JPS6059979B2 - High strength, high conductivity copper alloy - Google Patents
High strength, high conductivity copper alloyInfo
- Publication number
- JPS6059979B2 JPS6059979B2 JP10289379A JP10289379A JPS6059979B2 JP S6059979 B2 JPS6059979 B2 JP S6059979B2 JP 10289379 A JP10289379 A JP 10289379A JP 10289379 A JP10289379 A JP 10289379A JP S6059979 B2 JPS6059979 B2 JP S6059979B2
- Authority
- JP
- Japan
- Prior art keywords
- strength
- copper alloy
- alloy
- electrical conductivity
- conductivity copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
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- Conductive Materials (AREA)
Description
【発明の詳細な説明】
本発明は黄銅と同等の強度を有し、かつはるかに優れた
導電性と耐応力腐食割れ感受性を有する高強度高導電性
銅合金に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention is directed to a high strength, high conductivity copper alloy having strength comparable to brass, but with much greater electrical conductivity and stress corrosion cracking susceptibility.
黄銅は、銅に適量の亜鉛を添加した合金で、安価な亜鉛
を多量に含むところからコストが安く、優れた強度を有
しているため、配線機器、電気、電子部品等に広く用い
られている。しかるにこの合金は導電率が低く、応力腐
食割れを起し易い欠点がある。最近の電気、電子工業の
発展は目ざましく、これに伴い、これら各装置の信頼性
の向上が望まれ部品材料についてもより導電性が優れ、
強度も高く、製造が容易で安価な合金が要求されている
。Brass is an alloy of copper with an appropriate amount of zinc added, and because it contains a large amount of inexpensive zinc, it is low in cost and has excellent strength, so it is widely used in wiring equipment, electrical and electronic parts, etc. There is. However, this alloy has the disadvantage of low electrical conductivity and is susceptible to stress corrosion cracking. Recent developments in the electrical and electronic industries have been remarkable, and as a result, improvements in the reliability of these devices have been desired, and component materials have also become more conductive.
There is a need for alloys that have high strength, are easy to manufacture, and are inexpensive.
本発明はこれに鑑み、種々研究の結果、黄銅と同等の強
度を有し、より優れた導電性と耐応力腐食割れ感受性を
有する高強度高導電性銅合金を開発したもので、C00
.1〜2.0%及びP0.01〜0.5%とAg、Sn
、In、Mg、Mn、Zn、Si、Alのうち何れか1
種又は2種以上を合計0.1〜1.0%とを含み、残部
Cuからなることを特徴とする。即ち本発明は、Cuに
Coを添加することにより導電率をあまり低下させるこ
となく強度を向上せしめ、これにPを添加してCoとP
を共存せしめることによりP(5Coの金属間化合物を
形成し、かつ該化合物の析出を促進させて導電率の向上
を計り、かつPの脱酸効果により健全な鋳塊を得たもの
であり、更にまたAg、Sn、In、Mg、Mn、Zn
、Si、Alのうち何れか1種又は2種以上を添加して
導電率をあまり低下せしめることなく、強度を一層向上
せしめたものである。In view of this, as a result of various studies, the present invention has developed a high-strength, high-conductivity copper alloy that has strength equivalent to that of brass, superior conductivity, and stress corrosion cracking susceptibility.
.. 1-2.0% and P0.01-0.5%, Ag, Sn
, In, Mg, Mn, Zn, Si, Al.
It is characterized by containing one or more species in a total amount of 0.1 to 1.0%, with the remainder being Cu. That is, the present invention improves the strength without significantly reducing the electrical conductivity by adding Co to Cu, and adds P to this to improve the strength of Co and P.
By coexisting with P(5Co), an intermetallic compound of P(5Co) is formed, and the precipitation of the compound is promoted to improve the electrical conductivity, and a healthy ingot is obtained due to the deoxidizing effect of P. Furthermore, Ag, Sn, In, Mg, Mn, Zn
By adding one or more of , Si, and Al, the strength is further improved without significantly lowering the electrical conductivity.
しカルてCo含有量を0.1〜2.0%と限定した理由
は、0.1%未満では強度の向上が不充分であり、2.
0%を越えると強度向上の効果は飽和し、かつ加工性が
低下するためであり、またP含有量を0.01〜0.5
%を限定した理由は、0.01%未満ではCoとPの金
属間化合物の形成量が少なく、該化合物の析出促進効果
も不充分て導電率の向上が望めず、0.5%を越えると
Coと化合せず、Cu中に固溶して導電率を低下するた
めてある。The reason for limiting the Co content to 0.1 to 2.0% is that if it is less than 0.1%, the improvement in strength is insufficient;
This is because if the P content exceeds 0%, the strength improvement effect will be saturated and the workability will decrease.
The reason for limiting the percentage is that if it is less than 0.01%, the amount of intermetallic compound of Co and P will be small, and the effect of promoting the precipitation of this compound will be insufficient, making it impossible to expect an improvement in electrical conductivity. This is because Cu does not combine with Co, but forms a solid solution in Cu, lowering the electrical conductivity.
また〜hSn91n、Mg、Mn9Zn、Si、Alの
うち何れか1・種又は2種以上の含有総量を0.1〜1
.0%と限定し 。た理由は、0.1%未満では強度向
上に及ぼす効果を不充分であり、1.0%を越えると導
電率を著しく低下せしめ、かつ加工性を害するためであ
る。次に本発明合金を実施例について説明する。高周波
溶解炉中で黒鉛ルツボを用い、Cuを木炭で被覆した状
態で溶解し、溶落後qoをCU−50%Co母合金で添
加し、次にPをCU−15%P借金金で添加し、最後に
Ag,Sn,In,Mg,Mn,Zn,Al,Siのう
ち何れか1種又は2種以上を添加し、これを金型に鋳造
して第1表に示す組成の鋳塊(厚さ30T!Rltl巾
10i1長さ200?)を得た。次にこれら各鋳塊の両
面を面削して厚さ2.5mとした後、900℃で厚さ1
0TfrI1&まで熱間圧延し、続いて室温まで冷却し
た。この冷却は早い方が好ましいが必ずしも水中冷却を
行なう必要はない。次にこの板を冷間圧延と中間焼鈍を
繰り返し、厚さ0.5顛の板に仕上げた。尚最終冷間加
工度は30%とした。次に得られた板から各種試験片を
切り出し、導電率、引張強さ、応力腐食割れ感受性を調
べた。In addition, the total content of one or more of hSn91n, Mg, Mn9Zn, Si, and Al is 0.1 to 1.
.. Limited to 0%. The reason for this is that if it is less than 0.1%, the effect on improving strength is insufficient, and if it exceeds 1.0%, the electrical conductivity will be significantly lowered and workability will be impaired. Next, examples of the alloy of the present invention will be explained. Using a graphite crucible in a high-frequency melting furnace, Cu is melted while covered with charcoal, and after melting, qo is added with CU-50% Co master alloy, and then P is added with CU-15% P debt. Finally, one or more of Ag, Sn, In, Mg, Mn, Zn, Al, and Si are added, and this is cast into a mold to obtain an ingot (with the composition shown in Table 1). (thickness 30T! Rltl width 10i1 length 200?) was obtained. Next, both sides of each of these ingots were faceted to a thickness of 2.5 m, and then heated to a thickness of 1 m at 900°C.
It was hot rolled to 0TfrI1& then cooled to room temperature. Although it is preferable that this cooling be done quickly, it is not always necessary to carry out underwater cooling. Next, this plate was repeatedly subjected to cold rolling and intermediate annealing to produce a plate with a thickness of 0.5 mm. The final degree of cold working was 30%. Next, various test pieces were cut out from the obtained plates and examined for electrical conductivity, tensile strength, and stress corrosion cracking susceptibility.
その結果を第2表に示す。尚応力腐食割れ感受性は、板
(厚さ0.5wn)より巾10m1長さ10−の試料を
切り出し、曲げ半径4mで180さ曲げ加工を加えた状
態でアンモニアガス雰囲気中に放置し、破断まての時間
を測定したものである。The results are shown in Table 2. Susceptibility to stress corrosion cracking was determined by cutting a sample 10 m wide and 10 mm long from a plate (thickness 0.5 wn), bending it by 180 degrees with a bending radius of 4 m, and leaving it in an ammonia gas atmosphere until it broke. The time taken was measured.
第1表及び第2表から明らかなように、本発明.合金(
NO.l〜NOl8)は何れも引張強さ48〜53kg
/i、導電率63〜78%IACSl破断まての日数1
0日以上で、何れも従来合金(NO24)である651
35黄銅に比較し、同等の引張強さを有し、より優れた
導電率及び耐応力腐食割れ感受性を有していることが判
る。As is clear from Tables 1 and 2, the present invention. alloy(
No. l~NOl8) all have a tensile strength of 48~53kg
/i, conductivity 63-78% IACSl rupture days 1
0 days or more, all of which are conventional alloys (NO24) 651
It can be seen that it has similar tensile strength, superior electrical conductivity, and stress corrosion cracking susceptibility compared to No. 35 brass.
これに対し、比較合金(NO.l9〜NO.23)から
明らかなように、CO含有量の少ない合金(NO.l9
)は引張強さが劣り、耐応力腐食割れ感受性が不充分で
ある。On the other hand, as is clear from the comparative alloys (NO.19 to NO.23), alloys with low CO content (NO.19 to NO.23)
) has poor tensile strength and insufficient stress corrosion cracking resistance.
またP含有量の少ない合金NO.2O及び多い合金(N
O23)は何れも導電率が不充分である。またAg,S
n,In,Mg,Zn,Mn,Si,Alの何れも添加
しない合金(NO.2l)は、引張強さが劣り、Ag,
Sn,■N,Mg,Zn,Mn,Si,Alの何れか添
加量の多い合金(NO.22)は導電率が不充分である
。尚CO添加量の多い合金は加工性が悪く、実用的でな
いので試験を省略した。Also, alloy NO. with low P content. 2O and rich alloys (N
O23) all have insufficient electrical conductivity. Also Ag,S
The alloy (NO.2l) to which none of n, In, Mg, Zn, Mn, Si, or Al is added has poor tensile strength, and Ag,
The alloy (No. 22) containing a large amount of Sn, N, Mg, Zn, Mn, Si, or Al has insufficient electrical conductivity. It should be noted that the alloy with a large amount of CO added had poor workability and was not practical, so the test was omitted.
このように本発明合金は黄銅を同等の強度を有し、かつ
優れた導電率を耐応力腐食割れ感受性を有し、電気、電
子機器の部品に使用し、その信頼性を高める等、顕著な
効果を奏する。In this way, the alloy of the present invention has strength equivalent to that of brass, excellent electrical conductivity, and stress corrosion cracking susceptibility, and can be used in parts of electrical and electronic equipment to improve their reliability. be effective.
Claims (1)
、Ag,Sn,In,Mg,Mn,Zn,Si,Alの
うち何れか1種又は2種以上を合計0.1〜1.0%と
を含み残部Cuからなる高強度高導電性銅合金。1 Co0.1-2.0% and P0.01-0.5%, and any one or more of Ag, Sn, In, Mg, Mn, Zn, Si, Al, total 0.1 A high-strength, high-conductivity copper alloy consisting of ~1.0% Cu and the balance Cu.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10289379A JPS6059979B2 (en) | 1979-08-13 | 1979-08-13 | High strength, high conductivity copper alloy |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10289379A JPS6059979B2 (en) | 1979-08-13 | 1979-08-13 | High strength, high conductivity copper alloy |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5690946A JPS5690946A (en) | 1981-07-23 |
JPS6059979B2 true JPS6059979B2 (en) | 1985-12-27 |
Family
ID=14339532
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10289379A Expired JPS6059979B2 (en) | 1979-08-13 | 1979-08-13 | High strength, high conductivity copper alloy |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6059979B2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59140343A (en) * | 1983-01-29 | 1984-08-11 | Furukawa Electric Co Ltd:The | Copper alloy for lead frame |
CA1248779A (en) * | 1984-06-14 | 1989-01-17 | Ryoichi Nobuyoshi | Excellently corrosion-resistant copper alloy |
JPS61242052A (en) * | 1985-04-19 | 1986-10-28 | Mitsubishi Shindo Kk | Copper alloy lead material for semiconductor device |
-
1979
- 1979-08-13 JP JP10289379A patent/JPS6059979B2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5690946A (en) | 1981-07-23 |
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