JPS60500110A - microwave package - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] microwave package The present invention relates to microwave packaging, and more particularly to hermetically sealed pancages. It depends.

The known microwave package has a micro screwed in place into it. Including lid. These packages have a number of drawbacks. In particular, they , currently not suitable for the wide frequency range operation possible with gallium arsenide integrated circuits. stomach.

The invention can operate in good microwave circuits over a wide frequency range. It also has good thermal characteristics that allow it to operate at higher output rates than previously available. It is intended to provide a chronograph package.

According to the present invention, in a microwave package, the bonded active material to the substrate and is in good thermal contact with the base plate. base to form a hermetically sealed pancage with the microwave device a wall member and a lid member for the package welded to the plate; The substrate and base plate have similar coefficients of expansion, and the active microwave device 2. Contact is made through a glass-to-metal seal in the wall member. Special notice GO-500110 (2) A microwave panpackage is provided which is characterized by:

Preferably said substrate has electrically conductive tracks printed thereon. A microwave device is coupled at one end and a gas is connected at the other end. A coupling band is provided to connect the conductor passing through the lath-metal seal. The complete package is such that the height of the conductor on the base member is equal to the height of the bond pad on the base member. height, so that the conductor and the coupling member have almost 1 inch between them. It is constructed in such a way that it can be combined without leaving any distance.

The important point of this feature mentioned above is that if the distance between the two is long, the bonding wire or A very large drop of solder is required, which creates a microphone effect into the circuit. The point is that it may induce

According to the invention, the base plate made of tungsten steel and the base plate made of nickel iron or has a wall member made of copal and a lid member made of nickel iron or copal. A microwave package is provided consisting of a microwave circuit, the microwave circuit being mounted on a base. Mounted on a beryllium oxide substrate that is well-positioned and in good thermal contact with the base plate. The wires to the microwave device are connected through a glass-to-metal seal. It penetrates the wall of the cage, and the lid member, wall member, and base member are connected together in the field. to form a hermetically sealed package.

Using tungsten steel as a base, the substrate is preferably extremely good thermal conductivity from the microwaves mounted on the substrate is obtained. The device(s) can operate at higher power levels than previously possible. Wear.

Using tungsten steel as the base also makes the package Therefore, the temperature increase inside the package is only 1 It is limited to 20 degrees Celsius and will not damage microwave equipment.

Furthermore, by welding the wall component to the base and the lid to the wall component, the glass-metal The seal provides an extremely well-tight seal that can operate over a wide frequency range. A sealed microwave package is provided.

Embodiments of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 is a cross-sectional view of a microwave package according to the present invention, and FIG. 2 is a cross-sectional view of a microwave package according to the present invention. shows a portion of the board in more detail, showing the glass-to-metal seal and connections between the board and the input leads. It shows that

Referring to FIG. 1, a microwave pancage is shown and preferably includes 2. PeIJIJium oxide has a relatively high thermal conductivity of 5 W/cm'. The resulting substrate 12 includes an active microwave device 10 mounted on it. Before Contact with the device 10 is made through the glass-to-metal seal 16 in the wall member 18. This is done through a conductor 14 that is Substrate 12 is preferably an intermediate layer made of gold. It is fixed to the base plate 20 via the conductive layer 22. The wall portion 18 is loosely attached to the base plate 20. Using a radar that fits into the recess 24 and forms the weld 26, the base part The entire circumference of the material 24 is welded.

A lid 28 is disposed on the top of the wall 18 and includes a lid 28 as shown at 30. - is welded over the entire circumference of the wall portion 18. Said base member, wall part The material and lid are preferably rectangular.

Referring to FIG. 2, contact from feedthrough conductor 14 to device 10 is further illustrated. Shown in detail. The conductor 14 is connected to the glass sheet at a higher position than the base member. 16 and is only slightly higher than the conductive trunk 32 on the board. , and as shown at 34, directly to the track 32. It can be soldered. The substrate is provided with a gold lining 22, The base plate 20 may include an internal pancage surface over its entirety or as shown. On the surface 36, nickel and gold are lined.

The base member of the microwave package is made of tungsten steel, which has a Similar to the thermal expansion coefficient of 1.1 ppm K-1 (approximately 6 ppm K”-1) . The thermal conductivity of tungsten steel is -1 at 24 D'Wm-1, and this value is It compares well with 400 and is much better than Copal 17.

Gold backing for high thermal conductivity substrate and nickel for paste material The fact that the gold plate 36 is stretched provides a good heat sink for this microwave device 10. Microwave package This means that it can be used at higher outputs.

During assembly, the microwave device 10 is attached to the substrate 1 by, for example, soldering. 2 and then a gold-lined alumina substrate 12 (entectic) is soldered to the base member 20. Ko A glass-to-metal seal is attached to the wall member 18 made of pearl or nickel iron. Although it is possible.

Alternatively, suitable holes may be provided for seals that may be added later. If you wish Full gluing and testing of the Raba microwave device may be done prior to wall installation. .

The wall has the same thickness as the glass seal (approximately 1.15 m), and the thickness of the package Like the lid 28, it is welded to the base using a lathe.

In practical embodiments, it is used to weld both the base and the lid. The radar is a pulse type solid with high average output using computer control. <f-tNd/YAG race. computer program is All four sides are circumferentially welded in an argon atmosphere, and the laser The beam is focused onto a metal joint.

Another implementation using an alumina ceramic substrate (thermal expansion coefficient approximately 8 ppm K-”) In the example, the ceramic substrate is perforated and requires large amounts of heat. Houses a microwave device soldered directly onto the base to provide conductivity It is supposed to be done. This means that the alumina ceramic substrate can heat up to a sufficiently high temperature. It has no conductivity and the microwave device is located on top of the alumina ceramic substrate. is not necessary, as it is impossible to use it at large output levels if That's true.

In the actual case, the alumina substrate supporting the microwave strip transmission line preferably has a reed-raised hole. This board is the base The device is soldered to the base in a hole drilled in the board. has been done.

The main feature of the invention is to provide a good heat sink for microwave equipment The point is that a tungsten copper base is used for this purpose. Wall using laser technology According to the welding operation to the base of the part, the temperature did not increase above 120 degrees C and therefore the structure No damage to components. Radey welding the base to the wall The advantage of this is that chip or strip transmission lines can be assembled and connected before the wall is in place. This is something that can be done and tested. Normally, soldering to the wall of the base is All processes described above must be carried out within the confines of the wall.

The package's good thermal properties allow it to operate over a wide frequency range. Microwave equipment can be used.

Packages that use a monolithic 50 ohm glass-to-metal seal shall have at least also has good mi- ter coverage up to i[I GHz and in some cases up to 18 GHz. It has chroma wave characteristics. This characteristic is also broadband, i.e. D Continuously operates upward from state C. Many ceramics with the same physical dimensions as the present invention Micbase pan cages have metal or metallic lids and package walls. It suffers from narrowband characteristics due to resonance between the connecting lines that it passes through. All money Metallic packages also have excellent properties below the waveguide cutoff frequency. , thereby reducing the transmission of unwanted signals by keeping the pancage width at its maximum dimension. It can be suppressed by This is especially important, as the The gallium arsenide integrated circuits housed in the Hz or higher). The metal base has sufficient R against the IC chip. Provide F ground. The reproducibility of RF characteristics is determined by the microwave transmission line on lumped elements. Depending on the application, to create reproducible characteristics or parasitic elements. , the chip can be soldered or epoxied to a ground plane. Each is used.

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Claims (1)

[Claims] 1. In a microwave package, it is located on the base plate of the package. , the bonded active micro to the substrate in good thermal contact with the base plate. wave device and welded to the base plate to form a hermetically sealed package a wall member and a lid member for the package, which are connected to the substrate and the base member. The base plate has a similar coefficient of expansion and has a similar coefficient of expansion to the active microwave device. characterized in that the contact is made via a glass-metal seal in the wall member. microwave package. 2. In the microwave pancage according to claim 1, the substrate includes a An electrically conductive track is printed on top, with a micrometer at one end. A chroma wave device is coupled and at the other end there is a A complete package is - Make sure that the height of the conductor on the lining member is approximately the same as the height of the bonding pad on the pacing member. so that the conductor and the coupling member can be coupled with little distance between them. A microwave package configured in such a way that In the microwave package according to claim 1 or 2, The base plate is made of tungsten copper, and the wall members are made of nickel iron or copper. The microwave circuit is located on the pace and is made of Kovar. The microphone is mounted on a beryllium oxide substrate that is in good thermal contact with the base plate. Kuro wave package. 4. In the microwave package according to claim 1 or 2, The base plate is made of tungsten copper, and the wall members are made of nickel iron or copper. The microwave circuit is connected through a hole formed in the alumina substrate. Microwave package installed directly on the pace. 5. The microwave package according to any one of claims 1 to 6. A recess is formed on the outer periphery of the base plate, and a wall is inserted into the recess. Microwave package where parts are placed before welding. 1