JPS6063114A - Mold releasing agent compound - Google Patents

Abstract

PURPOSE:To obtain mold releasing agent that prevents a product from adhering to a hot press and a patch plate and is excellent in mold release characteristic in urethane foaming and can be applied to a metallic surface by combining polyisocyanate compound, specific wax and water. CONSTITUTION:(A) polyisocyanate compound (such as trilene diisocyanate etc.), (B) wax with a melting point 60 deg.C and more (preferably, petroleum wax or low molecular weight PE) and (C) water are mixed to obtain the object mold releasing compound. It is most preferable that the weight percentage of compound A to compound B is 99:1-50:50 and that of compound A to compound C is 80:20- 20:80. If the metallic surface is coated with the object compound and then heated or the metallic surface kept at a high temperature is coated with the objective compound, a better release effect can be obtained. If the objective compound is used as part or all of the binder to a molded piece as well as coating material of the metallic surface, more improved releasability is obtained.

Description

[Detailed Description of the Invention] At present, it is said that the adhesive applied to plywood and sheets (-takele board, etc.) by iron hot presses may adhere to the hot press or caulking plate due to long-term operation. Problems have frequently arisen.In particular, methods using thermoplastic resins such as synthetic rubber latex or incanate compounds such as polymeric MDI as adhesives have become popular. When such an adhesive is used, the adhesion force to a hot press or a backing plate is extremely large, posing a major problem in work, and no fundamental solution has yet been found.

In addition, when molding urethane foam, there is a problem with the molded product separating from the mold, and silicone resin etc. are used as a mold release agent, but the number of effective mold release times with one application of mold release agent is limited. Therefore, there was a drawback that workability was significantly hindered.

The present invention eliminates such drawbacks, and includes (a)
This is a mold release agent composition for coating on metal surfaces, the main components of which are a polyisocyanate compound, (b) a wax having a melting point of 60° C. or higher, and (C) water.

The polyisocyanate compound used in the present invention includes virtually any polyisocyanate. For example, tolylene diisocyanate, methylene diphenyl diincyanate, polymethylene polyphenyl polyisocyanate (hereinafter referred to as polymeric MDI), sodium diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, methylene dicyclohexyl diincyanate, triphenylmethane triisocyanate, etc. can be given. Also, isocyanate-terminated prepolymers produced by the reaction of excess polyisocyanate with hydroxyl-terminated polyesters or hydroxyl-terminated polyethers, and monomeric polyols such as ethylene glycol, trimethylolpropane or butanediol or Incyanate-terminated prepolymers obtained by reaction with mixtures thereof are included. Also included are masked isocyanates in which an in7anate group is synthesized by a known method using phenol, caprolactam, bisulfite, or the like. Furthermore, JP-A-57-183755, JP-A-57
- Adding a silicone-containing surfactant to a product obtained by reacting a compound obtained by adding ethylene oxide or ethylene oxide and propylene oxide to a monofunctional alcohol on an organic polyisocyanate such as that described in 185755, or Also included are incyanate compositions that are formed without additives and are water emulsifiable.

The wax used in the present invention has a melting point of 6
There is no particular restriction as long as it is above 0°C, but particularly preferred examples include carnauba wax, hydrogenated castor oil, and cellosol 52.
4 (Made by Middle East Oil, Carnauba wax emulsion ti
1 minute 30%), animal-based beeswax, Cellosol 531 (Made by Middle East Oil & Fat, beeswax emulsion solid content 30%), petroleum-based products include microwax,
Examples include Cellosol 967 (manufactured by Middle East Oil Co., Ltd., micro wax emulsion, solid content 50%), low molecular weight polyethylene, Polylon 593 (manufactured by Middle East Oil Co., Ltd., low molecular weight polyethylene wax emulsion, solid content 60%) slack wax, etc. However, it is preferable to use petroleum wax. Although the molecular weight of the low molecular weight polyethylene is not clearly indicated, it is generally preferably in the range of 500 to 5,000.

Those with a melting point below 60°C cannot be used because there is a risk that the mold release effect will be insufficient. Although the detailed reason for this is unknown, when it is employed in hot pressure molding, the effect is significantly impaired.

It is necessary to use water together with the polyinocyanate compound and wax. If water is not used, the reaction of the polyisocyanate compound will not proceed sufficiently and the effect of adhering the wax to the metal surface will be weak.

In the present invention, (a) a polyincyanate compound, (b)
) Wax having a melting point of 60° C. or higher and (C) water are not particularly limited, but the weight ratio of wax (a)
):(b)=99.5:0.5-10:90
is preferable, more preferably said (a): said (b) to 9
The range is 9:1 to 50:50.

The ratio of (a) and (C) is (a):(c)=9
The ratio is preferably from 9:1 to 1:99, more preferably from (a):(c) to 80:20 to 20:80.

These numerical ranges indicate the range in which a particularly excellent mold release effect can be expected, and if it deviates from these numerical ranges, it does not mean that there is no effect at all.

The amount of the mold release agent composition of the present invention to be applied to the metal surface cannot be specified as it varies depending on the conditions of use, but it is in the range of 0.1 to 100 g per square meter as the total amount of the polyisocyanate compound and wax. is appropriate.

The mold release agent composition of the present invention may be applied to a metal surface and used as is; By applying the mold release agent composition of the present invention to the metal surface, the mold release effect becomes even more excellent.

Furthermore, the mold release agent composition of the present invention not only obtains a mold release effect by applying it to a metal surface, but also can be used as part or all of the binder of a molded product such as particle board. The mold releasability is dramatically improved. This point cannot be predicted at all from conventional technology.
It is quite remarkable.

By using the mold release agent composition of the present invention, the problem of product adhesion to presses and backing plates in the plywood particle board manufacturing industry can be solved, and furthermore, the use of thermoplastic resins such as synthetic rubber latex as adhesives can be solved. The significance of making it possible to use polyinsyanate compounds such as polymeric MDI is extremely significant. Further, when molding urethane foam, the problem of separation from the entire mold is significantly improved by using the mold release agent composition of the present invention, so the practical effect is extremely large.

Next, the present invention will be explained with reference to Examples, in which all parts and ratios are by weight.

Reference νsu1 TDI 80/20 (2. of Mitsui Nisso Urethane Co., Ltd.)
80/20 (weight ratio) mixture of 4-tolylene diisocyanate and 2.6-)lylene diisocyanate, N0
0 = 47.8 parts) and DIOL-1000 (Mitsui Nisso Urethane Co., Ltd.'s hydroxyl-terminated polyether polyol, average molecular weight = 1000, OH value = 112) 5
0 part was charged into a reactor and reacted at 90°C for 2 hours with stirring. The resulting reaction was Ne.

Reference Example 2 100 parts of MDI-0-200 (polymeric MDI from Mitsui Nisso Urethane Co., Ltd., NOO%=31.0%) and 710 parts of methylol propane was added to the reactor, and the reaction was carried out at 85°C for 2 hours with stirring.

The obtained reaction product has a N00 of 47.3%, and is hereinafter abbreviated as 15O-2.

Reference Example 5 100 parts of MD 1-0R-500 (Polymeric MDI, N00 = 470.8H, manufactured by Mitsui Nisso Urethane Co., Ltd.) and 3 parts of Compound A represented by the following molecular formula were charged into a reactor, The reaction was allowed to proceed at 70°C for 6 hours with stirring. The reaction product obtained was N00=47.5H, hereinafter abbreviated as 15O-3.

Examples 1 to 10 Four types of polyisocyanate compounds, 180-1, 15O-2, 180-3, and MDI-OR-200 (mentioned above), which are the reaction products of Reference Examples 1 to 3, and Cellosol 524 as wax. (Middle East Oil Co., Ltd., carnauba wax emulsion, solid content 30 t), Cellosol 967 (Middle East Oil Co., Ltd., micro wax emulsion, solid content 5 oz)
l), Cellosol 531 (Middle East Oil Co., Ltd., beeswax emulsion, solid content 60 t), Polylon 393 (Middle East Oil Co., Ltd., polyethylene wax emulsion, solid content 5
A mold release agent composition was prepared by combining the four types (o%) and water in various proportions. The mold releasability was evaluated by the following manufacturing test of urethane foam and particle board plywood.

Method for producing urethane foam: A release agent composition was applied to the surface of a mold for producing urethane foam so that the total amount of polyisocyanate compound and wax was as shown in Table 1.

A urethane composition was prepared by mixing the following ingredients in the order listed.

Ingredients Part Stanus Octoate 04 Triethylenediamine 1.2 Water Z4 Trichlorofluoromethane 10.0 Tolylene diisocyanate 960 This mixture is poured into a mold and heated to a temperature of about 120°C for about 2 hours.
0 minute sword I] i prefecture.

The mold releasability of the formed 7-ohm urethane from the mold is shown in the table below.
Shown in 1.

Plywood manufacturing method-1: A mold release agent composition was applied to a cold press and a hot press used for making plywood so that the total amount of polyisocyanate compound and wax was as shown in Table 1.

An adhesive was prepared by blending 10 parts of crosslinking agent 100AG with 100 parts of water-based vinyl urethane resin MR-112. (M Ru 112,100AG manufactured by Mitsui Toatsu Chemical Co., Ltd., trade name) 1.0+ 1.0- using this adhesive
1-1.0 Mi IJ veneer plywood coating amount 2sy/9
007, the compression conditions were cold pressure 10 kg.
/Crl −, 10 mi, rb, heat pressure 120°C, 1-4
．． The above-mentioned mold release agent composition was applied at a ratio of 10 to 9/Cf/l, and plates were made by cold press and hot press.

Table 1 shows the releasability of the formed plywood from cold pressing and hot pressing.

Plywood manufacturing method-I: In plywood manufacturing-I, the pressing conditions were cold pressure 10ky/d.
, 3 Jr. Plywood was manufactured under the same conditions except that only 3 Jr. Table 1 shows the releasability of the formed plywood from cold pressing.

Particle board manufacturing method-1 The mold release agent composition is added to a hot press for particle board manufacturing, and the total amount of polyisocyanate compound and wax is shown in Table-1.
I applied it to the desired amount.

MDI U emulsifiable for wood chips with a moisture content of 7 tons
A 50% water emulsion of R-4000 (manufactured by Mitsui Toatsu Chemical Co., Ltd.) was applied at a resin spraying rate of 6%. Table 1 shows the mold releasability of particle boards molded using these chips and hot press upon depressurization.

Heat and pressure conditions 160℃ 4m, Ln, 30kg/C
RL particle board manufacturing method-n: The total amount of polyisocyanate compound and wax is as shown in Table 1.
It was applied in the amount stated in .

A mold release agent composition with the same composition as that applied to the hot press was applied to wood chips with a moisture content of 7% at a spraying rate of 6q.
It was painted to look like b. Next ℃1 and this Jt et al.

The takele board was molded using a hot press and the mold releasability when the pressure was released is shown in Table 1.

Heat pressure + case 160℃ 4 rn, L n, 30 kg/
CI! (Note 1) The evaluation is shown after applying the mold release agent composition to the metal surface and repeating the molding operation of urethane foam, plywood, or particle board a predetermined number of times.

(Note 2) In the mold releasability judgment, ○ mark indicates that no adhesion occurs at all when the pressure is released, and Δ mark indicates that there is a slight amount of adhesion to the press or backing plate when the pressure is released, but it does not interfere with work. show,
The X mark indicates that the product adheres strongly to the hot press and backing plate during depressurization, causing a major hindrance to the work.

(Note 6) A mark in the table indicates that the test has not been conducted.

Comparative Example 1 A urethane foam was produced according to the urethane foam H& method shown in the Examples section without treating the mold surface with a mold release agent composition, but the urethane foam could not be separated from the mold.

Comparative Example 2 Plywood was manufactured according to the method for manufacturing plywood shown in the Example column - ■ without treating it with a mold release agent composition during cold pressing and hot pressing, but the adhesive did not protrude or seep from the original board. If there was any ejection, the plywood would stick to the cold press or press.

Comparative Example 6 Example column ((Plywood was manufactured without being treated with a cold press mold release agent composition according to the plywood manufacturing method shown in H. In some cases, the plywood stuck to the cold press.

Comparative Example 4 Manufacturing method of particle board shown in the Example column-1
Although particle board was produced without treating the hot press with a release agent composition according to the method, the board stuck to the hot press when the pressure was released.

Comparative Example 5 Method for manufacturing particle board shown in the Example column
■ without treating the hot press with a mold release agent composition according to
Using the mold release agent compositions of Examples 7 to 10 shown in Table 1 as a binder] (- Tickle board was produced, but upon removal) Adhesion of the takele board to the hot press occurred.

Patent applicant Mitsui Toatsu Chemical Co., Ltd.

Claims (1)

Scope of Claims: (1) A mold release agent composition for coating on metal surfaces, the main components of which are (a) a polyinocyanate compound, (b) a wax having a melting point of 60° C. or higher, and (C) water. (2) The composition according to claim 1, wherein the wax is a petroleum wax. (6) The composition according to claim 2, wherein the wax is low molecular weight polyethylene.