JPS6049625U - infrared heating device - Google Patents
infrared heating deviceInfo
- Publication number
- JPS6049625U JPS6049625U JP14302283U JP14302283U JPS6049625U JP S6049625 U JPS6049625 U JP S6049625U JP 14302283 U JP14302283 U JP 14302283U JP 14302283 U JP14302283 U JP 14302283U JP S6049625 U JPS6049625 U JP S6049625U
- Authority
- JP
- Japan
- Prior art keywords
- heating device
- heated surface
- infrared heating
- infrared
- filament
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案の前提となる赤外線加熱装置の概略断面
図、第2図は第1図のTl−Tl線に断面図、第3図は
第2図のT2−T2線から寛た概略平面図、第4図は第
3図における被加熱面の部分平面図とその放熱分布特性
曲線図及び熱分布特性曲線図、第5図及び第6図は本考
案の他の実施例を示す赤外線ランプの概略平面図である
。
m・・・被加熱面、ml・・・中央部、m2・・・周辺
部、7・・・赤外線ランプ、8・・・フィラメント。Figure 1 is a schematic sectional view of the infrared heating device that is the premise of the present invention, Figure 2 is a sectional view taken along the Tl-Tl line in Figure 1, and Figure 3 is a schematic view taken from the T2-T2 line in Figure 2. 4 is a partial plan view of the heated surface in FIG. 3, its heat radiation distribution characteristic curve diagram, and heat distribution characteristic curve diagram; FIGS. 5 and 6 are infrared rays showing other embodiments of the present invention. FIG. 3 is a schematic plan view of the lamp. m... surface to be heated, ml... central portion, m2... peripheral portion, 7... infrared lamp, 8... filament.
Claims (1)
数灯並列に配置して平坦な被加熱面に対向させ該被加熱
面を同時加熱する加熱装置において、各赤外線ランプの
各フィラメントの被加熱面の中央部と対向する部分を粗
に、被加熱面の周面部と対向する部分を密に形成したこ
とを特徴とする赤外線加熱装置。In a heating device in which a plurality of long linear infrared lamps each having a filament are arranged in parallel to face a flat heated surface and simultaneously heat the heated surface, the heated surface of each filament of each infrared lamp is An infrared heating device characterized in that a portion facing the central portion of the heated surface is formed roughly, and a portion facing the peripheral surface of the heated surface is formed densely.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14302283U JPS6049625U (en) | 1983-09-13 | 1983-09-13 | infrared heating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14302283U JPS6049625U (en) | 1983-09-13 | 1983-09-13 | infrared heating device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6049625U true JPS6049625U (en) | 1985-04-08 |
Family
ID=30319377
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14302283U Pending JPS6049625U (en) | 1983-09-13 | 1983-09-13 | infrared heating device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6049625U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030025146A (en) * | 2001-09-19 | 2003-03-28 | 권영해 | Heating apparatus of rapid thermal annealer and rapid thermal chemical vapor deposition for semiconductor device manufacturing |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5764937A (en) * | 1980-10-09 | 1982-04-20 | Ushio Inc | Annealing device |
-
1983
- 1983-09-13 JP JP14302283U patent/JPS6049625U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5764937A (en) * | 1980-10-09 | 1982-04-20 | Ushio Inc | Annealing device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030025146A (en) * | 2001-09-19 | 2003-03-28 | 권영해 | Heating apparatus of rapid thermal annealer and rapid thermal chemical vapor deposition for semiconductor device manufacturing |
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