JPS6062444A - Dieing device - Google Patents

Dieing device

Info

Publication number
JPS6062444A
JPS6062444A JP59081773A JP8177384A JPS6062444A JP S6062444 A JPS6062444 A JP S6062444A JP 59081773 A JP59081773 A JP 59081773A JP 8177384 A JP8177384 A JP 8177384A JP S6062444 A JPS6062444 A JP S6062444A
Authority
JP
Japan
Prior art keywords
blade
light
indicated
breakage
motor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59081773A
Other languages
Japanese (ja)
Inventor
Tsutomu Mimata
巳亦　力
Akira Kabashima
樺島　章
Yoshiyuki Abe
由之 阿部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59081773A priority Critical patent/JPS6062444A/en
Publication of JPS6062444A publication Critical patent/JPS6062444A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/09—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool
    • B23Q17/0952—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool during machining
    • B23Q17/0957—Detection of tool breakage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/24—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
    • B23Q17/248—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves using special electromagnetic means or methods

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Machine Tool Sensing Apparatuses (AREA)

Abstract

PURPOSE:To make it possible to obtain a cutting device suitable for automatizing a dieing process, by providing such an arrangement that light is irradiated onto peripheral section of a rotary cutting blade to automatically detect the breakage of the rotary cutting blade, etc. with the use of a mechanism for detecting the light. CONSTITUTION:When a blade is bent due to impact, a laser beam 8 from a projector 6 is reflected as indicated by B or C so that the reflected light does not reach a light receiver 7, and therefore, no electrical signal issues therefrom. Accordingly, a drive circuit for a motor 5 is deenergized so that a bend of the blade may be indicated. Further, if a part of the blade 3 is broken, the laser beam 8 from the projector 6 will not impinges upon the surface of the blade, and therefore, goes straight as indicated by B. As a result, the reflected light will not impinges upon the light receiver 7 so that no electrical single is issued. Thus, a breakage of the blade 3 may be indicated at once from a stopping of the motor 5 or the issuance of warning, and as well the device which may automatically detects a breakage of the blade 3 is suitable for a complete automatization of a dieing process.

Description

【発明の詳細な説明】 本発明は切削刃の破損等を自動的に検出できるダイシン
グ装置に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a dicing device that can automatically detect damage to a cutting blade.

この種のモニタ機構としては、特開昭５１−１２９９８
４に、回転ブレードとテーブルの接触による振動音の変
化により、ブレードの高さを検出するダイシング装置が
示されている。As a monitor mechanism of this kind, Japanese Patent Application Laid-Open No. 51-12998
4 shows a dicing device that detects the height of the blade based on changes in vibration sound caused by contact between the rotating blade and the table.

半導体工業κおいては、半導体ウェハを個々のチップに
切断するいわゆるダイシング作業は欠がせないものであ
る。かかるダイシングは、第１図に示すように、ＸＹ方
向に移動″ｆ′ろテーブル上に半導体ウェハ２を載置す
るとともに、この移動テーブル内に設けられた複数の吸
着孔９がらの真空引きを利用して半導体ウェハ２を真空
吸着固定した後、この半導体ウェハ２に回転する切削刃
（ブレード）を接触させて一定ピノナで平行に切込み溝
ができるようにしている。In the semiconductor industry, a so-called dicing operation for cutting semiconductor wafers into individual chips is essential. As shown in FIG. 1, such dicing involves placing the semiconductor wafer 2 on a filter table that moves in the X and Y directions, and evacuating a plurality of suction holes 9 provided in this moving table. After the semiconductor wafer 2 is fixed by vacuum suction, a rotating cutting blade is brought into contact with the semiconductor wafer 2 to form parallel cut grooves with a constant pinona.

ところで、かかるダイシング作業に使用されるブレード
は、寿命により、または半導体ウェハ面のキズにより、
あるいは前記ウェハ固定用の真空引きの力か弱《ウェハ
が動《こと等に起因して破損する場合が多い。そして、
り剛力の破損の結果円滑なダイシングが行えないという
問題が生ずる。By the way, the blade used for such dicing work may deteriorate due to its lifespan or due to scratches on the semiconductor wafer surface.
Alternatively, damage often occurs due to weak vacuuming force for fixing the wafer (the wafer moves), etc. and,
A problem arises in that smooth dicing cannot be performed as a result of damage to the rigidity.

このようにブレードが破損して切削不能となった場合等
には半導体ウェハ上の切り屑や、切削ライン等が無《な
るため、従来は、作業者が目視により図中破線で示す方
向から切削状態を観察することによりかかるブレードの
破損を検出していた。　″しかじ、現在作業の合理化の
要請の下でダイシング作業の完全自動化（無人化）が提
案されており、かかる完全自動化の下では、作業者の目
視によってブレードの破損を検出する従来の方法は全く
採用できない。If the blade is damaged and cannot be cut, there will be no chips or cutting lines on the semiconductor wafer. Such blade damage was detected by observing the condition. ``However, in response to requests for work rationalization, full automation (unmanned) of dicing operations is currently being proposed, and under such complete automation, the conventional method of detecting blade breakage by visual inspection by the operator will no longer be possible. Cannot be hired at all.

したがって本発明の目的とするところは、自動的にブレ
ードの破損等を検出することができる装置を提供するこ
とにあり、他の目的はダイシング作業の自動化に適した
切削装置を提供することにある。Therefore, an object of the present invention is to provide a device that can automatically detect damage to a blade, and another object of the present invention is to provide a cutting device suitable for automating dicing operations. .

以下実施例により本発明を具体的に説明する。The present invention will be specifically explained below using Examples.

第２図は本発明に係る切削装置の一例な示す説明図であ
る。FIG. 2 is an explanatory diagram showing an example of a cutting device according to the present invention.

図中３は円板状の回転ブレードであり、４はこのブレー
ド３を両側から挾むようにした保持板である。０の保持
板４及びブレード３はその中心部で、モータ５の回転軸
に固定されている。したがって、モータ５の回転により
ブレード３が回転部ドの周辺に元を照射する機構であり
、例えばレーザ光線８を前記ブレード３０面に対して斜
め上方からほぼ４５度の角度で投射するようになってい
る。７は受光器であり、前記ブレード３におけるレーザ
元が当る部分の斜め下方に配設され、前記レーザ光線８
がブレード面に当って返って（るほぼ４５度の角度の反
射光を受け、この反射光を電気信号に変換して出力する
ようにな−ている。この出力電気信号は、例えばブレー
ド３０回転機構たるモータ５の駆動回路に印加されるよ
うになっている。そして、この検出電気信号が出力され
ている場合は駆動回路は正常に動作し、検出電気信号が
出力されない場合には駆動回路の動作を停止させるよう
になっている。In the figure, 3 is a disk-shaped rotating blade, and 4 is a holding plate that holds this blade 3 from both sides. The retaining plate 4 and blade 3 of No. 0 are fixed to the rotating shaft of the motor 5 at their central portions. Therefore, the mechanism is such that the blade 3 irradiates the periphery of the rotating part D by the rotation of the motor 5. For example, the laser beam 8 is projected onto the surface of the blade 30 from diagonally above at an angle of approximately 45 degrees. ing. Reference numeral 7 denotes a light receiver, which is disposed diagonally below the part of the blade 3 that is hit by the laser beam, and is arranged diagonally below the part of the blade 3 that is hit by the laser beam 8.
The blade hits the blade surface, receives reflected light at an angle of approximately 45 degrees, converts this reflected light into an electrical signal, and outputs it. This output electrical signal is, for example, generated when the blade rotates 30 times. It is applied to the drive circuit of the motor 5, which is a mechanism.When this detected electric signal is output, the drive circuit operates normally, and when the detected electric signal is not output, the drive circuit operates normally. It is designed to stop the operation.

かかる装置は次のようにして使用される。Such a device is used as follows.

先ず、正常の切削状態１−なわち、ブレードが定常状態
を保っているときには、投光器６から投射されたレーザ
光線８はブレード面に当たり、その面に対して４５度の
角度で反射される。その反射光（第２図における破線）
Ａが受光器７で検出され、所定の電気信号を出力する。First, in normal cutting condition 1, ie, when the blade is in a steady state, the laser beam 8 projected from the projector 6 hits the blade surface and is reflected at an angle of 45 degrees with respect to the surface. The reflected light (dashed line in Figure 2)
A is detected by the light receiver 7 and outputs a predetermined electrical signal.

このときはモータ５の駆動回路は正常に動作し、切削作
業が続けられる。At this time, the drive circuit of the motor 5 operates normally and the cutting operation can be continued.

次にブレード３が何らかの衝撃により屈曲した状態（第
２図におけるＸ部分のように）となれば、投光器６から
のレーザ光線８は、Ｂ又はＣの矢印の如（反射する。こ
の反射ブＣは受光器７には達しないから受光器７からは
電気信号が生じない。このため前記したように、モータ
５の駆動回路の動作が停止となり、モータの回転が停止
せしめられる。これによりブレードの曲りを知ることが
できる。なお、モータ停止と同時に警報を発′−４−る
ようにしておけば、その検出はより迅速になされる０ま
た、第３図に示すようにブレード３の一部が。Next, when the blade 3 is bent due to some kind of impact (as shown in the X section in Fig. 2), the laser beam 8 from the projector 6 is reflected as shown by the arrows B or C. Since the light does not reach the light receiver 7, no electrical signal is generated from the light receiver 7. Therefore, as described above, the operation of the drive circuit of the motor 5 is stopped, and the rotation of the motor is stopped. If a warning is issued at the same time as the motor stops, the bending can be detected more quickly.In addition, as shown in Fig. but.

破損（図中Ｙで示す状態）していた場合にあっては、投
光器６からのレーザ光線８はブレード面に当ｔこらずに
矢印Ｂのように直進してしまう。このため、受光器７に
は反射光が入射せず、しｔこかって電気信号は出力され
ない。かかる場合にもモータの停止又は警報の発生によ
りブレードの破損を直ちに知ることができる。If the blade is damaged (state indicated by Y in the figure), the laser beam 8 from the projector 6 will travel straight as shown by arrow B without hitting the blade surface. Therefore, no reflected light enters the light receiver 7, and therefore no electrical signal is output. Even in such a case, damage to the blade can be immediately known by stopping the motor or generating an alarm.

以上説明したように本発明の一実施例は反射光の角度を
検出し、それを電気的に処理することによりブレードの
破損等を検査することができる。As described above, one embodiment of the present invention detects the angle of reflected light and processes it electrically, thereby making it possible to inspect the blade for damage or the like.

したがって、作業者を要せずして自動的にブレードの状
態を検査することができる。また、自動検出が可能でｔ
）るからダイシング作業の完全自動化に適したものとな
る。さらに、切削不良の発生を未然に防止できるからダ
イシング作業の能率を向上させることができる。Therefore, the condition of the blade can be automatically inspected without requiring an operator. In addition, automatic detection is possible.
), making it suitable for complete automation of dicing work. Furthermore, since the occurrence of cutting defects can be prevented, the efficiency of dicing work can be improved.

本発明は前記実施例に限定されない。例えば前記実施例
ではレーザ光線を利用したがこれに限らず、他の光線を
利用してもよい。ｆこだ、ダイシング作業中にはブレー
ドに洗浄水がかかるため元の散乱が起り易いから、かか
る散乱を生じさせることのない直進性の良い光線を用い
る必要がある。The invention is not limited to the above embodiments. For example, although a laser beam was used in the embodiment, the present invention is not limited to this, and other light beams may be used. However, during the dicing operation, the blade is splashed with cleaning water, which tends to cause scattering, so it is necessary to use a light beam with good straightness that does not cause such scattering.

また、検出電気信号は必ずしもブレードの回転停止用の
信号として用いる必要はなく、例えばＸＹテーブルの上
下動用の駆動機構に入力するようにしてブレード破損時
にウェハとブレードを離間させるようにしてもよいし、
また、単純に警報装置に入力するだけとしてもよい。Further, the detected electric signal does not necessarily need to be used as a signal to stop the rotation of the blade, and may be inputted to a drive mechanism for vertical movement of an XY table to separate the wafer from the blade when the blade is damaged. ,
Alternatively, the information may simply be input to the alarm device.

本発明は全ての切削装置に広（利用できる。The present invention is widely applicable to all cutting equipment.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はダイシング作業を説明するための断面図、第２
図は本発明に係るダイシング装置の一例を説明するため
の説明図、第３図は、本発明に係る切削装置の一例を説
明するための説明図である。 １・・・テーブル、２・・・半導体ウェハ、３・・・ブ
レード、４・・・保持板、５・・・モータ、６・・・投
ブ０器、７・・・受光器、８・・・レーザう“Ｃ線、９
・・・吸着孔。 第　１　図 第　２　図 第　３　１′ＡFigure 1 is a cross-sectional view for explaining the dicing operation, Figure 2
FIG. 3 is an explanatory diagram for explaining an example of a dicing device according to the present invention, and FIG. 3 is an explanatory diagram for explaining an example of a cutting device according to the present invention. DESCRIPTION OF SYMBOLS 1...Table, 2...Semiconductor wafer, 3...Blade, 4...Holding plate, 5...Motor, 6...Emitter 0 device, 7...Light receiver, 8... ...laser "C line, 9"
...Adsorption hole. Figure 1 Figure 2 Figure 3 1'A

Claims (1)

【特許請求の範囲】 １、（ａｌ　被切削物を載置すべき載置台と（ｂｌ　上
記被切削物を切削するための回転ブレビと （ｃｌ　上記回転ブレードの状態を検ｆｆ１ｊる機構と よりなるダイシング装置。 ２、上記ブレードの状態を検出する機構は、上記回転ブ
レードの周辺部に元を照射する機構とブレードの状態変
化による上記光の変化を検出するための受光機構よりな
ることを特徴とする特許請求の範囲第１項に記載のダイ
シング装置。[Claims] 1. Consisting of (al) a mounting table on which the object to be cut is placed, (bl) a rotating shaker for cutting the object to be cut, and (cl) a mechanism for detecting the state of the rotating blade. Dicing apparatus. 2. The mechanism for detecting the state of the blade is characterized by comprising a mechanism for irradiating a source around the rotating blade and a light receiving mechanism for detecting a change in the light due to a change in the state of the blade. A dicing apparatus according to claim 1.
JP59081773A 1984-04-25 1984-04-25 Dieing device Pending JPS6062444A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59081773A JPS6062444A (en) 1984-04-25 1984-04-25 Dieing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59081773A JPS6062444A (en) 1984-04-25 1984-04-25 Dieing device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP1648778A Division JPS54109682A (en) 1978-02-17 1978-02-17 Method of cutting blade inspection

Publications (1)

Publication Number Publication Date
JPS6062444A true JPS6062444A (en) 1985-04-10

Family

ID=13755791

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59081773A Pending JPS6062444A (en) 1984-04-25 1984-04-25 Dieing device

Country Status (1)

Country Link
JP (1) JPS6062444A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0428939U (en) * 1990-06-25 1992-03-09

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5115875A (en) * 1974-07-31 1976-02-07 Oki Electric Ind Co Ltd KOGUMAMORYOSOKUTEIHOHO OYOBI SOCHI

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5115875A (en) * 1974-07-31 1976-02-07 Oki Electric Ind Co Ltd KOGUMAMORYOSOKUTEIHOHO OYOBI SOCHI

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0428939U (en) * 1990-06-25 1992-03-09

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