JPS6046045A - ペレツトチヤツク - Google Patents

ペレツトチヤツク

Info

Publication number
JPS6046045A
JPS6046045A JP15280384A JP15280384A JPS6046045A JP S6046045 A JPS6046045 A JP S6046045A JP 15280384 A JP15280384 A JP 15280384A JP 15280384 A JP15280384 A JP 15280384A JP S6046045 A JPS6046045 A JP S6046045A
Authority
JP
Japan
Prior art keywords
pellet
chuck
package
directly
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15280384A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0377664B2 (enrdf_load_stackoverflow
Inventor
Shuichi Ito
伊藤 秋一
Tsutomu Hanno
勉 半野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15280384A priority Critical patent/JPS6046045A/ja
Publication of JPS6046045A publication Critical patent/JPS6046045A/ja
Publication of JPH0377664B2 publication Critical patent/JPH0377664B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
JP15280384A 1984-07-25 1984-07-25 ペレツトチヤツク Granted JPS6046045A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15280384A JPS6046045A (ja) 1984-07-25 1984-07-25 ペレツトチヤツク

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15280384A JPS6046045A (ja) 1984-07-25 1984-07-25 ペレツトチヤツク

Publications (2)

Publication Number Publication Date
JPS6046045A true JPS6046045A (ja) 1985-03-12
JPH0377664B2 JPH0377664B2 (enrdf_load_stackoverflow) 1991-12-11

Family

ID=15548494

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15280384A Granted JPS6046045A (ja) 1984-07-25 1984-07-25 ペレツトチヤツク

Country Status (1)

Country Link
JP (1) JPS6046045A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0377664B2 (enrdf_load_stackoverflow) 1991-12-11

Similar Documents

Publication Publication Date Title
US4980971A (en) Method and apparatus for chip placement
US3903363A (en) Automatic positioning system and method
US5249349A (en) Parts mounting device
KR102132094B1 (ko) 전자 부품 실장 장치 및 전자 부품 실장 방법
JPS6046045A (ja) ペレツトチヤツク
DE4105874C1 (enrdf_load_stackoverflow)
EP1802192A1 (de) Verfahren für die Montage eines Flipchips auf einem Substrat
DE102018129805B3 (de) Aufnahme eines zu bestückenden Trägers mit Träger-Aufnahmevorrichtung aufweisend einen Grundkörper und ein Adapterelement sowie System und Bestückmaschine diese aufweisend und Verfahren zum Bestücken eines Trägers
EP0307574B1 (de) Lötkopf zum Ein- und Auslöten von Bauelementen
JP2844409B2 (ja) 半導体位置決め方法
JP2596913B2 (ja) 半導体ペレットの位置決め装置
JPH02250343A (ja) テープボンディングの位置決め方法
EP0305695B1 (de) Lötkopf zum Aufnehmen und Ausrichten von Bauelementen während des Ein- oder Auslötens, insbesondere für oberflächenmontierbare Bauelemente (SMD)
Field et al. SMD placement using machine vision
GB1592368A (en) Automated manipulative operation system
JPS59152698A (ja) 自動チツプマウント装置の治具盤と吸着口におけるチツプ吸着位置修正方法
JPS6148930A (ja) 半導体基板載置台
CN117283495A (zh) 螺纹件装配方法
JPH03159265A (ja) リードピンろう付け方法及びリードピンろう付け用治具
EP0305697A2 (de) Verfahren zum Einlöten von SMD-Bauteilen, die zeitweise an einem mittels Vakuumleitung evakuierbaren Lötkopf gehalten werden
JPS6076934A (ja) 嵌合部品の自動挿入方法
JPH01149429A (ja) 半導体ペレットのマウント方法
JP2004259876A (ja) パッケージの位置決め方法及びその装置
JPH0513507A (ja) キヤリヤテープ規正装置
JPH04186644A (ja) 半導体装置の組立装置