JPS6042598U - Clamp mechanism in board splitting equipment - Google Patents
Clamp mechanism in board splitting equipmentInfo
- Publication number
- JPS6042598U JPS6042598U JP13437483U JP13437483U JPS6042598U JP S6042598 U JPS6042598 U JP S6042598U JP 13437483 U JP13437483 U JP 13437483U JP 13437483 U JP13437483 U JP 13437483U JP S6042598 U JPS6042598 U JP S6042598U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- board
- clamp mechanism
- slider
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図a、 bは従来のプレス式の基板切断装置の理水
側面図、第2図a ”−cは従来の折曲式の基板割り装
置の理水側面図、第3図〜第5図は本考案の一実施例で
、第3図a、 bは側面図、第4図はロータ駆動機構の
正面図、第5図はスライダ駆動機構の正面図、第6図は
集合基板を割る実施例の平面図、第7図はその要部の理
水図、第8図は集合基板を示し、各図に於けるa、bt
C,d。
e、fは工程順を示す。
10・・・・・・ロータ、13・・・・・・スライダ、
14・・・・・・クランパ、15−−−−−一基板、1
6−−−−−−ミシン目、21・・・・・・シリンダ、
22・・・・・・上スライダ、23・・・・・・下スラ
イダ、2−6・・・・・・爪。
第3図
第4図Figures 1a and b are side views of a conventional press-type substrate cutting device; Figures 2a-c are side views of a conventional folding-type substrate cutting device; and Figures 3 to 5. The figures show one embodiment of the present invention, in which Figures 3a and 3b are side views, Figure 4 is a front view of the rotor drive mechanism, Figure 5 is a front view of the slider drive mechanism, and Figure 6 is a diagram showing how the collective board is divided. A plan view of the embodiment, FIG. 7 is a hydraulic diagram of the main part, and FIG. 8 is a collective board.
C, d. e and f indicate the order of steps. 10...Rotor, 13...Slider,
14... Clamper, 15-----One board, 1
6------Perforation, 21...Cylinder,
22...Upper slider, 23...Lower slider, 2-6...Claw. Figure 3 Figure 4
Claims (1)
ント基板の該分離線の両側を挟持するクランプの少くと
もその一方を前記分離線を中心として回動させてプリン
ト基板を割るクランプを上スライダと下スライダで構成
し、この上スライダと下スライダ間に基板を導入すると
共に、これ等のスライダに設けたストッパが前記導入に
よってプリント基板に当ってその導入が完了した際に、
プリント基板を挟着する挟着用の爪を設けたことを特徴
とする基板割り装置におけるクランプ機構。At least one of the clamps that clamps both sides of the separation line of a printed circuit board with a separation line such as a perforation or a V-cut groove is rotated about the separation line, and the clamp for splitting the printed circuit board is raised. Consisting of a slider and a lower slider, a board is introduced between the upper slider and the lower slider, and when the stoppers provided on these sliders hit the printed circuit board due to the introduction and the introduction is completed,
A clamping mechanism for a board splitting device, characterized in that a clamping claw is provided for clamping a printed circuit board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13437483U JPS6042598U (en) | 1983-09-01 | 1983-09-01 | Clamp mechanism in board splitting equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13437483U JPS6042598U (en) | 1983-09-01 | 1983-09-01 | Clamp mechanism in board splitting equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6042598U true JPS6042598U (en) | 1985-03-26 |
Family
ID=30302801
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13437483U Pending JPS6042598U (en) | 1983-09-01 | 1983-09-01 | Clamp mechanism in board splitting equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6042598U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012027993A (en) * | 2010-07-27 | 2012-02-09 | Nhk Spring Co Ltd | Method for tearing off plate, plate and device |
-
1983
- 1983-09-01 JP JP13437483U patent/JPS6042598U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012027993A (en) * | 2010-07-27 | 2012-02-09 | Nhk Spring Co Ltd | Method for tearing off plate, plate and device |
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