JPS606206B2 - Mold release agent for resin molding - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a mold release agent for resin molding, and particularly to a mold release agent used for resin molded products used in areas exposed to arcs in a sulfur hexafluoride gas atmosphere.

As the molding agent used in this type of resin molding, a secondary silicone-based molding agent has generally been used. However, although the mold release agent is used by being applied to the inner surface of the mold, most of it is attached to the surface of the molded product. Therefore, if this molded product is installed in close proximity to a gas liner or disconnector where TSF6 gas is used for insulation, it may be exposed to the overflow of the arc. become. However, when a silicone-based molding agent is used, if it adheres to the surface of the molded product, a chemical reaction will occur between the SF6 gas and the silicone in the presence of residual moisture, resulting in fluorine as the final product. Acid is produced. If the amount of this product is large, it will cause tracking in the molded product and cause repeated deterioration of the flickering properties. In order to solve this problem, we minimize the amount of silicone mold agent applied and use it after confirming empirically that it does not cause tracking, but this process must rely on the experience of the operator. It's inconvenient. An object of the present invention is to provide a mold release agent that does not cause deterioration in tracking and longitudinal properties even when exposed to high temperatures in an SF6 gas atmosphere.

According to this invention, a base oil is a low polymerization agent of Sanfutsui Q capped ethylene, and 0.5 to 10% of an organic gelling agent is added to the base oil.
weight%. same as below. ) A template agent is provided which can be added to form a wax-like or grease-like form. When the average molecular weight of the polymer is less than 700, the product of a low polymerized oil of ethylene trifluoride chloride and an organic gelling agent obtained from the condensation reaction of D-sorbitol and penzaldehyde is 15
It is located in the mirror direction where it evaporates at about 0 pi. Therefore, it can be used if the curing temperature of the resin material used is 15 mm or less, but if the temperature is higher than this, it is necessary to use a resin material with a large average molecular weight. Note that the larger the average molecular weight, the higher the steam temperature. However, if it exceeds 1,100, it solidifies and is therefore unsuitable as a scale agent. The organic gelling agent has the effect of raising the boiling point of the base oil and converting the liquid base oil into a grease-like or wax-like state.

That is, when this is added to base oil and heated, the base oil becomes gel-like and its physical properties change, thereby raising its boiling point. Note that if this addition amount is less than 0.5%,
The degree of mapleness required as a mold release agent cannot be obtained. In other words, a liquid portion partially remains in the base oil, and a sufficient increase in boiling point cannot be expected. Moreover, if it exceeds 10%, the boiling point will rise sufficiently. It solidifies more than necessary and cannot be used as a mold release agent. In other words, the steel cannot be coated on the inner surface of the mold. If necessary, an inorganic powder having gas resistance, such as boron nitride (BN) powder, may be added to improve the scale-like performance. This is thermally approximately 1
It is a stable compound up to 0.00000, and does not generate hydrogen acid like silicone mold release agents even in SF6 gas, and maintains excellent electrical properties. When adding this, 0.05 to 5% is appropriate; less than 0.05% is insufficient to improve template performance, and if it exceeds 5%, the base oil will cause more rice than necessary. This makes it impossible to use it as a mold release agent. Q when trying to increase the amount of base oil
- Fine powder of alumina (Q-N203) may be used if necessary.

Q-Alumina is more stable to SF6 gas than boron nitride. For Q-alumina, it is preferable to have an average particle size of 3A or less, especially around 1A, and if it exceeds 3A, fine irregularities may form on the surface of the molded product, which may impair commercial value. The amount added is 0.05~ as in the case of boron nitride.
5% is appropriate. It is desirable that the impurities in each of these additives be as low as possible, but even if it is unavoidable, Si021
% or less and Na200.2% or less.
This is necessary in order to use the product in a 6 gas atmosphere without causing any problems. Next, embodiments of this invention will be described.

Tar, Fifloyl (trade name) manufactured by Daikin Industries, Ltd. was used as trifluorochloroethylene low polymerized oil, and Gelol D (trade name) manufactured by Shin Nippon Rika Co., Ltd. (Osaka City) was used as an organic gelling agent. In addition, desoca boron nitride (manufactured by Denki Kagaku Kogyo Co., Ltd. (Tokyo)) was used as a nitrided boron fine powder.
Several types of mold release agents were produced using each of the following product names and varying the mixing ratio. These characteristics are shown in the following table.
In this table, A stands for low polymerized ethylene trifluoride chloride oil, B stands for organic gelling agent, and C stands for fine boron nitride powder. Moreover, the temperature represents the maximum temperature that can be used in a stable state. All of these mixtures were obtained by heating to an extent that the organic gelling agent was dissolved (for example, 140° C., approximately 300° C.) and then cooling. From the above results,
First, the maximum usable temperature is determined only by the average molecular weight of the difluorochloroethylene low-polymerized oil; the larger the average molecular weight, the higher the maximum temperature, and the degree of mapleness is affected by the organic gelling agent. When the amount added is small, it becomes like a grease with a low branity, and when it is added, it becomes like a wax with a high degree of steel.

Therefore, if the curing temperature of the resin material is high, trifluorochloride low polymerized oil with a large average molecular weight should be used, and if the mold has a complicated shape, trifluoroethylene low polymerized oil should be added. What is necessary is to use a small amount, that is, a grease-like material. When fine boron chloride powder is mixed as in sample number 7, improvement in template performance can be expected. This kind of powder was originally used as an additive for mold release agents, but since it is chemically stable against SF6 gas, no deterioration of electrical properties occurs even when it is added. . Next, when each of the above samples was used for molding epoxy resin, the cast material could be taken out with just a slight force. This is comparable to the case where a silicone mold release agent is used. The obtained molded product was set in a test container with a slit section, and under an SF6 gas atmosphere, arc current was 3 A, voltage was V, arc time was 2 cycles, number of tests was 5 times, and test time interval. It was aged for 2-4 minutes at SF6 gas pressure (gauge pressure) 3k9'c sea (15°C).
This sample was then repeatedly subjected to alternating current entanglement in SF6 gas 15 times. As a result, no drop in flashover voltage occurred in any of the samples, and no tracking occurred. Incidentally, in an experiment conducted using a silicone mold release agent, the resistance decreased to 80% of the initial value after 15 times of tangling. In this experiment, the silicon layer was made very thin, so the drop in the flashback value was small; if it were applied even thicker, the flashback value would drop even further, causing tracking damage. can be easily inferred. As detailed above, the present invention has the effect of requiring a mold release agent suitable for manufacturing resin moldings that is electrically and chemically stable against SF6 gas.

Claims (1)

[Scope of Claims] 1 Trifluorochloroethylene low polymerized oil is used as a base oil, and 0.5 to 10% by weight of an organic gelling agent derived from a condensation reaction of D-sorbitol and benzaldehyde is added thereto. A mold release agent for resin molding that forms a grease-like or wax-like form. 2 Trifluorochloroethylene low polymerized oil has an average molecular weight of 70
The mold release agent for resin molding according to claim 1, which has a molecular weight of 0 to 1100. 3. The mold release agent for resin molding according to claim 1, which contains 0.05 to 5% by weight of boron nitride fine powder. 4. The mold release agent for resin molding according to claim 1, which contains 0.05 to 5% by weight of α-alumina fine powder.