable for semiconducting layer peeling work and that can obtain data that can determine the adhesive strength and uniformity between an insulating layer and a semiconducting layer. The purpose of this invention is to provide a method for testing layer peeling.

<Structure of the Invention> A sample of an electric cable with a semi-conductive layer exposed is attached to the stand, which is slidably attached to the tension shaft of the tensile tester or the base. This method is characterized in that the protruded end of the semiconductive layer is held by the measuring chuck of the tensile testing machine so that the peeling point is always on the tensile axis.

<Example> Next, an example of the present invention will be described with reference to the drawings. 1 is a sample mounting device set on a chuck 3 at the upper end of a tensile shaft 2 of a tensile testing machine, and consists of a rail 4, a linear ball bearing 5, and a sample mounting table 6.

The sixth step is to attach the sample using an electrical cable with a length of 4ocm.
7 A slit S with a width of 12.7 mm reaching the insulating layer in the length direction is made in the outer semiconducting layer 8 on the edge body 7 , and the outer semiconducting layer is peeled off by 5 cm from one end.
A peeling test of the semiconductive layer is performed by attaching the peeled portion 9 to the measuring chuck of the tensile testing machine and operating the tensile shaft.

In this example, a rail was used as the base, but it is also possible to use a base with dovetail grooves and attach a stand to the sample via ball bearings.In short, as the peel test progresses, the sample can be attached to the stand. Any means may be used as long as it moves easily and the peeling point is always on the tension axis.

By doing the above, as the semiconducting layer peels off from the insulator and the peeling point P moves, the sample mounting table moves to the left in the drawing, and the peeling point P is always on the tensile axis and the peeled endothelium moves. It is now possible to maintain the angle at 90 degrees, which suits the actual situation of semiconducting layer peeling work, and it has become possible to accurately measure the adhesive strength and uniformity of the semiconducting layer in accordance with the actual situation.

[Brief explanation of drawings]

Figure 1 is an explanatory diagram of the sample mounting apparatus used in the semiconducting layer peeling test method of the present invention, Figure 2 is an explanatory diagram of the conventional semiconducting layer peeling test apparatus used in the 90 degree peel test, and Figure 3 is 18
This is an explanatory diagram of a semiconductive layer peeling test in 0 degree peeling, and the symbols in the figure are as follows. 1: Sample mounting device 2: Tensile shaft of tensile testing machine 3: Chuck 4: Rail 5: Linear ball bearing 6: Sample mounting table 7: Insulator 8: External semiconductive layer 9: Peel off the opening! ! ls Nislit P: Peeling point patent applicant Tuck Electric Wire Co., Ltd. Representative Takeo Oishi

Claims (1)

[Claims] For mounting a specimen (set on the tensile side of a tensile testing machine) or slidably attached to a base, attach an electrical cable sample with a semiconducting layer exposed to the stand, and then attach the sample of an electric cable with a semiconductive layer exposed to the base, and A peeling test method for a semiconducting layer, characterized by gripping it on the measuring chuck of a tensile tester so that the peeling point is always on the tensile axis.