JPS6052724U - Sealing structure of electronic components - Google Patents
Sealing structure of electronic componentsInfo
- Publication number
- JPS6052724U JPS6052724U JP14386283U JP14386283U JPS6052724U JP S6052724 U JPS6052724 U JP S6052724U JP 14386283 U JP14386283 U JP 14386283U JP 14386283 U JP14386283 U JP 14386283U JP S6052724 U JPS6052724 U JP S6052724U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- sealed
- sealing structure
- exterior case
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図AおよびBは従来の電子部品の封止構造を示す斜
視図、第2図AおよびBはこの考案の電子部品の封止構
造の一実施例を示す斜視図である。
1・・・・・・電子部品本体、2,3・・・・・・リー
ド端子、4・・・・・・外装ケース、6・・・・・・弾
性シール液流入防止板。FIGS. 1A and 1B are perspective views showing a conventional electronic component sealing structure, and FIGS. 2A and 2B are perspective views showing an embodiment of the electronic component sealing structure of this invention. 1...Electronic component body, 2, 3...Lead terminal, 4...Exterior case, 6...Elastic seal liquid inflow prevention plate.
Claims (1)
開口状の外装ケースに収容し、上記外装ケースの開口部
を樹脂でシールしてなる電子部品の封止構造であって、
上記外装ケースの開口部を、リード端子を挿通させるた
めの切除部を備えた弾性絶縁体からなるシール液流入防
止板で封止した後、樹脂でシールしたことを特徴とする
電子部品の封止構造。A sealing structure for an electronic component, in which an electronic component main body is housed in an exterior case having an open end at one end with lead terminals led out to the outside, and the opening of the exterior case is sealed with a resin,
Sealing of an electronic component characterized in that the opening of the exterior case is sealed with a sealing liquid inflow prevention plate made of an elastic insulator and having a cutout for inserting a lead terminal, and then sealed with a resin. structure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14386283U JPS6052724U (en) | 1983-09-16 | 1983-09-16 | Sealing structure of electronic components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14386283U JPS6052724U (en) | 1983-09-16 | 1983-09-16 | Sealing structure of electronic components |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6052724U true JPS6052724U (en) | 1985-04-13 |
Family
ID=30320990
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14386283U Pending JPS6052724U (en) | 1983-09-16 | 1983-09-16 | Sealing structure of electronic components |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6052724U (en) |
-
1983
- 1983-09-16 JP JP14386283U patent/JPS6052724U/en active Pending
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