JPS6056034B2 - audio equipment - Google Patents
audio equipmentInfo
- Publication number
- JPS6056034B2 JPS6056034B2 JP1363284A JP1363284A JPS6056034B2 JP S6056034 B2 JPS6056034 B2 JP S6056034B2 JP 1363284 A JP1363284 A JP 1363284A JP 1363284 A JP1363284 A JP 1363284A JP S6056034 B2 JPS6056034 B2 JP S6056034B2
- Authority
- JP
- Japan
- Prior art keywords
- slit
- speaker
- circuit board
- printed circuit
- lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は音響機器に関し、内蔵スピーカの裏側に発生す
る音圧を通過させる新規な構成を提供するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to audio equipment, and provides a novel configuration for passing sound pressure generated on the back side of a built-in speaker.
従来例の構成とその問題点小型のテープレコードやラジ
オ等では内蔵スピーカの裏側に発生する音圧をケース内
の空間あるいはケース外へ導く必要がある。Conventional configurations and their problems In small tape records, radios, etc., it is necessary to guide the sound pressure generated on the back side of the built-in speaker to the space inside the case or to the outside of the case.
このため従来の音響機器では第１図に示すようにスピー
カ１が取付けられたケース本体２とその蓋３間に収納さ
れるプリント基板４に音圧通過用の複数の孔５を設け、
スピーカ１の裏側に発生する音圧をそのプリント基板４
の孔５を通して蓋３に設けた孔６からケース外へ放音す
るようにしている。しカルながら、このようにプリント
基板４に音圧通過用の専用の孔を設けることはその孔の
ためのスペースを設けられなければならず、そしてここ
には部品等を配置することができなくなるため、機器の
小型化、薄型化が阻害されているものであつた。For this reason, in conventional audio equipment, as shown in FIG. 1, a plurality of holes 5 for sound pressure passage are provided in a printed circuit board 4 housed between a case body 2 to which a speaker 1 is attached and its lid 3.
The sound pressure generated on the back side of the speaker 1 is measured by the printed circuit board 4.
The sound is emitted from a hole 6 provided in the lid 3 through the hole 5 to the outside of the case. However, in order to provide a dedicated hole for sound pressure passage in the printed circuit board 4 in this way, a space must be provided for the hole, and it becomes impossible to place components etc. here. This has hindered the miniaturization and thinning of devices.
発明の目的
本発明は上記従来の欠点を解消するもので、内蔵スピー
カの裏側の音圧を通過させる小型、薄型の構成を実現す
ることを目的とする。OBJECTS OF THE INVENTION The present invention solves the above-mentioned conventional drawbacks, and aims to realize a compact and thin structure that allows sound pressure from the back side of a built-in speaker to pass through.
発明の構成
本発明はスピーカが取付けられたケース本体と蓋からな
るケース内にスリットを設けたフレキシブルプリント基
板を設け、前記フレキシブルプリント基板のスリットの
両側をケース内部の部材により互いに加圧し、該加圧に
よつて形成されたスリットの開孔を上記スピーカの裏側
に発生する音圧の通過孔としたものであり、小型化、薄
型化を実現できるものである。Structure of the Invention The present invention provides a flexible printed circuit board with a slit in a case consisting of a case body and a lid to which a speaker is attached, and pressurizes both sides of the slit of the flexible printed circuit board against each other by members inside the case. The opening of the slit formed by the pressure is used as a passage hole for the sound pressure generated on the back side of the speaker, and it is possible to realize a reduction in size and thickness.
実施例の説明
本発明の一実施例によいて第２図、第３図を用いて説明
する。DESCRIPTION OF THE EMBODIMENTS An embodiment of the present invention will be described with reference to FIGS. 2 and 3.
７はスピーカ８が取付けられたケース本体であり、９は
そのケース本体７の蓋で、この蓋９にはスピーカ８の裏
側の音圧をケース外へ導くための孔１０が形成されてい
るとともに内面には突起１１が一体に形成されている。7 is a case body to which a speaker 8 is attached; 9 is a lid of the case body 7; a hole 10 is formed in the lid 9 for guiding sound pressure from the back side of the speaker 8 to the outside of the case; A projection 11 is integrally formed on the inner surface.
１２は前記ケース本体７と蓋９とからなるケース内に配
されたベース材が柔軟な合成樹脂膜等からなるフレキシ
ブルプリント基板で、該フレキシブルプリント基板１２
には電子部品１３が取付け接続されているとともに所要
長さのスリット１４が形成されている。そして前記ケー
ス本体７に蓋９を取付けた状態ではフレキシブルプリン
ト基板１２においてスリット１４の左側上面に蓋９の突
起１１が当接し、またスリット１４の右側下面にはスピ
ーカ８の頭部が当接してそれぞれ加圧され、これにより
第３図に示すようにスリット１４が開孔１５となるよう
に構成されている。Reference numeral 12 denotes a flexible printed circuit board whose base material is made of a flexible synthetic resin film, etc., which is disposed inside the case consisting of the case body 7 and the lid 9.
An electronic component 13 is attached and connected thereto, and a slit 14 of a required length is formed. When the lid 9 is attached to the case body 7, the protrusion 11 of the lid 9 is in contact with the upper left side of the slit 14 on the flexible printed circuit board 12, and the head of the speaker 8 is in contact with the lower right side of the slit 14. Each is pressurized so that the slit 14 becomes an opening 15 as shown in FIG.
このように構成することによりスピーカ８の裏側に発生
する音圧はフレキシブルプリント基板１２のスリット１
４によつて形成された開孔１５からケース本体７内や蓋
９の孔１０を通して外部に導かれるものである。With this configuration, the sound pressure generated on the back side of the speaker 8 is transmitted through the slit 1 of the flexible printed circuit board 12.
4 through the hole 15 in the case body 7 or through the hole 10 in the lid 9 to the outside.
なお、上記実施例ではフレキシブルプリント基板のスリ
ットの両側に当接して加圧し、そのスリットを開口させ
るものとして蓋９の突起１１とスピーカ８を用いたが、
これは他の部材等であつても同様である。In the above embodiment, the protrusion 11 of the lid 9 and the speaker 8 were used to press against both sides of the slit of the flexible printed circuit board to open the slit.
This also applies to other members.
発明の効果
本発明はスピーカが取付けられたケース本体とその蓋か
らなるケース内にスリットを設けたフレキシブルプリン
ト基板を設け、前記フレキシブルプリント基板のスリッ
トの両側をケース内部の部材により互いに加圧し、該加
圧によつて形成されたスリットの開孔を上記スピーカの
裏側に発生する音圧の通過孔としたものであり、本発明
によればプリント基板に大きな面積を有する孔を専用に
形成することなく単なるスリットによつて音圧通過孔を
形成することができるため、プリント基板のスペースを
有効に利用することができ、したがつて音響機器の小型
化や薄型化が舗れるもので、その効果は大である。Effects of the Invention The present invention provides a flexible printed circuit board with a slit in a case consisting of a case body to which a speaker is attached and its lid, and pressurizes both sides of the slit of the flexible printed circuit board against each other by members inside the case. The opening of the slit formed by applying pressure is used as a passage hole for the sound pressure generated on the back side of the speaker, and according to the present invention, a hole having a large area is specially formed on the printed circuit board. Since the sound pressure passage hole can be formed with a simple slit, the space on the printed circuit board can be used effectively, which allows audio equipment to be made smaller and thinner. is large.
第１図は従来例を示す要部分解斜視図、第２図は本発明
の一実施例を示す要部分解斜視図、第３図は同組立て状
態の断面側面図てある。
７・・・・・・ケース本体、８・・・・・・スピーカ、
９・・・・・・蓋、１１・・・・・・突起、１２・・・
・・・スピーカプリント基板、１４・・・・・・スリッ
ト、１５・・・・・・開孔。FIG. 1 is an exploded perspective view of essential parts showing a conventional example, FIG. 2 is an exploded perspective view of essential parts showing an embodiment of the present invention, and FIG. 3 is a cross-sectional side view of the assembled state. 7...Case body, 8...Speaker,
9...Lid, 11...Protrusion, 12...
... Speaker printed circuit board, 14 ... Slit, 15 ... Opening.
Claims (1)
ース内にスリットを設けたフレキシブルプリント基板を
設け、前記フレキシブルプリント基板のスリットの両側
をケース内部の部材により互いに加圧し、該加圧によつ
て形成されたスリットの開孔を上記スピーカの裏側に発
生する音圧の通過孔としてなる音響機器。1. A flexible printed circuit board with a slit is provided in a case consisting of a case body and a lid to which a speaker is attached, and both sides of the slit of the flexible printed circuit board are pressurized against each other by members inside the case. An acoustic device in which the opening of the slit serves as a passage hole for sound pressure generated on the back side of the speaker.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1363284A JPS6056034B2 (en) | 1984-01-27 | 1984-01-27 | audio equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1363284A JPS6056034B2 (en) | 1984-01-27 | 1984-01-27 | audio equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59146293A JPS59146293A (en) | 1984-08-22 |
| JPS6056034B2 true JPS6056034B2 (en) | 1985-12-07 |
Family
ID=11838607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1363284A Expired JPS6056034B2 (en) | 1984-01-27 | 1984-01-27 | audio equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6056034B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8928899D0 (en) * | 1989-12-21 | 1990-02-28 | Knowles Electronics Co | Coil assemblies |
-
1984
- 1984-01-27 JP JP1363284A patent/JPS6056034B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59146293A (en) | 1984-08-22 |
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