JPS6045522U - Sealed structure of electronic components - Google Patents
Sealed structure of electronic componentsInfo
- Publication number
- JPS6045522U JPS6045522U JP13706583U JP13706583U JPS6045522U JP S6045522 U JPS6045522 U JP S6045522U JP 13706583 U JP13706583 U JP 13706583U JP 13706583 U JP13706583 U JP 13706583U JP S6045522 U JPS6045522 U JP S6045522U
- Authority
- JP
- Japan
- Prior art keywords
- opening
- electronic components
- sealed structure
- electronic component
- partition plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来例の一部破断斜視図、第２図は第１図のＡ
−Ａ線に沿う部分の拡大断面図、第３図〜第７図は本考
案の実施例に係り、第３図は全体の一部破断斜視図、第
４図は仕切部材の斜視図、第５図は第３図のＢ−Ｂ線に
沿う部分の拡大断面図、第６図および第７図はそれぞれ
仕切板の他の変形例を示す斜視図である。
１１・・・ケース、１２・・・開口部、１３・・・ベー
ス板、１４・・・密封用樹脂、１６．２１・・・仕切板
。Figure 1 is a partially cutaway perspective view of the conventional example, and Figure 2 is A of Figure 1.
- An enlarged sectional view of a portion along line A, FIGS. 3 to 7 are related to an embodiment of the present invention, FIG. 3 is a partially cutaway perspective view of the whole, and FIG. 4 is a perspective view of a partition member, FIG. 5 is an enlarged sectional view of a portion taken along the line B--B in FIG. 3, and FIGS. 6 and 7 are perspective views showing other modifications of the partition plate, respectively. DESCRIPTION OF SYMBOLS 11... Case, 12... Opening, 13... Base plate, 14... Sealing resin, 16.21... Partition plate.
Claims (1)
口部を密封用樹脂で閉塞してなる電子部品の密封構造に
おいて、前記開口部を間仕切りする仕切板を備え、この
仕切板をケースの開口部寄りの内面に装着することによ
り該開口部を複数の単位開口部に間仕切りした状態で密
封用樹脂で各単位開口部を閉塞してなる電子部品の密封
構造。In a sealed structure for electronic components in which an electronic component is stored through an opening of a case and the opening is closed with a sealing resin, a partition plate is provided to partition the opening, and the partition plate is connected to the opening of the case. A sealing structure for an electronic component, in which the opening is partitioned into a plurality of unit openings by being attached to the inner surface of the electronic component, and each unit opening is closed with a sealing resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13706583U JPS6045522U (en) | 1983-09-02 | 1983-09-02 | Sealed structure of electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13706583U JPS6045522U (en) | 1983-09-02 | 1983-09-02 | Sealed structure of electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6045522U true JPS6045522U (en) | 1985-03-30 |
Family
ID=30307982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13706583U Pending JPS6045522U (en) | 1983-09-02 | 1983-09-02 | Sealed structure of electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6045522U (en) |
-
1983
- 1983-09-02 JP JP13706583U patent/JPS6045522U/en active Pending
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