JPS6055610A - Method of producing electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing electronic components, and particularly to a method for manufacturing chip-type electronic components.

Conventionally, the above manufacturing method has been disclosed in Japanese Patent Application Laid-Open No. 55-2'79.
There are some such as those disclosed in No. 12. This involves bending a metal clad plate with metal foil on one side into a U-shape in the longitudinal direction so that the metal foil is on the outside to form a gutter-like filling capacity. Electronic component elements are loaded at equal intervals, the electrodes of these elements are connected to the metal foil on the outer side wall of the filling container by soldering or welding, resin is injected into the filling container, and the metal foil on the bottom of the filling container is connected to the metal foil on the bottom of the filling container. Then, the filled container is cut and separated at an intermediate position between each electronic component element. However, in this manufacturing method, the electrodes of the element must be soldered or welded to the metal foil on the outer surface of the side wall of the filling container each time, which is cumbersome.

SUMMARY OF THE INVENTION An object of the present invention is to provide a manufacturing method that facilitates the soldering of the electrodes of each electronic component element to each metal foil at the same time.

Therefore, in the present invention, (a) long holes for bending are formed at predetermined intervals along both longitudinal edges of the strip-shaped insulator at biased positions, and (b) pasting metal foil on one side of the band-shaped insulator; and (c) forming a window between the two windows. (b) placing solder in each of the windows; and (e) placing a plurality of electronics on the surface of the strip-shaped insulator opposite to the surface on which the metal foil is attached. A process of arranging component elements at predetermined intervals so that their electrodes are in contact with the solder in the window, and (f) heating the solder all at once and soldering each electrode to each of the metal foils. (g) a process of bending the band-shaped insulator along each of the long holes for bending to form a gutter-like body with the metal foil located on the outside;
The process includes the steps of: filling the trough-like body with resin; and (2) cutting the trough-like body in the width direction at positions between the electronic components.

In this manufacturing method, a window is formed on the strip-shaped insulator in step (a), and metal foil is placed on the outside of the window in step (c), so solder is applied to the six windows in step (d). By simply placing the electrodes in contact with each of these solders in step (e), and heating them in step (f), you can solder the electrodes to multiple metal foils at the same time. becomes easier.

This invention is illustrated below! This will be explained in detail based on examples. FIG. 1 shows a chip-type tantalum capacitor manufactured by the manufacturing method according to the present invention. In the figure, reference numeral 2 denotes a support body having a bottom wall portion 4 and an end wall portion 6.8.

10.12 is a long hole for bending. End wall portion 6 of bottom wall portion 4
．． A window 14, +6 is bored near the end wall 6.
An external electrode is provided so as to straddle the end of the bottom wall 4 and cover the window 14. Similarly, an external electrode 20 is provided so as to straddle the ends of the end wall 8 and the bottom wall 4 and cover the window 16. 22 is a capacitor element, 24 is its cathode layer, 25 is an anode lead wire, and 26 is an anode member. The cathode layer 24 and the anode member 26 are soldered to the external electrode 20 via the window 14.16 by solders 2'l, 2B. Note that the anode lead wire 26 and the anode member 28 are welded. Although not shown in the figure, the support 2 is filled with synthetic resin so that the capacitor element is buried therein.
In some cases, a heat-resistant plate may be provided so as to straddle the upper ends of the end walls 6.8.

Next, a manufacturing method according to the present invention will be explained.

First, the strip-shaped insulator 30 is punched out as shown in FIG.

The strip insulator 30 is made of polyimide or glass epoxy and has a thickness of about 0.1 mm. Elongated bending holes 1O are punched out at predetermined intervals along the longitudinal edge of the strip-shaped insulator 30 at a position biased toward one longitudinal edge. Similarly, an elongated bending hole I2 is punched out at a position biased toward the other longitudinal edge of the strip-shaped insulator 30 so as to correspond to the elongated bending hole 10 along the longitudinal edge. A rectangular window +4 is punched out at a position inside each bending slot IO, and a rectangular window I6 is punched at a position inside each bending slot I2. An end wall height defining elongated hole 32 is located at a position further toward the longitudinal edge of the strip insulator 30 than each bending elongated hole 10.32. ．． 34 is punched out. In addition, 6 windows 14, a long hole 32 for height regulation
Elongated holes 36, 38 for defining the width are punched out on both sides of the hole 36, and elongated holes 40, 42 for defining the width are similarly punched on both sides of the six windows 14 and the elongated hole 34 for determining the height. Width dimension regulation long holes 36.38 and 40. , 42, width dimension defining windows 44 are punched out respectively. The part surrounded by the long holes 32 and 34 for end wall height regulation, the peripheral length for width dimension regulation: holes 36 and 38, and the window 44 for width dimension regulation becomes the support body 2, and among these parts, the end wall height regulation The part between the elongated hole 32 and the elongated bending hole 10 becomes the end wall 6, and the part between the elongated bending hole 30 and 12 becomes the bottom wall 4, and the height of the elongated bending hole 12 and the end wall. The portion between the regulation long hole 34 and the end wall 8 becomes the end wall 8.

As shown in FIG. 3, a copper foil 46 having a thickness of approximately 25 to 50 μm is pasted over the entire back surface of the strip-shaped insulator 30 thus punched out. Then, as shown in FIG. 4, this copper foil 46 is etched and punched to produce an external electrode +8.20. In addition, FIG. 4 shows the band-shaped insulator 3.
0 is shown.

Then, on the surface side of the strip-shaped insulator 300, solder 2'7 is placed above each window, and solder 28 is placed above each window 20''.

After that, the capacitor element 22 is arranged so that the cathode layer 24 is located on the window 16 and the anode member 26 is located on the window 14, and the solder 2'7.2B is melted through a heating furnace, for example, and the fifth
As shown in the figure, the external electrode 18 and the anode member 26 are soldered, and the external electrode 20 and the cathode layer 24 are soldered.

Thereafter, as shown in FIG. 6, the band-shaped insulator 30 is bent to form a trough-like body at the position of the bending slot 10° 12 so that the external electrodes 18, 20 are located on the outside. Then, an insulating synthetic resin is injected into this trough-like body so that the capacitor element 22 is buried therein. After this synthetic resin has hardened, the gutter-like body is cut along the cutting line shown by the dashed line in the figure, and also cut so as to connect the long holes 32 and 34 for adjusting the height of the end walls.

This completes the manufacturing. In addition, when attaching a heat-resistant plate, the belt-shaped heat-resistant plate may be placed after resin injection.

In the above embodiment, a capacitor element is used, but various electronic components can be used as long as they have two electrodes. Although copper foil was used, other metal foils may also be used. Furthermore, although a long hole for defining the width dimension and a long hole for defining the window and end wall height were punched out, these may be unnecessary in some cases.

[Brief explanation of drawings]

FIG. 1 is a longitudinal sectional view of a chip type capacitor manufactured by the manufacturing method according to the invention, and FIGS. 2 to 6 are process diagrams of one embodiment of the invention. IQ, 12... Long hole for bending, +4.16... Window for electrode connection, 22... Capacitor element (electronic component element), 27.28... Solder, 3o... Band-shaped insulation body. Patent applicant Matsuo Electric Co., Ltd.

Claims (1)

[Claims] (1) Long holes for bending are bored at predetermined intervals along both longitudinal edges of the strip-shaped insulator at predetermined intervals, and the long holes for bending are also located on the inside. a process of drilling a window for electrode connection in each of the above, a process of pasting metal foil on one side of the strip-shaped insulator, and a process of removing the metal foil located between the windows on both sides. , placing solder in each window on the surface opposite to the surface to which the metal foil is attached, and placing a plurality of electronic component elements on the surface of the strip-shaped insulator opposite to the surface to which the metal foil is attached. A process of arranging the electrodes at predetermined intervals so that they are in contact with the solder in the window, a process of heating the solder all at once and soldering each of the electrodes to each of the metal foils, and a process of soldering the electrodes to each of the metal foils. A process of bending the metal foil along each of the long holes for bending to form a gutter-like body in which the metal foil is located on the outside, a process of filling the gutter-like body with resin, and a process of forming the gutter-like body into each of the above-mentioned grooves. A method of manufacturing an electronic component, which comprises the step of cutting in the width direction at positions between electronic component elements.